Radical flux control in reactive ion beam etching (RIBE) by dual exhaust system

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Author(s):  
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Yun Jong Jang ◽  
Ye Eun Kim ◽  
Hong Seong Gil ◽  
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...  
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Vol 12 (2-3) ◽  
pp. 229-233 ◽  
Author(s):  
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Vol 22 (Part 2, No. 4) ◽  
pp. L219-L220 ◽  
Author(s):  
Hiroaki Aritome ◽  
Toshiya Yamato ◽  
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Susumu Namba

1982 ◽  
Vol 21 (Part 2, No. 1) ◽  
pp. L4-L6 ◽  
Author(s):  
Seitaro Matsuo ◽  
Yoshio Adachi

RSC Advances ◽  
2018 ◽  
Vol 8 (57) ◽  
pp. 32417-32422
Author(s):  
Laixi Sun ◽  
Ting Shao ◽  
Jianfeng Xu ◽  
Xiangdong Zhou ◽  
Xin Ye ◽  
...  

RIBE and DCE techniques can be combined to tracelessly mitigate laser damage precursors on a fused silica surface.


Author(s):  
A. A. Akhsakhalyan ◽  
A. D. Akhsakhalyan ◽  
Yu. A. Vainer ◽  
D. G. Volgunov ◽  
M. V. Zorina ◽  
...  

1997 ◽  
Vol 468 ◽  
Author(s):  
Jae-Won Lee ◽  
Hyong-Soo Park ◽  
Yong-Jo Park ◽  
Myong-Cheol Yoo ◽  
Tae-Il Kim ◽  
...  

ABSTRACTDry etching characteristics of GaN using reactive ion beam etching (RIBE) were studied. Etching profile, etching rate and etching selectivity to a photoresist (PR) mask were investigated as a function of various etching parameters. Characteristics of chemically assisted reactive ion beam etching (CARIBE) and RIBE were compared at varied mixtures of CH4 and Cl2. A highly anisotropie etching profile with a smooth surface was obtained for tilted RIBE with Ch at room temperature. Etching selectivity to a PR was dramatically improved in RIBE and CARIBE when a volume fraction of CH4 to the mixture of CH4 and Ch was larger than 0.83.


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