Temperature dependence of the sticking coefficient in atomic layer deposition

2010 ◽  
Vol 256 (12) ◽  
pp. 3778-3782 ◽  
Author(s):  
M. Rose ◽  
J.W. Bartha ◽  
I. Endler
2014 ◽  
Vol 211 (9) ◽  
pp. 2166-2171 ◽  
Author(s):  
Woochool Jang ◽  
Heeyoung Jeon ◽  
Chunho Kang ◽  
Hyoseok Song ◽  
Jingyu Park ◽  
...  

2003 ◽  
Vol 765 ◽  
Author(s):  
Xinye Liu ◽  
Sasangan Ramanathan ◽  
Thomas E. Seidel

AbstractHafnium oxide (HfO2) thin films were synthesized from tetrakis(dimethylamino) hafnium (TDMAH) and ozone (O3) by atomic layer deposition (ALD) on 200 mm silicon wafers. Gradual saturation was observed for TDMAH exposure pulse. However O3 showed better saturation behavior for O3exposure. Yet, 100% step coverage was achieved for ~100nm trenches with aspect ratio of 35. Temperature dependence of the deposition rate was studied at susceptor temperature from 160°C to 420°C. The lowest deposition rate was observed at 320°C. Mercury probe measurements indicated the dielectric constant increased from 16 to 20 as susceptor temperature increased from 200°C to 320°C. Selected comparisons with tetrakis (ethylmethylamino) hafnium (TEMAH) were also made.


2012 ◽  
Vol 520 (11) ◽  
pp. 3994-3998 ◽  
Author(s):  
Akiko Kobayashi ◽  
Naoto Tsuji ◽  
Atsuki Fukazawa ◽  
Nobuyoshi Kobayashi

2020 ◽  
Vol 536 ◽  
pp. 125568 ◽  
Author(s):  
Justin C. Goodrich ◽  
Thomas G. Farinha ◽  
Ling Ju ◽  
Alexandra J. Howzen ◽  
Animesh Kundu ◽  
...  

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