Reliability analysis of multicellular system architectures for low-cost satellites

2018 ◽  
Vol 147 ◽  
pp. 183-194 ◽  
Author(s):  
A.O. Erlank ◽  
C.P. Bridges
2018 ◽  
Vol 75 ◽  
pp. 133-142 ◽  
Author(s):  
Mohsen Rashki ◽  
Alireza Ghavidel ◽  
Hamed Ghohani Arab ◽  
Seyed Roohollah Mousavi

2018 ◽  
Vol 2018 ◽  
pp. 1-16 ◽  
Author(s):  
D. Y. C. Lie ◽  
J. C. Mayeda ◽  
Y. Li ◽  
J. Lopez

The 5G wireless revolution presents some dramatic challenges to the design of handsets and communication infrastructures, as 5G targets higher than 10 Gbps download speed using millimeter-wave (mm-Wave) spectrum with multiple-input multiple-output (MIMO) antennas, connecting densely deployed wireless devices for Internet-of-Everything (IoE), and very small latency time for ultrareliable machine type communication, etc. The broadband modulation bandwidth for 5G RF transmitters (i.e., maximum possibly even above 1 GHz) demands high-power efficiency and stringent linearity from its power amplifier (PA). Additionally, the phased-array MIMO antennas with numerous RF front-ends (RFFEs) will require unprecedented high integration level with low cost, making the design of 5G PA one of the most challenging tasks. As the centimeter-wave (cm-Wave) 5G systems will probably be deployed on the market earlier than their mm-Wave counterparts, we will review in this paper the latest development on 15 GHz and 28 GHz 5G cm-Wave PAs extensively, while also covering some key mm-Wave PAs in the literature. Our review will focus on the available options of device technologies, novel circuit and system architectures, and efficiency enhancement techniques at power back-off for 5G PA design.


2021 ◽  
Vol 11 (22) ◽  
pp. 11064
Author(s):  
Paulo Barros ◽  
António Curado ◽  
Sérgio Ivan Lopes

Radon gas is a harmful pollutant with a well-documented adverse influence on public health. In poorly ventilated environments, that are often prone to significant radon levels, studies indicate a known relationship between human radon exposure and lung cancer. Recent technology advances, notably on the Internet of Things (IoT) ecosystem, allow the integration of sensors, computing, and communication capabilities into low-cost and small-scale devices that can be used for implementing specific cyber-physical systems (CPS) for online and real-time radon management. These technologies are crucial for improving the overall building indoor air quality (IAQ), contributing toward the so-called cognitive buildings, where human-based control is tending to decline, and building management systems (BMS) are focused on balancing critical factors, such as energy efficiency, human radon exposure management, and user experience, to achieve a more transparent and harmonious integration between technology and the built environment. This work surveys recent IoT technologies for indoor radon exposure management (monitoring, assessment and mitigation), and discusses its main challenges and opportunities, by focusing on methods, techniques, and technologies to answer the following questions: (i) What technologies have been recently in use for radon exposure management; (ii) how they operate; (iii) what type of radon detection mechanisms do they use; and (iv) what type of system architectures, components, and communication technologies have been used to assist the referred technologies. This contribution is relevant to pave the way for designing more intelligent and sustainable systems that rely on IoT and Information and Communications Technology (ICT), to achieve an optimal balance between these two critical factors: human radon exposure management and building energy efficiency.


2020 ◽  
Vol 37 ◽  
pp. 28-36
Author(s):  
H Y Hsiao ◽  
K N Chiang

ABSTRACT We applied an artificial intelligence (AI) algorithm, the random forest (RF) model, using finite element simulations to predict the reliability life of wafer-level packaging (WLP). Due to rapid growth and an increasingly fast cycle pace of integrated circuits, it is imperative to shorten the development time of electronic packaging. This study focuses on packaging reliability analysis and prediction. In recent years, package reliability analysis has been performed using finite element method simulations, which reduce the required number of accelerated thermal cyclic tests. Compared with conventional ball grid array-type packaging, WLP has become the mainstream packaging type due to its small form factor, batch-type manufacturing process and low cost. We applied the RF model, a machine learning algorithm, to predict the reliability life of WLP. The finite element procedure, theory and mesh size were validated by a set of experiments, and a large dataset was generated for AI training purposes through the finite element simulations. The RF method was built using Python®. A fast and robust reliability assessment AI model of WLP can be achieved once the AI training accuracy is located within the target range; the designer only needs to input the geometry of each WLP component to obtain the reliability life cycle. WLP structural optimization can thus be easily achieved. The AI model also significantly shortens the design cycle to meet current design demands.


Author(s):  
Y. L. Chen ◽  
S. Fujlshiro

Metastable beta titanium alloys have been known to have numerous advantages such as cold formability, high strength, good fracture resistance, deep hardenability, and cost effectiveness. Very high strength is obtainable by precipitation of the hexagonal alpha phase in a bcc beta matrix in these alloys. Precipitation hardening in the metastable beta alloys may also result from the formation of transition phases such as omega phase. Ti-15-3 (Ti-15V- 3Cr-3Al-3Sn) has been developed recently by TIMET and USAF for low cost sheet metal applications. The purpose of the present study was to examine the aging characteristics in this alloy.The composition of the as-received material is: 14.7 V, 3.14 Cr, 3.05 Al, 2.26 Sn, and 0.145 Fe. The beta transus temperature as determined by optical metallographic method was about 770°C. Specimen coupons were prepared from a mill-annealed 1.2 mm thick sheet, and solution treated at 827°C for 2 hr in argon, then water quenched. Aging was also done in argon at temperatures ranging from 316 to 616°C for various times.


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