Interfacial reaction and solder joint reliability of Pb-free solders in lead frame chip scale packages (LF-CSP)

2000 ◽  
Vol 29 (10) ◽  
pp. 1233-1240 ◽  
Author(s):  
Seung Wook Yoon ◽  
Chang Jun Park ◽  
Sung Hak Hong ◽  
Jong Tae Moon ◽  
Ik Seong Park ◽  
...  
Keyword(s):  
Solder Joint ◽  
Interfacial Reaction ◽  
Lead Frame ◽  
Solder Joint Reliability ◽  
Joint Reliability

Solder Joint Reliability of SnBi Finished TSOPs with Alloy 42 Lead-Frame under Temperature Cycling

2011 ◽  
pp. 74-74-15 ◽  
Author(s):  
Weiqiang Wang ◽  
Michael Osterman ◽  
Diganta Das ◽  
Michael Pecht
Keyword(s):  
Solder Joint ◽  
Temperature Cycling ◽  
Lead Frame ◽  
Solder Joint Reliability ◽  
Joint Reliability

Solder Joint Reliability of SnBi Finished TSOPs with Alloy 42 Lead-Frame under Temperature Cycling

2010 ◽  
Vol 7 (8) ◽  
pp. 102939
Author(s):  
Weiqiang Wang ◽  
Michael Osterman ◽  
Diganta Das ◽  
Michael Pecht ◽  
S. W. Dean
Keyword(s):  
Solder Joint ◽  
Temperature Cycling ◽  
Lead Frame ◽  
Solder Joint Reliability ◽  
Joint Reliability

Solder Joint Reliability Assessment and Pad Size Studies of FO-WLP With Glass Substrate

2021 ◽  
Vol 21 (1) ◽  
pp. 96-101 ◽  
Author(s):  
P. H. Wang ◽  
Y. C. Lee ◽  
C. K. Lee ◽  
H. H. Chang ◽  
K. N. Chiang
Keyword(s):  
Solder Joint ◽  
Glass Substrate ◽  
Reliability Assessment ◽  
Solder Joint Reliability ◽  
Joint Reliability

Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies

2014 ◽  
Vol 54 (5) ◽  
pp. 939-944 ◽  
Author(s):  
Ye Tian ◽  
Xi Liu ◽  
Justin Chow ◽  
Yi Ping Wu ◽  
Suresh K. Sitaraman
Keyword(s):  
Solder Joint ◽  
Experimental Evaluation ◽  
Flip Chip ◽  
Solder Joint Reliability ◽  
Snagcu Solder ◽  
Joint Reliability

Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages

2003 ◽  
Vol 43 (8) ◽  
pp. 1329-1338 ◽  
Author(s):  
Tong Yan Tee ◽  
Hun Shen Ng ◽  
Daniel Yap ◽  
Zhaowei Zhong
Keyword(s):  
Solder Joint ◽  
Solder Joint Reliability ◽  
Reliability Modeling ◽  
Joint Reliability ◽  
Board Level
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