Morphology and growth kinetics of intermetallic compounds in solid-state interfacial reaction of electroless Ni-P with Sn-based lead-free solders

2006 ◽  
Vol 35 (1) ◽  
pp. 181-188 ◽  
Author(s):  
M. L. Huang ◽  
T. Loeher ◽  
D. Manessis ◽  
L. Boettcher ◽  
A. Ostmann ◽  
...  
Keyword(s):  
Solid State ◽  
Intermetallic Compounds ◽  
Interfacial Reaction ◽  
Growth Kinetics ◽  
Lead Free ◽  
Lead Free Solders ◽  
Electroless Ni ◽  
Kinetics Of

Growth Kinetics of IMC Formed between Sn-3.5Ag-0.75Cu BGA Solder and Electroless Ni-P/Cu Substrate by Solid-State Isothermal Aging

2004 ◽  
Vol 449-452 ◽  
pp. 893-896 ◽  
Author(s):  
Jeong Won Yoon ◽  
Chang Bae Lee ◽  
Seung Boo Jung
Keyword(s):  
Solid State ◽  
Growth Kinetics ◽  
Isothermal Aging ◽  
Ball Grid Array ◽  
Cu Substrate ◽  
Diffusion Controlled ◽  
Increasing Temperature ◽  
Electroless Ni ◽  
Kinetics Of ◽  
Deposit Layer

The growth kinetics of intermetallic compound (IMC) layers formed between Sn-3.5Ag-0.75Cu BGA (ball grid array) solder and electroless Ni-P/Cu substrate by solid state isothermal aging were examined at temperatures between 70 and 170°C for 0 to 100 days. In the solder joints between the solder ball and electroless Ni-P/Cu pads, the IMC layer was (Cu,Ni)6Sn5. Also, a P-rich Ni layer formed at the interface between (Cu,Ni)6Sn5 and original Ni-P deposit layer because of the phosphorous accumulation. These IMC layer thicknesses increased linearly with the square root of aging time and the growth was faster for higher aging temperatures. On the contrary, the shear strength decreased with the increasing temperature and time. The growth of IMC layer was mainly controlled by diffusion-controlled mechanism over the temperature range studied. The apparent activation energy calculated for the growth of the (Cu,Ni)6Sn5 IMC was 69.75 kJ/mol.

Morphology of interfacial reaction between lead-free solders and electroless Ni–P under bump metallization

2000 ◽  
Vol 88 (11) ◽  
pp. 6359-6363 ◽  
Author(s):  
J. W. Jang ◽  
D. R. Frear ◽  
T. Y. Lee ◽  
K. N. Tu
Keyword(s):  
Interfacial Reaction ◽  
Lead Free ◽  
Under Bump Metallization ◽  
Lead Free Solders ◽  
Electroless Ni

Enhanced Growth Kinetics of Intermetallic Compounds between Bi-Containing Sn-3.5Ag Solders and Cu Substrate during Aging

2005 ◽  
Vol 475-479 ◽  
pp. 2627-2630
Author(s):  
Soon Tae Kim ◽  
Joo Youl Huh
Keyword(s):  
Growth Rate ◽  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Interfacial Reaction ◽  
Growth Kinetics ◽  
Cu Substrate ◽  
Reaction Barrier ◽  
Cu3sn Layer ◽  
Cu6sn5 Layer ◽  
Kinetics Of

The effect of adding Bi to a eutectic Sn-3.5Ag solder alloy on the growth kinetics of the intermetallic compounds (IMCs) in solder/Cu joints was examined at the aging temperatures of 130°C, 150°C and 180°C. At 150°C and 180°C, the growth rate of the Cu6Sn5 layer was significantly enhanced, but that of the Cu3Sn layer was rather reduced with increasing Bi content up to 12 wt.%. At 130°C, however, both the η and ε layers appeared to grow faster as the Bi content in the solder was increased to 12 wt.%. These results suggest that the accumulation of Bi ahead of the Cu6Sn5 layers can affect not only the interfacial reaction barrier but also the local thermodynamics at the interface between the Cu6Sn5 layer and the solder.

Kinetics-Based Modeling of Bond-Metal Dissolution and IMC During Soldering

2006 ◽  
Author(s):  
Mohammad Faizan ◽  
Guo-X. Wang
Keyword(s):  
Intermetallic Phase ◽  
Molten Solder ◽  
Lead Free ◽  
Joint Interface ◽  
Environment Friendly ◽  
Soldering Process ◽  
Substrate Dissolution ◽  
Soldering Reaction ◽  
Lead Free Solders ◽  
Kinetics Of

Soldering has become an indispensable joining process in the electronic packaging industry. The industry is aiming for the use of environment friendly lead-free solders. All the lead-free solders are high tin-containing alloys. During the soldering process, an intense interaction of metallization on PCB and tin from the solder occurs at the metallization/solder interface. Intermetallic compound (IMC) is formed at the interface and subsequently PCB bond-metal (substrate) is dissolved into the molten solder. In the present study the terms bond-metal and substrate will be used interchangeably and the term 'substrate' refers to the top layer of the PCB which comes in contact with the molten solder during soldering reaction. Thickness of the intermetallic phase formed at the joint interface and amount of substrate lost is critical in achieving reliable solder joints. During the wet phase of soldering process, the IMC does not grow as layered structure; rather it takes the shape of scallops. The growth of scalloped IMC during the solder/substrate interaction entails complicated physics. Understanding of the actual kinetics involved in the formation of IMC phase is important in controlling the process to achieve desired results. This paper presents theoretical analysis of the kinetics involved in the formation of the scalloped intermetallic phase. The intermetallic phase growth is experimentally investigated to support the underlying kinetics of the process. Numerical model has been suggested to translate the physics of the process. The model is based on the basic mass diffusion equations and can predict the substrate dissolution and IMC thickness as a function of soldering time.

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