Experimental investigation of thermal conductivity and electrical conductivity of BioGlycol–water mixture based Al2O3 nanofluid

2016 ◽  
Vol 102 ◽  
pp. 932-941 ◽  
Author(s):  
M.Kh. Abdolbaqi ◽  
W.H. Azmi ◽  
Rizalman Mamat ◽  
K.V. Sharma ◽  
G. Najafi
Keyword(s):  
Thermal Conductivity ◽  
Electrical Conductivity ◽  
Experimental Investigation ◽  
Water Mixture ◽  
Al2o3 Nanofluid

scholarly journals Thermal Conductivity Enhancement of Al2O3 Nanofluid in Ethylene Glycol and Water Mixture

2015 ◽  
Vol 79 ◽  
pp. 397-402 ◽  
Author(s):  
N.A. Usri ◽  
W.H. Azmi ◽  
Rizalman Mamat ◽  
K. Abdul Hamid ◽  
G. Najafi
Keyword(s):  
Thermal Conductivity ◽  
Ethylene Glycol ◽  
Thermal Conductivity Enhancement ◽  
Water Mixture ◽  
Conductivity Enhancement ◽  
Al2o3 Nanofluid

An Experimental Investigation of Properties of Nanofluid and Its Performance on Thermosyphon Cooled by Natural Convection

2019 ◽  
Vol 11 (4) ◽  
Author(s):  
Sidhartha Das ◽  
Asis Giri ◽  
S. Samanta ◽  
S. Kanagaraj
Keyword(s):  
Thermal Conductivity ◽  
Surface Tension ◽  
Contact Angle ◽  
Experimental Investigation ◽  
Natural Convection ◽  
Thermal Resistance ◽  
Al2o3 Nanoparticles ◽  
Water Based ◽  
Lower Heat ◽  
Al2o3 Nanofluid

An attempt is made here to characterize thermal conductivity of water-based Al2O3 nanofluid and then use the same in a circular finned thermosyphon (TPCT) to measure its thermal performance. The concentration of Al2O3 nanofluid is varied within 0.05–0.25% by volume. The thermal conductivity of nanofluid is increased with concentration of Al2O3 nanoparticles as well as with temperature. A maximum of 26.7% enhancement of thermal conductivity is observed at 45 °C for 0.25% concentration by volume of nanofluid in comparison to that of de-ionized (DI) water. Variations of surface tension and contact angle of Al2O3 nanofluid are also compared with DI water. One of the smallest TPCT with different heat inputs (4 W, 8 W, and 12 W) and different inclinations (30 deg, 45 deg, 60 deg, and 90 deg) is tested for different concentration of Al2O3 nanofluid, which will find application in smaller electronic units. It is found that use of nanofluid decreases the wall temperature distribution of TPCT. Thermal resistance of TPCT decreases whenever TPCT is filled with nanofluid and a maximum of 36.4% reduction in thermal resistance is noted for 0.25% volume of nanoparticles at 4 W with an inclination of 60 deg. It is also found that performance of TPCT is higher at 60 deg inclination compared to other inclinations, especially for lower heat input.

COPPER ALLOY No. 815

Alloy Digest ◽  
1977 ◽  
Vol 26 (5) ◽  
Keyword(s):  
Thermal Conductivity ◽  
Electrical Conductivity ◽  
Corrosion Resistance ◽  
Physical Properties ◽  
Copper Alloy ◽  
Heat Treating ◽  
Chromium Alloy ◽  
High Electrical Conductivity ◽  
Medium Hardness ◽  
Hardened Condition

Abstract Copper Alloy No. 815 is an age-hardenable cast copper-chromium alloy. It is characterized by high electrical and thermal conductivities combined with medium hardness and strength in the age-hardened condition. It is used for components requiring high electrical conductivity or high thermal conductivity. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on corrosion resistance as well as casting, heat treating, machining, and joining. Filing Code: Cu-332. Producer or source: Copper alloy foundries.

Investigation of Thermoelectric Materials: Substitution effect of Bi on the Ag1-xPb18MTe20 (M = Sb, Bi) (x = 0, 0.14, 0.3)

2007 ◽  
Vol 1044 ◽  
Author(s):  
Mi-kyung Han ◽  
Huijun Kong ◽  
Ctirad Uher ◽  
Mercouri G Kanatzidis
Keyword(s):  
Thermal Conductivity ◽  
Electrical Conductivity ◽  
Seebeck Coefficient ◽  
Thermoelectric Materials ◽  
Figure Of Merit ◽  
Lattice Thermal Conductivity ◽  
Substitution Effect ◽  
Dimensionless Figure Of Merit ◽  
The Matrix ◽  
Mass Fluctuation

AbstractWe performed comparative investigations of the Ag1-xPb18MTe20 (M = Bi, Sb) (x = 0, 0.14, 0.3) system to better understand the roles of Sb and Bi on the thermoelectric properties. In both systems, the electrical conductivity nearly keeps the same values, while the Seebeck coefficient decreases dramatically in going from Sb to Bi. Compared to the lattice thermal conductivity of PbTe, that of AgPb18BiTe20 is substantially reduced. The lattice thermal conductivity of the Bi analog, however, is higher than that of AgPb18SbTe20 and this is attributed largely to the decrease in the degree of mass fluctuation between the nanostructures and the matrix (for the Bi analog). As a result the dimensionless figure of merit ZT of Ag1-xPb18MTe20 (M = Bi) is found to be smaller than that of Ag1-xPb18MTe20 (M = Sb).

Experimental investigation of extinction properties and thermal conductivity of metal-coated dielectric fibers in vacuum

1987 ◽  
Vol 8 (2) ◽  
pp. 263-280 ◽  
Author(s):  
H. Reiss ◽  
F. Schmaderer ◽  
G. Wahl ◽  
B. Ziegenbein ◽  
R. Caps
Keyword(s):  
Thermal Conductivity ◽  
Experimental Investigation

Numerical Simulation & Experimental Investigation of SMT Laser Microsoldering Thermal Process

1991 ◽  
Vol 226 ◽  
Author(s):  
Wang Chunqing ◽  
Qian Yiyu ◽  
Jiang Yihong
Keyword(s):  
Thermal Conductivity ◽  
Numerical Simulation ◽  
Experimental Investigation ◽  
Thermal Process ◽  
Light Wave ◽  
Light Reflection ◽  
Lead Wire ◽  
Wire Surface ◽  
Conductivity Variation ◽  
Thermal Conductivity Variation

AbstractIn this paper,a numerical simulation of thermal process in the SMT laser microsoldering joint has been developed, in which, the influence on thermal process of the factors such as the thermal conductivity variation of solder with temperature, light reflection coefficient of the lead wire surface, and heat exchange on the surface of SMT materials all have been considered. In order to carry this numerical calculation practice and prove it's results,the reflexive characteristic of light wave to the SMT materials has been gauged,and the dynamic temperature process of laser microjoint has been measured by a new experimental method which was invented by the authors.The results of numerical simulation have been borne out by the tests, and the influences of heating parameters on thermal process has been analysed in this paper.The conclusions will be advantageous to the further study of the microjoint quality control in the SMT laser microsoldering.

Sign in / Sign up

Export Citation Format

Share Document