Preparation, microstructure and properties of three-dimensional carbon/carbon composites with high thermal conductivity

Carbon ◽  
2021 ◽  
Vol 174 ◽  
pp. 758-759
Author(s):  
Bao-liu Li ◽  
Jian-guang Guo ◽  
Bing Xu ◽  
Hui-tao Xu ◽  
Zhi-jun Dong ◽  
...  
2020 ◽  
Vol 35 (5) ◽  
pp. 567-575
Author(s):  
Bao-liu Li ◽  
Jian-guang Guo ◽  
Bing Xun ◽  
Hui-tao Xu ◽  
Zhi-jun Dong ◽  
...  

2018 ◽  
Vol 140 (5) ◽  
Author(s):  
X. Bai ◽  
C. Hasan ◽  
M. Mobedi ◽  
A. Nakayama

A general expression has been obtained to estimate thermal conductivities of both stochastic and periodic structures with high-solid thermal conductivity. An air layer partially occupied by slanted circular rods of high-thermal conductivity was considered to derive the general expression. The thermal conductivity based on this general expression was compared against that obtained from detailed three-dimensional numerical calculations. A good agreement between two sets of results substantiates the validity of the general expression for evaluating the stagnant thermal conductivity of the periodic structures. Subsequently, this expression was averaged over a hemispherical solid angle to estimate the stagnant thermal conductivity for stochastic structures such as a metal foam. The resulting expression was found identical to the one obtained by Hsu et al., Krishnan et al., and Yang and Nakayama. Thus, the general expression can be used for both stochastic and periodic structures.


2019 ◽  
Vol 9 (1) ◽  
Author(s):  
Kai-Han Su ◽  
Cherng-Yuh Su ◽  
Cheng-Ta Cho ◽  
Chung-Hsuan Lin ◽  
Guan-Fu Jhou ◽  
...  

Abstract The issue of electronic heat dissipation has received much attention in recent times and has become one of the key factors in electronic components such as circuit boards. Therefore, designing of materials with good thermal conductivity is vital. In this work, a thermally conductive SBP/PU composite was prepared wherein the spherical h-BN@PMMA (SBP) composite powders were dispersed in the polyurethane (PU) matrix. The thermal conductivity of SBP was found to be significantly higher than that of the pure h-BN/PU composite at the same h-BN filler loading. The SBP/PU composite can reach a high thermal conductivity of 7.3 Wm−1 K−1 which is twice as high as that of pure h-BN/PU composite without surface treatment in the same condition. This enhancement in the property can be attributed to the uniform dispersion of SBP in the PU polymer matrix that leads to a three-dimensional continuous heat conduction thereby improving the heat diffusion of the entire composite. Hence, we provide a valuable method for preparing a 3-dimensional heat flow path in polyurethane composite, leading to a high thermal conductivity with a small amount of filler.


2018 ◽  
Vol 6 (36) ◽  
pp. 17540-17547 ◽  
Author(s):  
Zhilin Tian ◽  
Jiajia Sun ◽  
Shaogang Wang ◽  
Xiaoliang Zeng ◽  
Shuang Zhou ◽  
...  

A high thermal conductivity boron nitride based thermal interface material was developed by a foam-templated method.


2020 ◽  
Author(s):  
Xia Fang ◽  
Lei Jiang ◽  
Limei Pan ◽  
Shuang Yin ◽  
Tai Qiu ◽  
...  

Abstract High-thermally conductive AlN-based microwave attenuating composite ceramics with spherical graphite (SG) as the attenuating agent were fabricated through hot-pressing sintering. The SG maintains its three-dimensional morphology within the sintered bodies, which considerably impedes the sintering of the composites to some extent but slightly influences on the growth of AlN grains. The addition of SG reduces the strength of the composites, but provides a moderate toughening effect at the optimal addition amount (3.8 MPa·m1/2 at 4 wt% SG). Benefiting from the low anisotropy, high thermal conductivity, and the three-dimensional morphology of SG, the composites exhibit a relatively higher thermal conductivity (76.82 W·m-1·k-1 at 10 wt% SG) compared with composites added with non-spherical attenuating agent. The dielectric constant and loss (8.2–12.4 GHz) increase remarkably as the amount of SG added increases up to 8 wt%, revealing that the incorporation of SG improves the dielectric property of the composite. The composite with 7 wt% SG exhibits the best absorption performance with a minimum reflection loss of -14 dB at 12.4 GHz and an effective absorbing bandwidth of 0.87 GHz. The excellent overall properties of the SG/AlN microwave attenuating composites render them as a promising material for various applications. Moreover, SG has a great potential as an attenuating agent for microwave attenuating composites due to its strong attenuation upon integration, high thermal conductivity, and low anisotropy.


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