Enhanced Growth Kinetics of Intermetallic Compounds between Bi-Containing Sn-3.5Ag Solders and Cu Substrate during Aging

2005 ◽  
Vol 475-479 ◽  
pp. 2627-2630
Author(s):  
Soon Tae Kim ◽  
Joo Youl Huh
Keyword(s):  
Growth Rate ◽  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Interfacial Reaction ◽  
Growth Kinetics ◽  
Cu Substrate ◽  
Reaction Barrier ◽  
Cu3sn Layer ◽  
Cu6sn5 Layer ◽  
Kinetics Of

The effect of adding Bi to a eutectic Sn-3.5Ag solder alloy on the growth kinetics of the intermetallic compounds (IMCs) in solder/Cu joints was examined at the aging temperatures of 130°C, 150°C and 180°C. At 150°C and 180°C, the growth rate of the Cu6Sn5 layer was significantly enhanced, but that of the Cu3Sn layer was rather reduced with increasing Bi content up to 12 wt.%. At 130°C, however, both the η and ε layers appeared to grow faster as the Bi content in the solder was increased to 12 wt.%. These results suggest that the accumulation of Bi ahead of the Cu6Sn5 layers can affect not only the interfacial reaction barrier but also the local thermodynamics at the interface between the Cu6Sn5 layer and the solder.

Growth Kinetics of Intermetallic Compounds at the Interface of Liquid Sn-9Zn/Cu

2011 ◽  
Vol 233-235 ◽  
pp. 2323-2327
Author(s):  
Hui Zhen Huang ◽  
Xiu Qin Wei ◽  
Lang Zhou
Keyword(s):  
Activation Energy ◽  
Intermetallic Compound ◽  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Growth Kinetics ◽  
Layer Growth ◽  
Experimental Results ◽  
Cu Substrate ◽  
Diffusion Mechanisms ◽  
Kinetics Of

The morphology and growth of the intermetallic compound (IMC) formed between liquid Sn-9Zn eutectic solder alloy and Cu at 220-260°C was investigated. Experimental results showed that γ-Cu5Zn8 was present at the Sn-9Zn/Cu interface as the reaction product. The IMC layer growth follows the parabolic-growth law, which indicates that the growth of the IMC is controlled by the diffusion mechanisms. The activation energy of γ-Cu5Zn8 layer growth for liquid Sn-9Zn reacting with Cu substrate is determined as 50.5 KJ/mol.

Effect of Ni Addition on the Formation and Growth of Intermetallic Compound at Eutectic SnBi/Cu Interface

2010 ◽  
Vol 160-162 ◽  
pp. 709-714
Author(s):  
Tian You Kang ◽  
Yu Yan Xiu ◽  
Bo Xu ◽  
Chun Zhong Liu ◽  
Wei Ping Tong
Keyword(s):  
Growth Rate ◽  
Intermetallic Compound ◽  
Solder Alloy ◽  
Aging Process ◽  
Growth Behavior ◽  
Cu Substrate ◽  
Diffusion Controlled ◽  
Ni Addition ◽  
Cu3sn Layer

The reactions between Cu and the eutectic SnBi (Sn58wt.%Bi) solder alloy with and without 1wt.%Ni addition were investigated in this paper. After as-reflowed process, the IMCs formed in the Sn58wt.%Bi/Cu and Sn58wt.%Bi1wt.%Ni/Cu joints were Cu6Sn5 and (CuNi)6Sn5, respectively. During aging process, the thickness of the IMC layers formed at each solder/Cu joint increased, and a new layer Cu3Sn formed adjacent to the Cu substrate. It was found that 1wt.%Ni addition in Sn58wt.%Bi solder alloy could slightly enhance the growth rate of the total IMC layer, but effectively reduce the growth rate of Cu3Sn layer during aging process. The growth behavior of IMC layer for each joint followed the diffusion-controlled mechanism during aging.

Interfacial evolution between Cu and Pb–free Sn–Zn–Ag–Al solders upon aging at 150 °C

2003 ◽  
Vol 18 (8) ◽  
pp. 1795-1803 ◽  
Author(s):  
Shou Chang Cheng ◽  
Kwang Lung Lin
Keyword(s):  
Growth Rate ◽  
Intermetallic Compounds ◽  
Aging Time ◽  
Growth Kinetics ◽  
Solder Alloys ◽  
Rich Phase ◽  
Intermetallic Formation ◽  
Interfacial Evolution ◽  
Kinetics Of

The interfacial intermetallic formation at 150 °C between Cu and various solders, including Sn–9Zn, Sn–8.55Zn–1Ag, and Sn–8.55Zn–1Ag–XAl was investigated. The Al contents X of the quaternary solder alloys investigated were 0.01–0.45 wt.%. The compositions and the growth kinetics of intermetallic compounds (IMCs) were investigated. The IMC consisted of three layers for Sn–9Zn/Cu, Sn–Zn–Ag/Cu, and Sn–Zn–Ag–XAl/Cu specimens after aging for 100–600 h. These three layers included the Cu3(Zn, Sn) phase adjacent to the solder, the Cu6(Sn, Zn)5 phase in the middle, and the Cu–rich phase near to Cu. For long–term aging time over 1000 h, the Cu6(Sn, Zn)5 phase grew, while the Cu3(Zn, Sn) phase diminished. Al segregation formed in the IMC for all of the Sn–Zn–Ag–XAl/Cu specimens after aging.Cracks formed, when aged for 1000 h, at the solder/IMC interface or within the IMC layer for the following solders: Sn–9Zn, Sn–8.55Zn–1Ag, Sn–8.55Zn–1Ag–0.1Al, Sn–8.55Zn–1Ag–0.25Al, and Sn–8.55Zn–1Ag–0.45Al. The crack was not detected up to 3000 h for the Sn–8.55Zn–1Ag–0.01Al/Cu couple, of which the IMC growth rate was the slowest among all solders.

Sign in / Sign up

Export Citation Format

Share Document