Low Temperature Flip Chip Bonding Using Squeegee-Embedded Au Nanoporous Bump Activated by VUV/O3 Treatment

2018 ◽  
Vol 47 (10) ◽  
pp. 5952-5958 ◽  
Author(s):  
Weixin Fu ◽  
Tatsushi Kaneda ◽  
Akiko Okada ◽  
Kaori Matsunaga ◽  
Shuichi Shoji ◽  
...  
Keyword(s):  
Low Temperature ◽  
Flip Chip ◽  
Flip Chip Bonding

Low temperature Au-Au flip chip bonding with VUV/O3 treatment for 3D integration

2012 ◽  
Author(s):  
Akiko Okada ◽  
Masatsugu Nimura ◽  
Naoko Unami ◽  
Akitsu Shigetou ◽  
Hirokazu Noma ◽  
...  
Keyword(s):  
Low Temperature ◽  
Flip Chip ◽  
3D Integration ◽  
Flip Chip Bonding

Surface Activated Flip-Chip Bonding of Laser Chips

2005 ◽  
Author(s):  
Eiji Higurashi ◽  
Masao Nakagawa ◽  
Tadatomo Suga ◽  
Renshi Sawada
Keyword(s):  
Low Temperature ◽  
Flip Chip ◽  
Bonding Temperature ◽  
Ambient Air ◽  
Failure Criteria ◽  
Rf Plasma ◽  
Cavity Surface ◽  
Si Substrate ◽  
Plasma Irradiation ◽  
Flip Chip Bonding

This paper reports the results of low-temperature flip-chip bonding of a vertical cavity surface emitting laser (VCSEL) on a micromachined Si substrate. Low temperature bonding was achieved by introducing the surface activation by plasma irradiation into the flip-chip bonding process. After the surfaces of the Au electrodes of the VCSEL and Si substrate were cleaned using an Ar radio frequency (RF) plasma, Au-Au bonding was carried out only by contact in ambient air with applied static pressure. At a bonding temperature of 100°C, the die-shear strength exceeded the failure criteria of MIL-STD-883.

15-µm-pitch Cu/Au interconnections relied on self-aligned low-temperature thermosonic flip-chip bonding technique for advanced chip stacking applications

2014 ◽  
Vol 53 (4S) ◽  
pp. 04EB04 ◽  
Author(s):  
Bui Thanh Tung ◽  
Fumiki Kato ◽  
Naoya Watanabe ◽  
Shunsuke Nemoto ◽  
Katsuya Kikuchi ◽  
...  
Keyword(s):  
Low Temperature ◽  
Flip Chip ◽  
Flip Chip Bonding ◽  
Bonding Technique

scholarly journals Effects of Hardeners on the Low-Temperature Snap Cure Behaviors of Epoxy Adhesives for Flip Chip Bonding

2012 ◽  
Vol 22 (9) ◽  
pp. 454-458 ◽  
Author(s):  
Won-Jung Choi ◽  
Se-Hoon Yoo ◽  
Hyo-Soo Lee ◽  
Mok-Soon Kim ◽  
Jun-Ki Kim
Keyword(s):  
Low Temperature ◽  
Flip Chip ◽  
Epoxy Adhesives ◽  
Flip Chip Bonding

Improvement of Adhesion and Microwave Transmission Characteristics of Indium Bump by Silver Coating for Low Temperature Flip-Chip Applications

2004 ◽  
Vol 833 ◽  
Author(s):  
Kun-Mo Chu ◽  
Jung-Hwan Choi ◽  
Jung-Sub Lee ◽  
Han Seo Cho ◽  
Seong-Ook Park ◽  
...  
Keyword(s):  
Low Temperature ◽  
Flip Chip ◽  
Heating Temperature ◽  
Coplanar Waveguide ◽  
Fused Silica ◽  
Cavity Surface ◽  
Silver Coating ◽  
Flip Chip Bonding ◽  
Indium Bump ◽  
Polymeric Waveguide

ABSTRACTWe have conducted low-temperature flip-chip bonding for both optical interconnect and microwave applications. Flip-chip bonding of vertical-cavity surface-emitting laser (VCSEL) arrays was performed on a fused silica substrate that provides propagation paths of laser beams and also supports a polymeric waveguide. To avoid thermal damage of the polymeric waveguide during the flip-chip bonding, indium bumps were used and the bonding condition of the flip-chip was determined as a heating temperature of 150 °C and a pressure of 500 gf. Experimentally, a thin silver (Ag) layer coated on the indium bump was very effective to enhance the adhesion strength between the indium bump and the VCSEL chip pads. In addition, the microwave characteristic of coplanar waveguide (CPW) package was slightly improved by the Ag coating.

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