Failure Analysis of Fasteners in a Remotely Operated Vehicle (ROV) System

2015 ◽  
Vol 15 (6) ◽  
pp. 915-923 ◽  
Author(s):  
T. Chowdhury ◽  
D. Sathianarayanan ◽  
G. Dharani ◽  
G. A. Ramadass
2014 ◽  
Vol 48 (3) ◽  
pp. 63-72 ◽  
Author(s):  
Raju Ramesh ◽  
Dharmaraj Sathianarayanan ◽  
Vittal Doss Prakash ◽  
Arumugam Vadivelan ◽  
Sethuraman Ramesh ◽  
...  

AbstractSingle-mode fiber optic systems can play vital roles in cabled deep-water vehicle operations at greater depths (>3,000 m). One kind of single-mode fiber optic system, the ROSUB 6000, is used in a deep-water work-class remotely operated vehicle (ROV). Fiber optic link failure of ROV telemetry and sound navigation and ranging were noticed at a water depth of 3,050 m during the ROSUB 6000 system sea trials. A failure analysis of the fiber optic communication system was carried out with the link data logged during different phases of the deep-sea trials. The results from the failure analysis carried out during deep-sea trials showed an increase in the fiber optic link loss from a depth of 900 m onwards. Further analysis of the fiber optic link loss in the laboratory involved pressure and low-temperature testing of all the subsea components in the ROV telemetry link. From the laboratory pressure test results, it was concluded that pressure was not the root cause of the fiber optic link failure. On further analysis, a complete fiber optic link failure was noticed during the low-temperature testing of the subsea components. Furthermore, the low-temperature testing of the individual subsea components revealed that the fiber optic rotary joint (FORJ) insertion loss increased rapidly at low temperatures. This FORJ insertion loss led to complete failure of the fiber optic links in the ROV. The degradation of index-matching fluid in the FORJ was identified to be the root cause of fiber link failure.


Author(s):  
John R. Devaney

Occasionally in history, an event may occur which has a profound influence on a technology. Such an event occurred when the scanning electron microscope became commercially available to industry in the mid 60's. Semiconductors were being increasingly used in high-reliability space and military applications both because of their small volume but, also, because of their inherent reliability. However, they did fail, both early in life and sometimes in middle or old age. Why they failed and how to prevent failure or prolong “useful life” was a worry which resulted in a blossoming of sophisticated failure analysis laboratories across the country. By 1966, the ability to build small structure integrated circuits was forging well ahead of techniques available to dissect and analyze these same failures. The arrival of the scanning electron microscope gave these analysts a new insight into failure mechanisms.


Author(s):  
Evelyn R. Ackerman ◽  
Gary D. Burnett

Advancements in state of the art high density Head/Disk retrieval systems has increased the demand for sophisticated failure analysis methods. From 1968 to 1974 the emphasis was on the number of tracks per inch. (TPI) ranging from 100 to 400 as summarized in Table 1. This emphasis shifted with the increase in densities to include the number of bits per inch (BPI). A bit is formed by magnetizing the Fe203 particles of the media in one direction and allowing magnetic heads to recognize specific data patterns. From 1977 to 1986 the tracks per inch increased from 470 to 1400 corresponding to an increase from 6300 to 10,800 bits per inch respectively. Due to the reduction in the bit and track sizes, build and operating environments of systems have become critical factors in media reliability.Using the Ferrofluid pattern developing technique, the scanning electron microscope can be a valuable diagnostic tool in the examination of failure sites on disks.


1982 ◽  
Author(s):  
J. CAMPBELL ◽  
R. BECHTEL ◽  
J. BROPHY
Keyword(s):  

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