Kinetics of oxidation of polypyrrole-coated transparent electrodes by in situ linear sweep voltammetry and spectroscopy

1989 ◽  
Vol 30 (3) ◽  
pp. 369-379 ◽  
Author(s):  
Y. Tezuka ◽  
K. Aoki ◽  
K. Shinozaki
Keyword(s):  
Linear Sweep Voltammetry ◽  
Transparent Electrodes ◽  
Linear Sweep ◽  
Kinetics Of Oxidation ◽  
Kinetics Of

Oxidation Kinetics of Yba2Cu3OT7-x Thin Films in the Presence of Atomic Oxygen and Molecular Oxygen by In-Situ Resistivity Measurement

1991 ◽  
Vol 230 ◽  
Author(s):  
K. Yamamoto ◽  
B. M. Lairson ◽  
J. C. Bravman ◽  
T. H. Geballe
Keyword(s):  
Thin Films ◽  
Molecular Oxygen ◽  
Atomic Oxygen ◽  
Resistivity Measurement ◽  
Oxygen Stoichiometry ◽  
Ambient Conditions ◽  
Kinetics Of Oxidation ◽  
Thermally Activated ◽  
Kinetics Of

AbstractThe kinetics of oxidation in Yba2Cu3O7-x thin films in the presence of molecular and atomic oxygen ambients have been studied. The resistivity of c-axis, a-axis, and mixed a+c axis oriented films, deposited in-situ by off-axis magnetron sputtering, was measured as a function of time subsequent to a change in the ambient conditions. The oxidation process is shown to be thermally activated and can be characterized by a diffusion model with an activation energy which varies from approximately 1.2eV in the presence of molecular oxygen to 0.6eV for a flux of 2×1015 oxygen atoms/cm2sec. In both cases, diffusivity is found to be insensitive to oxygen stoichiometry, but the rate of oxidation is found to be sensitive to the microstructure and orientation of the films.

scholarly journals The Oxidation Kinetics of Thin Copper Films Studied by Resistivity Measurements

1999 ◽  
Vol 54 (2) ◽  
pp. 117-123 ◽  
Author(s):  
M. Rauh ◽  
H.-U. Finzel ◽  
P. Wißmann
Keyword(s):  
Linear Time ◽  
Metal Films ◽  
Pure Oxygen ◽  
Copper Films ◽  
Kinetics Of Oxidation ◽  
Resistivity Measurements ◽  
Glass Substrates ◽  
Kinetics Of ◽  
Potential Diffusion

Abstract Resistivity measurements on thin metal films allow to study the kinetics of oxidation. The method is applied to 50 - 60 nm thick copper films deposited on glass substrates under UHV conditions. After annealing at 150°C, the films are exposed to pure oxygen at various temperatures in the range 85 -135°C, and the electrical resistivity is recorded in situ. At these temperatures, the oxygen begins to penetrate into the interior of the films, which results in a relatively steep increase in the film resistivity. A linear time law is valid to good approximation, which can be attributed to the influence of the dissociation of an adsorbed molecular species of oxygen on the reaction velocity. A potential diffusion of oxygen in the grain boundaries is also discussed.

Studies of the kinetics of aluminium incorporation into an iron electrode in molten salts by linear sweep voltammetry

1989 ◽  
Vol 19 (2) ◽  
pp. 271-274 ◽  
Author(s):  
F. Lantelme ◽  
E. Cherrat ◽  
Y. Chryssoulakis ◽  
S. Kalogeropoulou
Keyword(s):  
Molten Salts ◽  
Linear Sweep Voltammetry ◽  
Iron Electrode ◽  
Linear Sweep ◽  
Kinetics Of

Initial Kinetics of Copper Oxidation in Different Oxidizing Atmospheres as Studied by In Situ UHV-TEM

2000 ◽  
Vol 6 (S2) ◽  
pp. 42-43
Author(s):  
Mridula D. Bharadwaj ◽  
Lori Tropia ◽  
Murray Gibson ◽  
Judith C. Yang
Keyword(s):  
Surface Science ◽  
High Vacuum ◽  
Practical Interest ◽  
Ultra High Vacuum ◽  
Copper Oxidation ◽  
Initial Oxidation ◽  
Kinetics Of Oxidation ◽  
Transmission Electron ◽  
Kinetics Of

It is of fundamental and practical interest to understand the oxidation process since a desirable property for metals is resistance to corrosion. But there is a wide gap between information provided by surface science methods and that provided by bulk oxidation studies. The former have mainly examined the adsorption of ∼ 1 ML of oxygen on the metal surface, where as both low and high temperature bulk oxidation studies have mainly focused on the growth of an oxide layer at the later stages of oxidation.We are probing the initial oxidation stage of a model metal system by in situ ultra-high vacuum (UHV) transmission electron microscopy (TEM) in order to gain insights into the initial kinetics of oxidation. We have previously shown that the growth mechanism of the cuprous oxide is initially dominated by oxygen surface diffision.

The Kinetics of Oxidation of Ru-Bearing Nickel-Based Superalloys

2008 ◽  
Vol 595-598 ◽  
pp. 59-67 ◽  
Author(s):  
I.M. Edmonds ◽  
Hugh E. Evans ◽  
C.N. Jones ◽  
Robert W. Broomfield
Keyword(s):  
Rate Constants ◽  
Initial Period ◽  
Anomalous Behaviour ◽  
Fourth Generation ◽  
Third Generation ◽  
Alumina Layer ◽  
Kinetics Of Oxidation ◽  
Transient Oxidation ◽  
Kinetics Of

Oxidation tests have been undertaken in air on two experimental fourth-generation Nibased superalloys containing, respectively, 3 and 5 wt.% Ru. A Ru-free, third generation alloy (CMSX-10K) was also included in the test programme which used temperatures covering the range 750-1100°C. Where possible, comparisons were also made with literature data on the secondgeneration CMSX-4 alloy and with IN738. After an initial period of transient oxidation, the subsequent parabolic rate constants for the 3%-Ru alloy were similar to those for CMSX-4 at all temperatures above 750°C. At 1000 and 1100°C these were consistent with the formation and growth of an α-alumina layer. At 950°C and lower, protective oxidation was obtained through the formation of an Al-rich spinel rather than alumina but, again, no deleterious influence of Ru additions could be found, at least in the temperature range of 800-950°C. Anomalous behaviour was found, however, at 750°C in that the Ru-bearing alloys oxidised non-protectively through the formation of sub-surface pits in which the γ΄ phase within the alloy was oxidised in situ.

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