Analysis of elastic and plastic deformation associated with indentation testing of thin films on substrates

1988 ◽  
Vol 24 (12) ◽  
pp. 1287-1298 ◽  
Author(s):  
A.K. Bhattacharya ◽  
W.D. Nix
Keyword(s):  
Thin Films ◽  
Plastic Deformation ◽  
Indentation Testing ◽  
Elastic And Plastic Deformation

Percolation Effects in the Mechanical Properties of Granular Ni-A12O3 thin films

1990 ◽  
Vol 195 ◽  
Author(s):  
T.E. Schlesinger ◽  
A. Gavrin ◽  
R.C. Cammarata ◽  
C.-L. Chien
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Plastic Deformation ◽  
Magnetic Properties ◽  
Percolation Threshold ◽  
Volume Fraction ◽  
Electrical And Magnetic Properties ◽  
Low Load

ABSTRACTThe mechanical properties of sputtered Ni-Al2O3 granular thin films were investigated by low load microharaness testing. It was found that the microhardness of these films displayed a percolation threshold at a nickel volume fraction of about 0.6, below which the hardness is greatly enhanced. This behavior is qualitatively similar to the electrical and magnetic properties of these types of films. A percolation threshold in hardness can be understood as due to a change in the mechanism for plastic deformation.

scholarly journals Rrevealing plastic deformation mechanisms in polycrystalline thin films with synchrotron XRD

JOM ◽  
2010 ◽  
Vol 62 (12) ◽  
pp. 44-51 ◽  
Author(s):  
Ralph D. Nyilas ◽  
Stephan Frank ◽  
Ralph Spolenak
Keyword(s):  
Thin Films ◽  
Plastic Deformation ◽  
Deformation Mechanisms ◽  
Polycrystalline Thin Films ◽  
Synchrotron Xrd

Effects of Confinement on Plastic Deformation in Passivated AL Films

1993 ◽  
Vol 308 ◽  
Author(s):  
S.G.H. Anderson ◽  
I.-S. Yeo ◽  
P.S. Ho ◽  
S. Ramaswami ◽  
R. Cheung
Keyword(s):  
Thin Films ◽  
Plastic Deformation ◽  
Thermal Cycling ◽  
Temperature Behavior ◽  
Weighted Sum ◽  
Wafer Curvature ◽  
Tension And Compression ◽  
Curvature Measurements

ABSTRACTWafer curvature measurements of a trilayer (SiO2 / AlSiCu / Si) structure are compared to that predicted by a weighted sum of individual measurements of SiO2 and AlSiCu films on Si, and significant differences are found to exist for temperatures above 200°C. A straightforward analysis of the stresses in each layer has been modeled using an extension of a model by Feng et al. which assumes uniform plastic deformation throughout the Al. The modeling results suggest a straightforeward method for determining stresses in deformable thin films that are confined by elastic overlayers. A comparison of the stress-temperature behavior for unpassivated and passivated AlSiCu films reveals that the confined films exhibit less plastic deformation and both higher tension and compression during thermal cycling.

Deformation, Fracture, and Friction Processes

2020 ◽  
pp. 14-24
Author(s):  
Francois Louchet
Keyword(s):  
Plastic Deformation ◽  
Ductile Failure ◽  
Scientific Validity ◽  
Coulomb’S Friction ◽  
Dynamic Loadings ◽  
Triggering Mechanisms ◽  
The Difference ◽  
Elastic And Plastic Deformation ◽  
Physical Quantities ◽  
Rupture Criterion

The main mechanical and physical quantities and concepts ruling deformation, fracture, and friction processes are recalled, with particular attention paid to the simplicity of the analysis, but without betraying the scientific validity of the arguments. We particularly discuss the difference between between elastic and plastic deformation, and quasistatic and dynamic loadings, essential in avalanche triggering mechanisms. The physical origin of Griffith’s rupture criterion that rules both fracture nucleation and propagation, and the transition between brittle and ductile failure processes, is thoroughly discussed. We also explain the physical meaning of the classical Coulomb’s friction law, showing why it can hardly apply to a non-conventional porous, brittle, and healable solid like snow.

Measurement of Stress-strain Curves of PECVD Silicon Oxide Thin Films by Means of Nanoindentation

2006 ◽  
Vol 977 ◽  
Author(s):  
Zhiqiang Cao ◽  
Xin Zhang
Keyword(s):  
Thin Films ◽  
Plastic Deformation ◽  
Deformation Mechanism ◽  
Silicon Oxide ◽  
Equivalent Stress ◽  
Plasticity Theory ◽  
Stress Strain ◽  
Transformation Zone ◽  
Shear Transformation ◽  
Shear Transformation Zone

AbstractIn this paper, we explore the use of nanoindentation techniques as a method of measuring equivalent stress-strain curves of the PECVD SiOx thin films. Three indenter tips with different geometries were adopted in our experiments, enabling us to probe different regimes of plastic deformation in the PECVD SiOx thin films. A shear transformation zone (STZ) based amorphous plasticity theory is applied to depict the underlying plastic deformation mechanism.

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