Optimization design of grooved evaporator wick structures in vapor chamber heat spreaders

2020 ◽  
Vol 166 ◽  
pp. 114657 ◽  
Author(s):  
Baotong Li ◽  
Xinxin Yin ◽  
Wenhao Tang ◽  
Jinhua Zhang
Keyword(s):  
Optimization Design ◽  
Vapor Chamber ◽  
Heat Spreaders

Wick-free paradigm for high-performance vapor-chamber heat spreaders

2022 ◽  
Vol 253 ◽  
pp. 115138
Author(s):  
George Damoulakis ◽  
Constantine M. Megaridis
Keyword(s):  
High Performance ◽  
Vapor Chamber ◽  
Heat Spreaders

Study of Miniaturization of a Silicon Vapor Chamber for Compact 3D Microelectronics, via a Hybrid Analytical and Finite Element Method

2019 ◽  
Vol 6 (5) ◽  
pp. 01-18
Author(s):  
Ma Yue ◽  
Shirazy Mahmoud ◽  
Coudrain Perceval ◽  
Colonna Jean-Phulippe ◽  
Souifi Abdelkader ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Numerical Models ◽  
Computational Cost ◽  
Vapor Chamber ◽  
Cooling Systems ◽  
Heat Spreaders ◽  
Operating Limits ◽  
Silicon Vapor ◽  
Core Height ◽  
Low Computational Cost

The interest in silicon vapor chambers (SVCs) has increased in the recent years as they have been identified as efficient cooling systems for microelectronics. They present the advantage of higher thermal conductivity and smaller form factor compared to conventional heat spreaders. This work aims to investigate the potential miniaturization of these devices, preliminary to integration on the backside of mobile device chips, located as close as possible to hotspots. While detailed numerical models of vapor chamber operation are developed, an easy modeling with low computational cost is needed for an effective parametric study.  Based on the study of the operating limits, this paper shows the thinning potential of a water filled micropillar for a device operating below 10 W and identify the corresponding vapour core height, and wick thickness.

scholarly journals Study of Miniaturization of a Silicon Vapor Chamber for Compact 3D Microelectronics, via a Hybrid Analytical and Finite Element Method

2019 ◽  
Vol 7 (6) ◽  
pp. 1-16
Author(s):  
Yue MA ◽  
M. R. S. Shirazy ◽  
Q. Struss ◽  
P. Coudrain ◽  
J.P. Colonna ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Numerical Models ◽  
Computational Cost ◽  
Vapor Chamber ◽  
Cooling Systems ◽  
Heat Spreaders ◽  
Operating Limits ◽  
Silicon Vapor ◽  
Core Height ◽  
Low Computational Cost

The interest in silicon vapor chambers (SVCs) has increased in the recent years as they have been identified as efficient cooling systems for microelectronics. They present the advantage of higher thermal conductivity and smaller form factor compared to conventional heat spreaders. This work aims to investigate the potential miniaturization of these devices, preliminary to integration on the backside of mobile device chips, located as close as possible to hotspots. While detailed numerical models of vapor chamber operation are developed, an easy modeling with low computational cost is needed for an effective parametric study.  Based on the study of the operating limits, this paper shows the thinning potential of a water filled micropillar for a device operating below 10 W and identify the corresponding vapour core height, and wick thickness.

Research and optimization design of limited internal cavity of ultra-thin vapor chamber

2020 ◽  
Vol 148 ◽  
pp. 119101 ◽  
Author(s):  
Guangwen Huang ◽  
Wangyu Liu ◽  
Yuanqiang Luo ◽  
Tao Deng ◽  
Yong Li ◽  
...  
Keyword(s):  
Optimization Design ◽  
Internal Cavity ◽  
Vapor Chamber

scholarly journals Multiscale Micro/Nanostructured Heat Spreaders for Thermal Management of Power Electronics

2021 ◽  
Author(s):  
Huihe Qiu ◽  
Yinchuang Yang
Keyword(s):  
Thermal Performance ◽  
Superhydrophobic Surface ◽  
Evaporation Rate ◽  
Nucleate Boiling ◽  
Nanostructured Surface ◽  
Vapor Chamber ◽  
Nanostructured Surfaces ◽  
Patterned Surface ◽  
Heat Spreaders ◽  
Surface Modification Techniques

In this chapter, we describe surface modification techniques for enhancing heat/mass transfer and evaporation on heated surfaces. The effect of asymmetrical structure in designing a vapor chamber, patterned with multiscale micro/nanostructured surfaces will be introduced. The wettability patterned surface and its mechanism for improving the evaporation rate of a droplet and the thermal performance of nucleate boiling are discussed. An ultrathin vapor chamber based on a wettability patterned evaporator is introduced as a case for the application of the wettability pattern. Besides, modifying the surface with nanostructure to form a multiscale micro/nanostructured surface or superhydrophobic surface also enhances the phase change. Several types of heat spreaders are proposed to investigate the effects of multiscale micro/nanostructured surface and nanostructured superhydrophobic condenser on the thermal performance of the heat spreaders, respectively. The effects of multiscale micro/nanostructured evaporator surfaces with wettability patterns will be analyzed and experimental data will be presented.

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