scholarly journals 3D thermal field modelling in electromagnetic gripping system

2019 ◽  
Vol 28 ◽  
pp. 01012
Author(s):  
Mariusz Barański ◽  
Krystian Glapa
Keyword(s):  
Steady State ◽  
Field Distribution ◽  
Thermal Field ◽  
Walking Robot ◽  
Field Modelling ◽  
Field Modeling

In this paper, 3D steady-state thermal field modeling in electromagnetic gripping system using Comsol Multiphisics was presented. The electromagnetic gripping system, which is a component of the mechanical leg of a walking robot was designed by the authors. An algorithm to design of the electromagnetic gripping was developed. During calculations, the influence of the value of the current on the thermal field distribution in steady-state was carried out. Selected results of simulations as well as the analysis of these results were presented.

Parallel analysis of thermal field in a layered DC cable

2014 ◽  
Vol 24 (3) ◽  
pp. 613-626
Author(s):  
Jerzy Golebiowski ◽  
Robert Piotr Bycul
Keyword(s):  
Steady State ◽  
Field Distribution ◽  
Time Constant ◽  
Thermal Field ◽  
Thermal Time ◽  
Content Type ◽  
The Core ◽  
Thermal Time Constant ◽  
Steady State Current

Purpose – The purpose of this paper is to prepare procedures for determination of characteristics and parameters of DC cables on the basis of transient and steady thermal field distribution in their cross-sections. Design/methodology/approach – Steady-state current rating was computed iteratively, with the use of steady thermal field distribution in the cable. The iterative process was regulated with respect to this field by changes of the mean surface temperature of the sheath of the cable. It was also controlled with respect to the unknown current rating by deviations of the temperature of the core from the maximum sustained temperature of the insulation (material zone) adjacent to the core. Heating curves were determined (in arbitrarily selected points of the cross-section of the cable) by a parallel algorithm described thoroughly in the first part of the paper. The algorithm was used for computing of transient thermal field distribution throughout the whole cross-section. Thermal time constant distributions were determined by the trapezium rule, where the upper integration limit of respective thermal field distributions was being changed. Findings – Using the methods prepared the following characteristics/parameters of the cable were determined: steady-state current rating, spatial-time heating curves, mean thermal time constant distribution. The results were verified and turned to be in conformance with those of the IEC 287 Standard and a commercial software – Nisa v. 16. Speedup and efficiency of the parallel computations were calculated. It was concluded that the parallel computations took less time than the sequential ones. Research limitations/implications – The specialized algorithms and software are dedicated to cylindrical DC cables. Practical implications – The knowledge of the determined characteristics and parameters contributes to optimal exploitation of a DC cable during its use. Originality/value – The algorithms of determination of the steady-state current rating and thermal time constant are original. The software described in the appendix has also been made by the authors.

Study on the Thermal Field Distribution of Steel Claws for Anode in Aluminium Electrolysis Cell

2015 ◽  
Vol 1120-1121 ◽  
pp. 1089-1092
Author(s):  
Qing Dong Qin
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Field Distribution ◽  
Thermal Field ◽  
Voltage Drop ◽  
The Other ◽  
Electrolysis Cell ◽  
Aluminium Electrolysis ◽  
Element Analysis ◽  
Anode Carbon

The electricity consuming of aluminium electrolysis cell is affected by the voltage drop of anode steel claws during the aluminium electrolysis course. The resistivity of anode steel claws is affected by the temperature. In the present study, the thermal field distribution of anode steel claws was studied by finite element analysis. The results show that the thermal energy of anode steel claws come from anode carbon blocks and environment. The temperature of steel claws less than 1/3 height is affected by anode carbon blocks, and the other part is affected by surrounding temperature. According the results, the principle of the new anode steel claw design is proposed.

Thermal Field Modeling and Experimental Analysis in Laser-Assisted Machining of Fused Silica

Silicon ◽  
2020 ◽  
Author(s):  
Pengfei Pan ◽  
Huawei Song ◽  
Zuohui Yang ◽  
Guoqi Ren ◽  
Junfeng Xiao ◽  
...  
Keyword(s):  
Experimental Analysis ◽  
Thermal Field ◽  
Fused Silica ◽  
Laser Assisted Machining ◽  
Field Modeling

Study on Thermal Placement Optimization of Embedded MCM

2011 ◽  
Vol 189-193 ◽  
pp. 2269-2273
Author(s):  
Chun Yue Huang ◽  
Tian Ming Li ◽  
Ying Liang ◽  
He Geng Wei
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Temperature Field ◽  
Field Distribution ◽  
Temperature Difference ◽  
Optimization Algorithm ◽  
Thermal Field ◽  
Maximum Temperature ◽  
Element Analysis ◽  
Placement Optimization

In the thermal design of embedded multi-chip module (MCM), the placement of chips has a significant effect on temperature field distributing, thus influences the reliability of the embedded MCM. The thermal placement optimization of chips in embedded MCM was studied in this paper, the goal of this work is to decrease temperature and achieve uniform thermal field distribution within embedded MCM. By using ANSYS the finite element analysis model of embedded MCM was developed, the temperature field distributing was calculated. Based on genetic algorithms, chips placement optimization algorithm of embedded MCM was proposed and the optimization chips placement of embedded MCM was achieved by corresponding optimization program. To demonstrate the effectiveness of the obtained optimization chips placement, finite element analysis (FEA) was carried out to assess the thermal field distribution of the optimization chips placement in embedded MCM by using ANSYS. The result shows that without chips placement optimizing the maximum temperature and temperature difference in embedded MCM model are 87.963°C and 2.189°C respectively, by using chips placement optimization algorithm the maximum temperature drop than the original 0.583°C and the temperature difference is only 0.694°C . It turns out that the chip placement optimization approach proposed in this work can be effective in providing thermal optimal design of chip placement in embedded MCM.

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