Thermal Field Modeling and Experimental Analysis in Laser-Assisted Machining of Fused Silica

Silicon ◽  
2020 ◽  
Author(s):  
Pengfei Pan ◽  
Huawei Song ◽  
Zuohui Yang ◽  
Guoqi Ren ◽  
Junfeng Xiao ◽  
...  
Silicon ◽  
2021 ◽  
Author(s):  
Huawei Song ◽  
Pengfei Pan ◽  
Kaihua Xu ◽  
Yuping Zhang ◽  
Zhengxin Yang ◽  
...  

2019 ◽  
Vol 106 (5-6) ◽  
pp. 2049-2064 ◽  
Author(s):  
Huawei Song ◽  
Pengfei Pan ◽  
Guoqi Ren ◽  
Zuohui Yang ◽  
Jinqi Dan ◽  
...  

2019 ◽  
Vol 28 ◽  
pp. 01012
Author(s):  
Mariusz Barański ◽  
Krystian Glapa

In this paper, 3D steady-state thermal field modeling in electromagnetic gripping system using Comsol Multiphisics was presented. The electromagnetic gripping system, which is a component of the mechanical leg of a walking robot was designed by the authors. An algorithm to design of the electromagnetic gripping was developed. During calculations, the influence of the value of the current on the thermal field distribution in steady-state was carried out. Selected results of simulations as well as the analysis of these results were presented.


Author(s):  
Pengfei Pan ◽  
Huawei Song ◽  
Junfeng Xiao ◽  
Zuohui Yang ◽  
Guoqi Ren ◽  
...  

Abstract Laser-assisted machining (LAM) is a promising technology for improving the machinability of hard-to-cut materials. In this study, based on the finite element method (FEM), a cutting model of thermally coupled non-uniform temperature field is established. The chip formation mechanism of fused silica during the laser-assisted machining process is explored from the aspects of laser power and laser incident angle. The results show that as the laser incident angle increases, the continuity of the chip increases gradually. An annular tool holder that can adjust the angle between the laser beam and the tool was designed. And the similar chip morphology obtained by variable-angle cutting experiments verified the effectiveness of the cutting model. Moreover, fracture chips and continuous banded chips are found in both simulation and experiment, which implies that the cutting mechanism works under a hybrid mode of brittle fracture and plastic deformation in the LAM process.


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