Computational optimization of counter-flow double-layered microchannel heat sinks subjected to thermal resistance and pumping power

2017 ◽  
Vol 121 ◽  
pp. 180-189 ◽  
Author(s):  
Han Shen ◽  
Xin Jin ◽  
Fengli Zhang ◽  
Gongnan Xie ◽  
Bengt Sunden ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
Heat Sinks ◽  
Pumping Power ◽  
Counter Flow ◽  
Computational Optimization ◽  
Microchannel Heat Sinks

scholarly journals Numerical Study of Double-Layered Microchannel Heat Sinks with Different Cross-Sectional Shapes

Entropy ◽  
2018 ◽  
Vol 21 (1) ◽  
pp. 16 ◽  
Author(s):  
Daxiang Deng ◽  
Guang Pi ◽  
Weixun Zhang ◽  
Peng Wang ◽  
Ting Fu
Keyword(s):  
Pressure Drop ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Numerical Study ◽  
Heat Sinks ◽  
High Heat Flux ◽  
Pumping Power ◽  
Cross Sectional ◽  
Prime Concern ◽  
Microchannel Heat Sinks

This work numerically studies the thermal and hydraulic performance of double-layered microchannel heat sinks (DL-MCHS) for their application in the cooling of high heat flux microelectronic devices. The superiority of double-layered microchannel heat sinks was assessed by a comparison with a single-layered microchannel heat sink (SL-MCHS) with the same triangular microchannels. Five DL-MCHSs with different cross-sectional shapes—triangular, rectangular, trapezoidal, circular and reentrant Ω-shaped—were explored and compared. The results showed that DL-MCHS decreased wall temperatures and thermal resistance considerably, induced much more uniform wall temperature distribution, and reduced the pressure drop and pumping power in comparison with SL-MCHS. The DL-MCHS with trapezoidal microchannels performed the worst with regard to thermal resistance, pressure drop, and pumping power. The DL-MCHS with rectangular microchannels produced the best overall thermal performance and seemed to be the optimum when thermal performance was the prime concern. Nevertheless, the DL-MCHS with reentrant Ω-shaped microchannels should be selected when pumping power consumption was the most important consideration.

Two-Phase Stacked Microchannel Heat Sinks for Microelectronics Cooling

2005 ◽  
Vol 2 (2) ◽  
pp. 122-131
Author(s):  
Pradeep Hegde ◽  
K.N. Seetharamu ◽  
P.A. Aswatha Narayana ◽  
Zulkifly Abdullah
Keyword(s):  
Finite Element ◽  
Pressure Drop ◽  
Thermal Resistance ◽  
Heat Sink ◽  
Two Phase Flow ◽  
Heat Sinks ◽  
Phase Flow ◽  
Pumping Power ◽  
Two Phase ◽  
Microchannel Heat Sinks

Stacked microchannel heat sinks with two-phase flow have been analyzed using the Finite Element Method (FEM). The present method is a simple and practical approach for analyzing the thermal performance of single or multi layered microchannel heat sinks with either single or two-phase flow. A unique 10 noded finite element is used for the channel discretization. Two-phase thermal resistance, pressure drop and pumping power of single, double and triple stack microchannel heat sinks are determined at different base heat fluxes ranging from 150 W/cm2 to 300 W/cm2. The temperature distribution along the length of the microchannel is also plotted. It is found that stacked microchannel heat sinks with two-phase flow are thermally more efficient than two-phase single layer microchannel heat sinks, both in terms of thermal resistance and pumping power requirements. It is observed that the thermal resistance of a double stack microchannel heat sink with two-phase flow is about 40% less than that for a single stack heat sink. A triple stack heat sink yields a further 20% reduction in the thermal resistance and at the same time operates with about 30% less pumping power compared to a single stack heat sink. The effect of channel aspect ratio on the thermal resistance and pressure drop of stacked microchannel heat sinks with two-phase flow are also studied.

scholarly journals Temperature Uniformity in Cross-Flow Double-Layered Microchannel Heat Sinks

Fluids ◽  
2020 ◽  
Vol 5 (3) ◽  
pp. 143
Author(s):  
Carlo Nonino ◽  
Stefano Savino
Keyword(s):  
Numerical Study ◽  
Cross Flow ◽  
Bottom Layer ◽  
Heat Sinks ◽  
Temperature Uniformity ◽  
Counter Flow ◽  
Microchannel Heat Sinks ◽  
Unequal Number ◽  
Flow Configurations ◽  
Header Design

An in-house finite element method (FEM) procedure is used to carry out a numerical study on the thermal behavior of cross-flow double-layered microchannel heat sinks with an unequal number of microchannels in the two layers. The thermal performance is compared with those yielded by other more conventional flow configurations. It is shown that if properly designed, i.e., with several microchannels in the top layer smaller than that in the bottom layer, cross-flow double-layered microchannel heat sinks can provide an acceptable thermal resistance and a reasonably good temperature uniformity of the heated base with a header design that is much simpler than that required by the counter-flow arrangement.

Flow Maldistribution Effects on the Temperature Uniformity in Double-Layered Microchannel Heat Sinks

2019 ◽  
Author(s):  
Carlo Nonino ◽  
Stefano Savino
Keyword(s):  
Thermal Resistance ◽  
Flow Rate ◽  
Heat Exchangers ◽  
Total Mass ◽  
Cross Flow ◽  
Heat Sinks ◽  
Temperature Uniformity ◽  
Inlet Velocity ◽  
Microchannel Heat Sinks ◽  
Flow Maldistribution

Abstract A numerical investigation is carried out on the effects of flow maldistribution on the temperature uniformity and overall thermal resistance in double-layered microchannel heat sinks. Different flow maldistribution models accounting for the effects of some typical header designs are considered together with different combinations of the average inlet velocity in the two layers of microchannels for a given total mass flow rate. The numerical simulations are carried out using an in-house FEM procedure previously developed by the authors for the analysis of cross-flow microchannel heat exchangers.

Improving Heat Transfer of Plate-Fin Heat Sinks Using Through Rod Configurations

2020 ◽  
Vol 13 (1) ◽  
Author(s):  
Mostafa A. H. Abdelmohimen ◽  
Salem Algarni ◽  
Khalid Almutairi ◽  
Gulam M. S. Ahmed ◽  
Kashif Irshad ◽  
...  
Keyword(s):  
Reynolds Number ◽  
Nusselt Number ◽  
Thermal Resistance ◽  
Flow Direction ◽  
Heat Sinks ◽  
Pumping Power ◽  
Baseline Case ◽  
Flow Directions ◽  
Suction Flow ◽  
Impinging Flow

Abstract The performance of the heat sink has been investigated as using rods through its fins. The shear-stress transport k–ω model is selected to carry out this study. Two different flow directions have been studied. Four cases are represented, including the baseline case which has no rods through the fins. Two, four, and six rods are used through the fins. Thermal resistance, pumping power, and Nusselt number have been represented and discussed through this study. The results show that as the number of rods increases, the thermal resistance decreases while the required pumping power increases. The impinging flow direction shows higher performance as compared with the suction flow direction. As the Reynolds number increases, the Nusselt number increases for all studied cases. The optimum case along with the studied range of Reynolds number and number of rods is case-2 (has four rods through fins).

S-Shaped Pin-Fins for Enhancement of Overall Performance of the Pin-Fin Heat Sink

2010 ◽  
Author(s):  
T. J. John ◽  
B. Mathew ◽  
H. Hegab
Keyword(s):  
Reynolds Number ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Heat Sinks ◽  
Uniform Heat Flux ◽  
Pumping Power ◽  
Pin Fin ◽  
Pin Fins ◽  
Overall Performance

In this paper the authors are studying the effect of introducing S-shaped pin-fin structures in a micro pin-fin heat sink to enhance the overall thermal performance of the heat sinks. For the purpose of evaluating the overall thermal performance of the heat sink a figure of merit (FOM) term comprising both thermal resistance and pumping power is introduced in this paper. An optimization study of the overall performance based on the pitch distance of the pin-fin structures both in the axial and the transverse direction, and based on the curvature at the ends of S-shape fins is also carried out in this paper. The value of the Reynolds number of liquid flow at the entrance of the heat sink is kept constant for the optimization purpose and the study is carried out over a range of Reynolds number from 50 to 500. All the optimization processes are carried out using computational fluid dynamics software CoventorWARE™. The models generated for the study consists of two sections, the substrate (silicon) and the fluid (water at 278K). The pin fins are 150 micrometers tall and the total structure is 500 micrometer thick and a uniform heat flux of 500KW is applied to the base of the model. The non dimensional thermal resistance and nondimensional pumping power calculated from the results is used in determining the FOM term. The study proved the superiority of the S-shaped pin-fin heat sinks over the conventional pin-fin heat sinks in terms of both FOM and flow distribution. S-shaped pin-fins with pointed tips provided the best performance compared to pin-fins with straight and circular tips.

Optimisation of single and double layer counter flow microchannel heat sinks

2002 ◽  
Vol 22 (14) ◽  
pp. 1569-1585 ◽  
Author(s):  
S.H. Chong ◽  
K.T. Ooi ◽  
T.N. Wong
Keyword(s):  
Double Layer ◽  
Heat Sinks ◽  
Counter Flow ◽  
Microchannel Heat Sinks

scholarly journals Energy and Exergy Viability Analysis of Nanofluids As A Coolant for Microchannel Heat Sink

2019 ◽  
Vol 16 (1) ◽  
pp. 6090-6107
Author(s):  
S. Mukherjee ◽  
Purna Chandra Mishra ◽  
P. Chaudhuri
Keyword(s):  
Thermal Resistance ◽  
Weight Fraction ◽  
Constant Heat Flux ◽  
Heat Sinks ◽  
Exergy Loss ◽  
Simultaneous Increase ◽  
Substrate Thickness ◽  
Pumping Power ◽  
Rectangular Microchannel ◽  
Viability Analysis

The present paper aims to provide a theoretical analysis of energy, exergy loss and pumping power demand of water-based Al2O3, TiO2, CuO, SiC nanofluids flow through rectangular microchannel heat sinks under constant heat flux condition. The weight fraction of nanoparticles was varied from 0% to5%. Thermal resistance decreased with particle inclusion in the base fluid. Decease in thermal resistance and increase in microchannel efficiency was observed with the application of nanofluids. However, reduction in thermal resistance and rise in efficiency is more with Al2O3 –water and CuO-water nanofluids rather than TiO2-water and SiC-water nanofluids. Addition of nanoparticles in base fluids was found suitable for reducing thermal resistance and increasing efficiency of microchannel but at the same time, an increase in pumping power with the rise in weight fraction was also observed. The maximum reduction in thermal resistance with a simultaneous increase in thermal efficiency was observed using CuO-water nanofluids at 5% wt. fraction. The estimated exergy loss is relatively higher in CuO-water and Al2O3-water nanofluids than TiO2-water and SiC-water nanofluids. The rise in ambient temperature effectively reduces the exergy loss. Maximum exergy loss was obtained with CuO nanofluids at 5% wt. fraction while the minimum was observed with water. The effect of substrate thickness on efficiency and exergy loss was also estimated.

Sign in / Sign up

Export Citation Format

Share Document