Modelling of point defect complex formation and its application to H+ ion implanted silicon

2015 ◽  
Vol 99 ◽  
pp. 187-195 ◽  
Author(s):  
N. Cherkashin ◽  
F.-X. Darras ◽  
P. Pochet ◽  
S. Reboh ◽  
N. Ratel-Ramond ◽  
...  
2009 ◽  
Vol 404 (23-24) ◽  
pp. 4820-4822 ◽  
Author(s):  
T.E. Mølholt ◽  
R. Mantovan ◽  
H.P. Gunnlaugsson ◽  
K. Bharuth-Ram ◽  
M. Fanciulli ◽  
...  

1999 ◽  
Vol 568 ◽  
Author(s):  
C. R. Cho ◽  
N. Yarykin ◽  
G. A. Rozgonyi ◽  
R. A. Zuhr

ABSTRACTThe formation of vacancy-related defects in n-type silicon has been studied immediately after implantation of He, Si, or Ge ions at 85 K using in-situ DLTS. A-center concentrations in He-implanted samples reach a maximum immediately after implantation, whereas, with Si or Ge ion implanted samples they continuously increase during subsequent anneals. It is proposed that defect clusters, which emit vacancies during anneals, are generated in the collision cascades of Si or Ge ions. An illumination-induced suppression of A-center formation is seen immediately after implantation of He ions at 85 K. This effect is also observed with Si or Ge ions, but only after annealing. The suppression of vacancy complex formation via photoexcitation is believed to occur due to an enhanced recombination of defects during ion implantation, and results in reduced number of vacancies remaining in the defect clusters. In p-type silicon, a reduction in K-center formation and an enhanced migration of defects are concurrently observed in the illuminated sample implanted with Si ions. These observations are consistent with a model where the injection of excess carriers modifies the defect charge state and impacts their diffusion.


1993 ◽  
Vol 300 ◽  
Author(s):  
T. E. Haynes ◽  
R. Morton ◽  
S. S. Lau

ABSTRACTIn recent years, a number of experimental observations have indicated that interactions between mobile point defects generated during ion implantation play an important role in the damage production in Ill-V compound semiconductors, and particularly GaAs. This paper reviews a set of such observations based on ion channeling measurements of the lattice damage in GaAs implanted with Si ions. Selected independent observations are also surveyed to illustrate the importance of point-defect interactions. Taken together, these show that at least two contributions to the lattice damage must often be considered: a “prompt” contribution attributed to direct-impact amorphization, and a “delayed” contribution attributed to point-defect clustering. New measurements are then described which show the different effects that these two damage components have on the electrical activation in annealed, Siimplanted GaAs. The aim is to indicate the potential to exploit the balance between these two damage contributions in order to improve the electrical performance and reproducibility of ion-implanted and annealed layers. Finally, the applicability of these concepts to other ion species and other compound semiconductors (GaP and InP) is briefly discussed.


1993 ◽  
Vol 62 (4) ◽  
pp. 393-395 ◽  
Author(s):  
A. La Ferla ◽  
L. Torrisi ◽  
G. Galvagno ◽  
E. Rimini ◽  
G. Ciavola ◽  
...  

2013 ◽  
Vol 110 (1) ◽  
Author(s):  
Pekka T. Neuvonen ◽  
Lasse Vines ◽  
Bengt G. Svensson ◽  
Andrej Yu. Kuznetsov

2017 ◽  
Vol 5 (35) ◽  
pp. 8958-8965 ◽  
Author(s):  
Leonie Koch ◽  
Sebastian Steiner ◽  
Kai-Christian Meyer ◽  
In-Tae Seo ◽  
Karsten Albe ◽  
...  

The temperature dependent ionic conductivity of NBT results from an interplay of defect complex formation, phase coexistence, and dopant concentration.


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