scholarly journals Impact of thermal oxidation on the electrical transport and chemical & electronic structure of the GaN film grown on Si and sapphire substrates

2021 ◽  
Vol 5 ◽  
pp. 100106
Author(s):  
Shubhendra Kumar Jain ◽  
Pratibha Goel ◽  
Urvashi Varshney ◽  
Tushar Garg ◽  
Neha Aggarwal ◽  
...  
1999 ◽  
Vol 5 (S2) ◽  
pp. 120-121
Author(s):  
D. A. Muller ◽  
T. Sorsch ◽  
S. Moccio ◽  
F. H. Baumann ◽  
K. Evans-Lutterodt ◽  
...  

The transistors planned for commercial use ten years from now in many electronic devices will have gate lengths shorter than 130 atoms, gate oxides thinner than 1.2 nm of SiO2 and clock speeds in excess of 10 GHz. It is now technologically possible to produce such transistors with gate oxides only 5 silicon atoms thick[l]. Since at least two of those 5 atoms are not in a local environment similar to either bulk Si or bulk SiO2, the properties of the interface are responsible for a significant fraction of the “bulk” properties of the gate oxide. However the physical (and especially their electrical) properties of the interfacial atoms are very different from .bulk Si or bulk SiO2. Further, roughness on an atomic scale can alter the leakage current by orders of magnitude.In our studies of such devices, we found that thermal oxidation tends to produce Si/SiO2 interfaces with 0.1-0.2 nm rms roughness.


2013 ◽  
Vol 114 (7) ◽  
pp. 073704 ◽  
Author(s):  
Vinod Kumar ◽  
Rajesh Kumar ◽  
D. K. Shukla ◽  
Sanjeev Gautam ◽  
Keun Hwa Chae ◽  
...  

1998 ◽  
Vol 537 ◽  
Author(s):  
Zhonghai Yu ◽  
M.A.L. Johnson ◽  
J.D. Brown ◽  
N.A. El-Masry ◽  
J. F. Muth ◽  
...  

AbstractThe epitaxial lateral overgrowth (ELO) process for GaN has been studied using SiC and sapphire substrates. Both MBE and MOVPE growth processes were employed in the study. The use of SiO2 versus SiNx insulator stripes was investigated using window/stripe widths ranging from 2 μm/4 μm to 3 μm/15 μm. GaN film depositions were completed at temperatures ranging from 800°C to 1120°C. Characterization experiments included RHEED, TEM, SEM and cathodolumenescence studies. The MBE growth experiments produced polycrystalline GaN over the insulator stripes even at deposition temperatures as high as 990°C. In contrast, MOVPE growth produced single-crystal GaN stripes with no observable threading dislocations.


2007 ◽  
Vol 19 (47) ◽  
pp. 476210 ◽  
Author(s):  
Shalendra Kumar ◽  
Alimuddin ◽  
Ravi Kumar ◽  
P Thakur ◽  
K H Chae ◽  
...  

2000 ◽  
Vol 221 (1-4) ◽  
pp. 311-315 ◽  
Author(s):  
. Sugianto ◽  
R.A. Sani ◽  
P. Arifin ◽  
M. Budiman ◽  
M. Barmawi
Keyword(s):  

1995 ◽  
Vol 395 ◽  
Author(s):  
A.E. Wickenden ◽  
D.K. Gaskill ◽  
D.D. Koleske ◽  
K. Doverspike ◽  
D.S. Simons ◽  
...  

ABSTRACTA comparison between 300 K electron transport data for state-of-the-art wurtzite GaN grown on sapphire substrates and corresponding theoretical calculations shows a large difference, with experimental mobility less than the predicted mobility for a given carrier concentration. The comparison seems to imply that GaN films are greatly compensated, but the discrepancy may also be due to the poorly known values of the materials parameters used in the calculations. In this work, recent analysis of transport and SIMS measurements on silicon-doped GaN films are shown to imply that the compensation, NA/ND, is less than 0.3. In addition, the determination of an activation energy of 34 meV in a GaN film doped to a level of 6×1016 cm−3 suggests either that a second, native donor exists in the doped films at a level of between 6×1017 cm−3 and 1×1017 cm−3, or that the activation energy of Si in GaN is dependent on the concentration, being influenced by impurity banding or some other physical effect. GaN films grown without silicon doping are highly resistive.


2004 ◽  
Vol 831 ◽  
Author(s):  
M. E. Twigg ◽  
N. D. Bassim ◽  
C. R. Eddy ◽  
R. L. Henry ◽  
R. T. Holm ◽  
...  

ABSTRACTIn order to reduce vertical leakage in III-nitride detectors, we have grown a patterned array of hexagonal GaN columns on masked heteroepitaxial GaN template layers using a-plane sapphire substrates. In addition to eliminating cracking, we have found that for GaN columns tens of microns in diameter and several microns high, the dislocation density is also significantly reduced. We have developed a simple closed-form analytical model for predicting the critical column height for the onset of the reduction in the dislocation density. Among the predictions of this model is that the critical column height for the onset of dislocation density reduction is proportional to the product of column width and the grain size of the GaN film.


Author(s):  
Б.Е. Умирзаков ◽  
С.Б. Донаев ◽  
Р.М. Ёркулов ◽  
Р.Х. Ашуров ◽  
В.М. Ротштейн

In this work, the composition, morphology, and electronic structure of SiO2 nanofilms of various thicknesses, created by thermal oxidation on the Si(111) surface, have been studied. It is shown that up to a thickness of 30–40 Å, the film has an island character. At d ≥ 60 Å, a homogeneous continuously film of SiO2 is formed and the stoichiometric surface roughness of which does not exceed 1.5 - 2 nm. Regardless of the film thickness of the SiO2 appreciable interdiffusion of atoms at the interface SiO2-Si not observed. The regularities of the change in the composition, the degree of surface coverage, and the energy of plasma oscillations with a change in the thickness of the SiO2/Si(111) films in the range from 20 to 120 Å have been determined.


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