Two-dimensional ordered growth of InAs nanowires assisted by randomly deposited silver nanoparticles on a topographically modified surface by a focused ion beam

2019 ◽  
Vol 493 ◽  
pp. 271-278
Author(s):  
R. Ribeiro-Andrade ◽  
T.L. Vasconcelos ◽  
R.M.S. Kawabata ◽  
M.P. Pires ◽  
P.L. Souza ◽  
...  
2008 ◽  
Vol 104 (5) ◽  
pp. 053907 ◽  
Author(s):  
F. Albertini ◽  
L. Nasi ◽  
F. Casoli ◽  
S. Fabbrici ◽  
P. Luches ◽  
...  

2005 ◽  
Vol 78-79 ◽  
pp. 11-15 ◽  
Author(s):  
S. Cabrini ◽  
A. Carpentiero ◽  
R. Kumar ◽  
L. Businaro ◽  
P. Candeloro ◽  
...  

1992 ◽  
Vol 283 ◽  
Author(s):  
M. M. Faye ◽  
L. Laanab ◽  
J. Beauvillain ◽  
A. Claverie ◽  
C. Vieu ◽  
...  

ABSTRACTA general method is presented for calculating the spatial distribution of damage generated by localized implantation in semiconductors. Implantation through masks and focused ion beam implantation in GaAs are simulated and compared to cross-sectional transmission electron microscopy observations. An excellent agreement is obtained when a depth-dependent lateral straggle is considered. Arbitrarily shaped mask edges and different compositions for the mask and the substrate are included in the calculations as well as realistic current profiles of the ion spot in the case of focused ion beam implantations. Simulations and experiments clearly demonstrate the potential application of localized implantations to fabricate lateral quantum nanostructures.


PLoS ONE ◽  
2014 ◽  
Vol 9 (5) ◽  
pp. e96078 ◽  
Author(s):  
César Pascual García ◽  
Alina D. Burchardt ◽  
Raquel N. Carvalho ◽  
Douglas Gilliland ◽  
Diana C. António ◽  
...  

2004 ◽  
Vol 03 (01n02) ◽  
pp. 81-85
Author(s):  
E. Yu. GAVRILIN ◽  
Yu. B. GORBATOV ◽  
V. V. STARKOV ◽  
A. F. VYATKIN

Photonic crystals are the very promising novel materials for micro- and nanophotonics for visible region. To produce photonic crystals for this region of light, artificial structures with characteristic sizes less than 1 μm have to be manufactured. Electrochemical deep anodic etching and plasma etching techniques is normally used to produce such structures in silicon wafers. However, standard way of deep anodic etching realization is not suitable for sub-micrometer porous silicon formation. In the present work combination of the deep anodic etching and focused ion beam techniques is used to produce ordered structure of macropores in silicon.


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