Diffusion length and grain-boundary recombination velocity measurements with the scanning electron microscope in a finite polysilicon grain

1984 ◽  
Vol 27 (2) ◽  
pp. 177-185 ◽  
Author(s):  
R. Sundaresan ◽  
D.E. Burk
1999 ◽  
Vol 586 ◽  
Author(s):  
C. L. Briant ◽  
D. L. Davidson

ABSTRACTThis paper presents a study of creep in polycrystalline aluminum. The sample was deformed in a scanning electron microscope and local strain was measured by analyzing micrographs taken during the test. EBSP was used to examine grain curvature and recrystallization The results showed that tensile strain developed during the test. The strain was not constant but varied both spatially and with time. Significant grain boundary migration occurred during the test, and near a triple point a grain with a completely new orientation was formed.


2003 ◽  
Vol 49 (165) ◽  
pp. 184-190 ◽  
Author(s):  
Ian Baker ◽  
Daniel Cullen

AbstractA series of experiments was undertaken to determine the origin of filaments found in grain boundaries and impurity spots found in grain interiors of polar ice during observation in the scanning electron microscope. It is shown that although the filaments are artifacts, they demonstrate the presence of impurities segregated to the grain boundary planes. It is also demonstrated that the impurities observed in the grain interior reside there and were not transported from the grain boundaries during specimen preparation or observation.


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