Bond behavior of CFRP-concrete bonding interface considering degradation of epoxy primer under wet-dry cycles

2021 ◽  
Vol 292 ◽  
pp. 123286
Author(s):  
Erjiang Cui ◽  
Shaofei Jiang ◽  
Juan Wang ◽  
Xinggui Zeng
Keyword(s):  
Bonding Interface ◽  
Bond Behavior ◽  
Epoxy Primer

A Fracture Mechanics Based Parametric Study of the Copper-to-Copper Direct Thermo-Compression Bonded Interface Using Finite Element Method

2013 ◽  
Author(s):  
Ah-Young Park ◽  
Satish Chaparala ◽  
Seungbae Park
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Parametric Study ◽  
Initial Crack ◽  
Bonding Interface ◽  
Interface Condition ◽  
Large Temperature ◽  
Bonded Interface ◽  
The Impact ◽  
Element Method

Through-silicon via (TSV) technology is expected to overcome the limitations of I/O density and helps in enhancing system performance of conventional flip chip packages. One of the challenges for producing reliable TSV packages is the stacking and joining of thin wafers or dies. In the case of the conventional solder interconnections, many reliability issues arise at the interface between solder and copper bump. As an alternative solution, Cu-Cu direct thermo-compression bonding (CuDB) is a possible option to enable three-dimension (3D) package integration. CuDB has several advantages over the solder based micro bump joining, such as reduction in soldering process steps, enabling higher interconnect density, enhanced thermal conductivity and decreased concerns about intermetallic compounds (IMC) formation. Critical issue of CuDB is bonding interface condition. After the bonding process, Cu-Cu direct bonding interface is obtained. However, several researchers have reported small voids at the bonded interface. These defects can act as an initial crack which may lead to eventual fracture of the interface. The fracture could happen due to the thermal expansion coefficient (CTE) mismatch between the substrate and the chip during the postbonding process, board level reflow or thermal cycling with large temperature changes. In this study, a quantitative assessment of the energy release rate has been made at the CuDB interface during temperature change finite element method (FEM). A parametric study is conducted to analyze the impact of the initial crack location and the material properties of surrounding materials. Finally, design recommendations are provided to minimize the probability of interfacial delamination in CuDB.

scholarly journals Interfacial Morphology and Bonding Mechanism of Explosive Weld Joints

2021 ◽  
Vol 34 (1) ◽  
Author(s):  
Tingting Zhang ◽  
Wenxian Wang ◽  
Zhifeng Yan ◽  
Jie Zhang
Keyword(s):  
Laminated Composite ◽  
Base Plate ◽  
Sine Wave ◽  
Laminated Plates ◽  
Bonding Interface ◽  
Interfacial Structure ◽  
Bonding Mechanism ◽  
Critical Material ◽  
Interfacial Morphology ◽  
Az31b Alloy

AbstractInterfacial structure greatly affects the mechanical properties of laminated plates. However, the critical material properties that impact the interfacial morphology, appearance, and associated bonding mechanism of explosive welded plates are still unknown. In this paper, the same base plate (AZ31B alloy) and different flyer metals (aluminum alloy, copper, and stainless steel) were used to investigate interfacial morphology and structure. SEM and TEM results showed that typical sine wave, wave-like, and half-wave-like interfaces were found at the bonding interfaces of Al/Mg, Cu/Mg and SS/Mg clad plates, respectively. The different interfacial morphologies were mainly due to the differences in hardness and yield strength between the flyer and base metals. The results of the microstructural distribution at the bonding interface indicated metallurgical bonding, instead of the commonly believed solid-state bonding, in the explosive welded clad plate. In addition, the shear strength of the bonding interface of the explosive welded Al/Mg, Cu/Mg and SS/Mg clad plates can reach up to 201.2 MPa, 147.8 MPa, and 128.4 MPa, respectively. The proposed research provides the design basis for laminated composite metal plates fabrication by explosive welding technology.

scholarly journals Experimental Characterization of the FRCM-Concrete Interface Bond Behavior Assisted by Digital Image Correlation

Sensors ◽  
2021 ◽  
Vol 21 (4) ◽  
pp. 1154
Author(s):  
Dario De Domenico ◽  
Antonino Quattrocchi ◽  
Damiano Alizzio ◽  
Roberto Montanini ◽  
Santi Urso ◽  
...  
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Mechanical Tests ◽  
Image Correlation ◽  
Front Face ◽  
Full Field ◽  
Bond Behavior ◽  
Externally Bonded ◽  
Strengthening Technique ◽  
Concrete Interface

Digital Image Correlation (DIC) provides measurements without disturbing the specimen, which is a major advantage over contact methods. Additionally, DIC techniques provide full-field maps of response quantities like strains and displacements, unlike traditional methods that are limited to a local investigation. In this work, an experimental application of DIC is presented to investigate a problem of relevant interest in the civil engineering field, namely the interface behavior between externally bonded fabric reinforced cementitious mortar (FRCM) sheets and concrete substrate. This represents a widespread strengthening technique of existing reinforced concrete structures, but its effectiveness is strongly related to the bond behavior between composite fabric and underlying concrete. To investigate this phenomenon, a set of notched concrete beams are realized, reinforced with FRCM sheets on the bottom face, subsequently cured in different environmental conditions (humidity and temperature) and finally tested up to failure under three-point bending. Mechanical tests are carried out vis-à-vis DIC measurements using two distinct cameras simultaneously, one focused on the concrete front face and another focused on the FRCM-concrete interface. This experimental setup makes it possible to interpret the mechanical behavior and failure mode of the specimens not only from a traditional macroscopic viewpoint but also under a local perspective concerning the evolution of the strain distribution at the FRCM-concrete interface obtained by DIC in the pre- and postcracking phase.

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