scholarly journals Thermoelectric Cooling Device Integrated with PCM Heat Storage for MS Patients

2014 ◽  
Vol 61 ◽  
pp. 2399-2402 ◽  
Author(s):  
X. Li ◽  
S. Mahmoud ◽  
R.K. Al-Dadah ◽  
A. Elsayed
2001 ◽  
Vol 691 ◽  
Author(s):  
Sangeeta Lal ◽  
Sim Loo ◽  
Duck-Young Chung ◽  
Theodora Kyratsi ◽  
Mercouri G. Kanatzidis ◽  
...  

ABSTRACTThe possibility of a prototype thermoelectric cooling device for operation near liquid nitrogen temperatures has been explored. In these devices, the figure of merit involves a combination of the properties of the two branches of the module. Here, we investigate the fabrication of a module with a new low temperature material, CsBi4Te6 (p-type), and the best known low temperature n-type materials Bi85Sb15. Transport measurements for each of these materials show high performance at low temperatures. Known values for the figure of merit Zmax of CsBi4Te6 is 3.5 × 10−3 K−1 at 225K and for Bi85Sb15 is 6.5 × 10−3 K−1 at 77K. At 100K these values drop to 2.0×10−3 K−1 for CsBi4Te6 and 6.0×10−3 K−1 for Bi85Sb15. Theoretical simulations based on these data show a cooling of δT = 12K at 100K, which is almost three times the efficiency of a Bi2Te3 module at that temperature. We present transport measurements of elements used in the fabrication of a low temperature thermoelectric module and properties of the resulting module.


Author(s):  
Ruzmetov Khujabek ◽  
Dushamov Mashhurbek ◽  
Sobirov Foziljon ◽  
Sultonmurotov Oybek

2012 ◽  
Vol 163 ◽  
pp. 226-232
Author(s):  
M.H. Hsueh

The research is presented a kind of cooling device for a vehicles brake cooling system, which comprises a thermoelectric cooling (TEC) chip and a heat exchange system. The disc-brake and drum-brake systems are discussed in the research. After inputting electric power, the TEC chip provides one cooling surface which is stick on the brake system and absorbs the heat from the brake pads or shoes. The other surface releases heat which is absorbed by a recycle water-cooling system to discharge the heat by water-cooled radiator to the surrounding. It decreased the working temperature of the brake system about 30% at most after using this cooling device and increased the braking force about 30% at least. There is a temperature control device for the device which can start the TEC chip when the temperature of the brake pads or shoes exceeded 50, which is the lowest temperature that the brake pads or shoes can maintain the most performance of the braking force. The device can efficiently keep the braking force when the driver uses the brake to reduce the vehicles speed for a long time and provide the safety for the driver.


Author(s):  
Zoe B Rosenberg ◽  
Nate C Weiner ◽  
Hasan Shahariar ◽  
Braden M Li ◽  
Jennifer L Peavey ◽  
...  

Abstract A flexible, soft thermoelectric cooling device is presented that shows potential for human cooling applications in wearable technologies and close-to-body applications. Current developments lack integration feasibility due to non-scalable assembly procedures and unsuitable materials for comfortable and durable integration into products. Our devices have been created and tested around the need to conform to the human body which we have quantified through the creation of a repeatable drape testing procedure, a metric used in the textile industry. Inspired by mass manufacturing constraints, our flexible thermoelectric devices are created using commercially available materials and scalable processing techniques. Thermoelectric legs are embedded in a foam substrate to provide flexibility, while Kirigami-inspired cuts are patterned on the foam to provide the drape necessary for mimicking the performance of textile and close to body materials. In total, nine different configurations, three different fill factors and three different Kirigami cut patterns were fabricated and inspected for thermal characterization, mechanical testing, flexibility and drape. Our studies show that adding Kirigami patterns can increase the durability of the device, improve the flexibility, decrease the drape coefficient, and have <1% of impact on cooling performance at higher fill factors (>1.5%), reaching temperature differences up to 4.39 ± 0.17°C between the hot and cold faces of the device. These thermoelectric cooling devices show great flexibility, durability, and cooling for integration into soft cooling products.


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