scholarly journals Research on the bonding properties of vitrified bonds with porous diamonds and the grinding performance of porous diamond abrasive tools

2022 ◽  
pp. 108841
Author(s):  
Jian-wei Li ◽  
Wen-jun Fang ◽  
Long Wan ◽  
Xiao-pan Liu ◽  
Wei-da Hu ◽  
...  
Keyword(s):  
Grinding Performance ◽  
Bonding Properties ◽  
Abrasive Tools ◽  
Diamond Abrasive

scholarly journals Research on The Bonding Properties of Vitrified Bonds With Porous Diamonds and The Grinding Performance of Porous Diamond Abrasive Tools

2021 ◽  
Author(s):  
Jianwei LI ◽  
Wenjun FANG ◽  
Long WAN ◽  
Xiaopan LIU ◽  
Weida HU ◽  
...  
Keyword(s):  
Wafer Surface ◽  
Processing Efficiency ◽  
Abrasive Particles ◽  
Bonding Properties ◽  
New Type ◽  
Vitrified Bond ◽  
Abrasive Tools ◽  
Grinding Efficiency ◽  
Diamond Abrasive

Abstract Ordinary diamond presents the disadvantages of poor self-sharpening and concentrated grinding stress when it is used as an abrasive. Moreover, this kind of diamond cannot be well wetted by the vitrified bond, resulting in a lower holding force of the binder to the abrasives (i.e., the diamond is easy to detach from the binder matrix during grinding). These comprehensive factors not only reduce the surface quality of the processed workpiece, but also hinder the processing efficiency. In order to solve these problems, a new type of porous diamond with high self-sharpening properties was prepared using a thermochemical corrosion method in this study. Our results showed a great improvement in pore volume and specific surface area of the porous diamond compared with ordinary diamond abrasive particles, and the holding force and wettability of vitrified bond to the porous diamond abrasive particles were also improved. Compared with ordinary diamond abrasive tools, porous diamond abrasive tools showed a 29.6% increase in grinding efficiency, a 15.5% decreased in grinding ratio, a 27.5% reduction in workpiece surface roughness, and the scratches on the silicon wafer surface were reduced and refined.

Fabrication and Application of Gel Forming Ultrafine Diamond Abrasive Tools

2021 ◽  
Vol 10 (6) ◽  
pp. 063009
Author(s):  
Kaiping Feng ◽  
Binghai Lyu ◽  
Tianchen Zhao ◽  
Zhaozhong Zhou
Keyword(s):  
Ultrafine Diamond ◽  
Abrasive Tools ◽  
Diamond Abrasive

Diamond Wheel Dressing: A Comprehensive Review

2017 ◽  
Vol 139 (12) ◽  
Author(s):  
Wenfeng Ding ◽  
Haonan Li ◽  
Liangchi Zhang ◽  
Jiuhua Xu ◽  
Yucan Fu ◽  
...  
Keyword(s):  
Electrical Discharge ◽  
Diamond Wheel ◽  
Grinding Wheels ◽  
Comprehensive Review ◽  
Laser Dressing ◽  
Critical Problems ◽  
The Common ◽  
Abrasive Tools ◽  
Electrical Discharge Dressing ◽  
Diamond Abrasive

This paper provides a comprehensive review on the dressing techniques of diamond grinding wheels. The common techniques with different tools were discussed in detail, which included the bonded SiC and diamond abrasive tools, loose abrasives, soft-elastic abrasive belts, and profiled diamond wheels. Meanwhile, laser dressing, electrical discharge dressing (EDD), and electrolytic in-process dressing (ELID) were also addressed. Some critical problems in the above dressing techniques were then analyzed and summarized for further investigation.

Fabrication of Ultra-Fine Diamond Abrasive Tools by Sol-Gel

2004 ◽  
Vol 471-472 ◽  
pp. 426-430 ◽  
Author(s):  
Juan Liu ◽  
Xi Peng Xu
Keyword(s):  
Experimental Study ◽  
Physical Properties ◽  
Sol Gel ◽  
Optical Microscope ◽  
Diamond Tools ◽  
Fine Diamond ◽  
Abrasive Tools ◽  
Grinding Machine ◽  
Surface Morphologies ◽  
Diamond Abrasive

In this paper, an experimental study was carried out to fabricate a new kind of ultra-fine diamond abrasive tools by means of sol-gel. The physical properties of the new diamond abrasive tools were evaluated in terms of the bulk density and hardness. The ultra-fine diamond tools were then used to polish granite on a vertical spindle grinding machine. SEM and optical microscope were applied to observe the surface morphologies of the diamond tools and granite. No obvious gathering of ultra-fine diamond grains were found in the new diamond abrasive tools, which exhibited a good wear-resistant ability in polishing. The granite surfaces polished by the new diamond tools were found to be basically smooth except few cracks originally existing in the granite.

Study on Grinding Performance of Soft Abrasive Wheel for Silicon Wafer

2009 ◽  
Vol 416 ◽  
pp. 529-534 ◽  
Author(s):  
Ren Ke Kang ◽  
Shang Gao ◽  
Zhu Ji Jin ◽  
Dong Ming Guo
Keyword(s):  
Silicon Wafer ◽  
Chemical Reaction ◽  
Removal Rate ◽  
Surface Damage ◽  
Amorphous Layer ◽  
Diamond Wheel ◽  
Wafer Surface ◽  
Abrasive Wheel ◽  
Grinding Performance ◽  
Diamond Abrasive

With the development of IC manufacturing technology, the machining precision and surface quality of silicon wafer are proposed much higher, but now the planarization techniques of silicon wafer using free abrasive and bonded abrasive have the disadvantage of poor profile accuracy, environmental pollution, deep damage layer, etc. A soft abrasive wheel combining chemical and medical effect was developed in this paper, it could get super smooth, low damage wafer surface by utilizing mechanical friction of abrasives and chemical reaction among abrasives, additives, silicon. A comparison experiment between #3000 soft abrasive wheel and #3000 diamond abrasive wheel was given to study on the grinding performance of soft abrasive wheel. The results showed that: wafer surface roughness ground by soft abrasive wheel was sub-nanometer and its sub-surface damage was only 0.01µm amorphous layer, which were much better than silicon wafer ground by diamond abrasive wheel, but material removal rate and grinding ratio of soft abrasive wheel were lower than diamond wheel. The wafer surface ground by soft abrasive wheel included Ce4+, Ce3+, Si4+, Ca2+ and Si, which indicated that the chemical reaction really occurred during grinding process.

scholarly journals DEVELOPMENT OF LOW-MELTING GLASSCERAMIC BONDS FOR HIGH RESOURCE DIAMOND-ABRASIVE TOOLS

2021 ◽  
pp. 103-112
Author(s):  
Olena Fedorenko ◽  
Larysa Yashchenko ◽  
Dmytro Fedorenko ◽  
Volodymyr Fedorovych ◽  
Oleksandr Koniev
Keyword(s):  
Service Life ◽  
Pore Structure ◽  
Glass Ceramic ◽  
Open Structure ◽  
Working Layer ◽  
High Resource ◽  
Large Pore ◽  
Abrasive Tools ◽  
Bearing Layer ◽  
Diamond Abrasive

Research is aimed at creating high-resource diamond-abrasive tools with a large-pore structure of the working layer, the use of which reduces the occurrence of grinding defects when processing materials sensitive to overheating. The formation of an open structure of the working layer ensures effective chip removal, which excludes a decrease in the сutting ability of the tool due to contamination with grinding sludge and creates favorable conditions for intensifying the processing of materials when using high-speed cutting modes. As part of the research, low-melting glass-ceramic binders for diamond-abrasive tools have been developed, which make it possible to increase the tool service life  due to the prevention of diamond grains premature destruction and the creation of a large-pore open structure of the working layer. Using a set of calculated data about the main characteristics of glass compositions by factor planning means, the dependences «composition - properties» were determined and the area of optimal compositions of glass-ceramic bonds was established, which ensure sintering of a diamond-containing composite at a temperature of 550–650 °C. The efficiency of the use of alumino-silicate microspheres of technogenic origin as a structure-forming filler providing the formation of a large-pore structure is shown. The features of the chemical and phase composition of the technogenic spheres recovered from the fly ash of the Krivoy Rog TPP have been determined. It has been established that when the diamond-bearing layer of the tool is sintered in the shell of the ash spheres, crystalline new formations with high hardness (hercynite, mullite, maghemite, spinel) are formed. Using ash spheres and developed low-melting binders, which include up to 30 mass. % of glass waste, the laboratory samples of diamond-containing composites with open porosity of 45-50% were made. Studies of their microstructure and morphological features made it possible to determine the pore size (130-200 μm) and establish that during grinding, partial destruction of ash spheres occurs with the formation of additional cutting elements, which increases the tool cutting ability. The research results indicate the advisability of using the proposed approach for selection of the diamond-ceramic composite components and the modes of heat treatment of the diamond-bearing layer when creating a tool. This approach will significantly expand the possibilities of manufacturing large-pore diamond-abrasive tools with a high service life at minimal material costs and will improve the processing of parts made of difficult-to-machine materials.

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