Growth Kinetics of Ni3Sn4 in the Solid–Liquid Interfacial Reaction

2019 ◽  
Vol 50 (7) ◽  
pp. 3038-3043 ◽  
Author(s):  
Yue Wang ◽  
Jihua Huang ◽  
Zheng Ye ◽  
Xianwen Peng ◽  
Jian Yang ◽  
...  
1991 ◽  
Vol 22 (6) ◽  
pp. 1259-1270 ◽  
Author(s):  
S. D. Peteves ◽  
R. Abbaschian

1991 ◽  
Vol 22 (6) ◽  
pp. 1271-1286 ◽  
Author(s):  
S. D. Peteves ◽  
Reza Abbaschian

2021 ◽  
Author(s):  
Siyu Wu ◽  
Qinwei An ◽  
Yugang Sun

The involvement of heterogeneous solid/liquid reaction in growing colloidal nanoparticles makes it challenging to quantitatively understand the fundamental steps that determine nanoparticles' growth kinetics. A global optimization protocol relying on...


2007 ◽  
Vol 546-549 ◽  
pp. 1627-1632 ◽  
Author(s):  
Yan Qing Yang ◽  
X.H. Lu ◽  
X. Luo ◽  
Z.J. Ma ◽  
J.K. Li ◽  
...  

The Ti6Al4V composites reinforced with Chinese SiC fiber was manufactured and then thermally exposed at 800°C, 900°C and 1000°C, respectively, for up to 500h. The interfacial reaction products were identified as TiC between Ti6Al4V and the C-coating of the SiC fiber. However, if the SiC fiber has no C-coating, the interfacial reaction forms TiC, Ti3SiC2, Ti5Si3(Cx) and Ti3Si(Cx). The thickness of the interfacial reaction zone was measured and it is found that the thickening rate is slower in the samples in which the SiC fiber has the C-coating. The growth of the interfacial reaction products is diffusion-controlled and the parameters of the growth kinetics, k0 and Q, were determined, respectively. The profile of the element distribution was calculated according to the diffusion theory and is well consistent with the expeimental data.


2005 ◽  
Vol 475-479 ◽  
pp. 2627-2630
Author(s):  
Soon Tae Kim ◽  
Joo Youl Huh

The effect of adding Bi to a eutectic Sn-3.5Ag solder alloy on the growth kinetics of the intermetallic compounds (IMCs) in solder/Cu joints was examined at the aging temperatures of 130°C, 150°C and 180°C. At 150°C and 180°C, the growth rate of the Cu6Sn5 layer was significantly enhanced, but that of the Cu3Sn layer was rather reduced with increasing Bi content up to 12 wt.%. At 130°C, however, both the η and ε layers appeared to grow faster as the Bi content in the solder was increased to 12 wt.%. These results suggest that the accumulation of Bi ahead of the Cu6Sn5 layers can affect not only the interfacial reaction barrier but also the local thermodynamics at the interface between the Cu6Sn5 layer and the solder.


2010 ◽  
Vol 46 (4) ◽  
pp. 390-395 ◽  
Author(s):  
Zhiyuan LIU ◽  
Zhigang YANG ◽  
Zhaodong LI ◽  
Zhenqing LIU ◽  
Chi ZHANG

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