Comparative study on interfacial microstructure and cutting performance of tunnel furnace and vacuum furnace brazed diamond core-drill

2018 ◽  
Vol 89 ◽  
pp. 132-139 ◽  
Author(s):  
Bao-Jun Sun ◽  
Bing Xiao
Keyword(s):  
Comparative Study ◽  
Interfacial Microstructure ◽  
Cutting Performance ◽  
Vacuum Furnace ◽  
Tunnel Furnace

Interfacial Microstructure Investigation of Diffusion Bonded New Ni-Cr-W Superalloy Using Cu Interlayer

2013 ◽  
Vol 634-638 ◽  
pp. 1844-1849 ◽  
Author(s):  
Rui Hu ◽  
Xian Lin Meng ◽  
Bin Tang ◽  
Chuan Yun Wang ◽  
Hong Chao Kou ◽  
...  
Keyword(s):  
Solid State ◽  
Bonding Temperature ◽  
Interfacial Microstructure ◽  
Vacuum Furnace ◽  
Solid State Diffusion ◽  
Diffusion Behavior ◽  
State Diffusion ◽  
Different Temperatures ◽  
Cu Foil ◽  
Cu Interlayer

The solid-state diffusion bonding processes were successfully carried out to join new Ni-Cr-W superalloys at different temperatures (850°C-950°C), under pressures of 20MPa and holding 45min in a vacuum furnace by taking Cu foil as interlayer. The influence of bonding temperature on the microstructural evolution and the diffusion behavior across the joints was investigated in details. Results indicate that the Ni-Cu solid solutions in the interface lead to a sound bonding interface without any void or impurity. As the temperature increases, the reaction layers become thicker due to the decrease of M23C6 precipitation in the grain boundaries and the rise of atoms diffusion capability. Furthermore, hardness measuremental result also reveals that the increased thickness of reaction layers cannot improve the microhardness of bonding interfaces apparently.

Microstructure in the Interface between CVD Diamond Thick Film and a Ag-Cu-Ti Braze Alloy

2007 ◽  
Vol 353-358 ◽  
pp. 1999-2002 ◽  
Author(s):  
Feng Lian Sun ◽  
Feng Gu ◽  
Zhi Li Zhao ◽  
Heng Ze Xian
Keyword(s):  
Thick Film ◽  
Filler Metal ◽  
Heating Temperature ◽  
Special Section ◽  
Braze Alloy ◽  
Processing Condition ◽  
Cvd Diamond ◽  
Interfacial Microstructure ◽  
Vacuum Furnace ◽  
Orientation Relationships

CVD diamond thick film was brazed to cemmented carbide using a Ag-Cu-Ti active filler metal. The brazing process was performed in a vacuum furnace under different processing condition. The interfacial microstructure and characterization between diamond and Ag-Cu-Ti filler metal were studied by SEM, EPMA and EDX. The morphology and distribution of new compound are shown for the first time (Figs). Results illustrate that a small amount of new compound TiC, TiCu compound exist in the interface. TiC layer exists in the interface and it's thickness is variational with the varying of processing condition such as peak heating temperature, keeping time and so on. New compound TiC accretes with the surface atoms of diamond in a special section, and particular orientation relationships are occasionally observed by examining the fracture section. TiCu layer near TiC exists in the interface. It is worth notice that too much TiC and TiCu in interface could weaken join strength because TiC and TiCu are brittle.

A comparative study on cutting performance of TiN-coated tungsten carbide cutting tool with a cobalt interlayer

2005 ◽  
Vol 200 (5-6) ◽  
pp. 1933-1938 ◽  
Author(s):  
Dong Hee Kwon ◽  
Myung Chang Kang ◽  
Jeong Suk Kim ◽  
Jung Tae Ok ◽  
Kwang Ho Kim
Keyword(s):  
Comparative Study ◽  
Tungsten Carbide ◽  
Cutting Tool ◽  
Cutting Performance ◽  
Carbide Cutting Tool
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