Self-assembled monolayers for electrochemical migration protection of low-temperature sintered nano-Ag paste

Rare Metals ◽  
2021 ◽  
Author(s):  
Shan Wan ◽  
Hong Wang ◽  
Jin-Hang Liu ◽  
Bo-Kai Liao ◽  
Xing-Peng Guo
ChemPhysChem ◽  
2003 ◽  
Vol 4 (11) ◽  
pp. 1247-1252 ◽  
Author(s):  
Christian J.-F. Dupraz ◽  
Udo Beierlein ◽  
Jörg P. Kotthaus

2007 ◽  
Vol 990 ◽  
Author(s):  
Xiaofang Ang ◽  
Li Cheong Chin ◽  
Guo Ge Zhang ◽  
Jun Wei ◽  
Zhong Chen ◽  
...  

ABSTRACTElevated bonding temperature for interconnection deteriorates the reliability of both the device and the interconnect; hence the imperative for developing low temperature bonding methods. This study investigates the feasibility of using self-assembled monolayers (SAMs) to assist direct gold-gold bonding. This involves a simple molecular self-assembly process whereby a monolayer of alkyl chains with a sulfur end group is attached to the gold surface prior to thermocompression bonding. Using this method, we have achieved gold to gold bonding at a bonding temperature below 100°C, a significant reduction compared to the conventional bonding temperatures of above 150 °C. We attribute this temperature reduction to two properties of SAMs - (1) surface passivation of the Au surface that precludes adsorption of surface contaminants, and (2) The easy displacement of SAMs through thermal desorption just before bonding occurs. This SAMs-assisted bonding mechanism is supported by X-ray photoelectron spectroscopy (XPS) and surface plasmon resonance (SPR) results.


2002 ◽  
Vol 14 (6) ◽  
pp. 418-421 ◽  
Author(s):  
N. Saito ◽  
H. Haneda ◽  
T. Sekiguchi ◽  
N. Ohashi ◽  
I. Sakaguchi ◽  
...  

1996 ◽  
Vol 69 (6) ◽  
pp. 860-862 ◽  
Author(s):  
Rochael J. Collins ◽  
Hyunjung Shin ◽  
Mark R. DeGuire ◽  
Arthur H. Heuer ◽  
Chaim N. Sukenik

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