An analytical solution for steady state three dimensional thermoelasticity of functionally graded circular plates due to axisymmetric loads

2014 ◽  
Vol 47 ◽  
pp. 124-142 ◽  
Author(s):  
M. Jabbari ◽  
E. Shahryari ◽  
H. Haghighat ◽  
M.R. Eslami
Keyword(s):  
Steady State ◽  
Analytical Solution ◽  
Three Dimensional ◽  
Functionally Graded ◽  
Circular Plates

Experimental Measurements of Temperature Distribution in Three Dimensional Stacked Package

2007 ◽  
Author(s):  
Anand Desai ◽  
James Geer ◽  
Bahgat Sammakia
Keyword(s):  
Experimental Study ◽  
Heat Conduction ◽  
Steady State ◽  
Temperature Distribution ◽  
Numerical Model ◽  
Analytical Solution ◽  
Three Dimensional ◽  
Power Input ◽  
Experimental Measurements ◽  
Steady State Heat

This paper presents the results of an experimental study of steady state heat conduction in a three dimensional stack package. The temperatures are measured at different interfaces within the stacked package. Delphi devices are used in the experiment which enables controlled power input and surface temperature of the devices. The experiment is carried out for three different boundary conditions on the package. The power input in varied to study its effects. A numerical model is created to compare to the experimental results. The results are also compared with the analytical solution presented in Desai et al [5] and Geer et al [6]. The results indicate that the experimental, numerical and analytical solutions follow the same trend. The agreement between the experimental and numerical results improves when the lateral losses are taken into account.

A Parallel Domain Decomposition BEM Algorithm for Three-Dimensional Exponentially Graded Elasticity

2008 ◽  
Vol 75 (5) ◽  
Author(s):  
J. E. Ortiz ◽  
W. A. Shelton ◽  
V. Mantič ◽  
R. Criado ◽  
L. J. Gray ◽  
...  
Keyword(s):  
Analytical Solution ◽  
Domain Decomposition ◽  
Functionally Graded Material ◽  
Computational Cost ◽  
Three Dimensional ◽  
Boundary Integral ◽  
Functionally Graded ◽  
Graded Material ◽  
High Computational Cost ◽  
Exponentially Graded

A parallel domain decomposition boundary integral algorithm for three-dimensional exponentially graded elasticity has been developed. As this subdomain algorithm allows the grading direction to vary in the structure, geometries arising from practical functionally graded material applications can be handled. Moreover, the boundary integral algorithm scales well with the number of processors, also helping to alleviate the high computational cost of evaluating the Green’s functions. For axisymmetric plane strain states in a radially graded material, the numerical results for cylindrical geometries are in excellent agreement with the analytical solution deduced herein.

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