Steady state and transient thermal-hydraulic characterization of full-scale ITER divertor plasma facing components

2008 ◽  
Vol 83 (7-9) ◽  
pp. 1034-1037 ◽  
Author(s):  
A. Tincani ◽  
P.A. Di Maio ◽  
G. Dell’Orco ◽  
I. Ricapito ◽  
B. Riccardi ◽  
...  
2007 ◽  
Vol 4 (1) ◽  
pp. 23-30 ◽  
Author(s):  
Kimmo Kaija ◽  
Pekka Heino

This paper is a case study of the thermal behavior of a stacked multichip package (SMCP). The aim is to measure temperature responses when heat is dissipated on different dice and to characterize the behavior with a compact thermal model (CTM) that accurately models steady-state and transient responses with a simple thermal RC -network. The measured package consists of three stacked layers, where each layer has one thinned flip chip attached die on an aramid interposer. The package's thermal responses were measured with thermal test dice that contain heaters and temperature sensors. The package was modeled with a finite element method (FEM) and the simulated temperature responses showed reasonable agreement with measured data. The FE model was further used to provide reference thermal data under different boundary conditions for CTM synthesis. The obtained CTM models accurately the steady-state and transient behavior and can be used as simplified model of the measured SMCP for further thermal analysis.


Author(s):  
Julia T. Luck ◽  
C. W. Boggs ◽  
S. J. Pennycook

The use of cross-sectional Transmission Electron Microscopy (TEM) has become invaluable for the characterization of the near-surface regions of semiconductors following ion-implantation and/or transient thermal processing. A fast and reliable technique is required which produces a large thin region while preserving the original sample surface. New analytical techniques, particularly the direct imaging of dopant distributions, also require good thickness uniformity. Two methods of ion milling are commonly used, and are compared below. The older method involves milling with a single gun from each side in turn, whereas a newer method uses two guns to mill from both sides simultaneously.


2021 ◽  
Vol 235 ◽  
pp. 112101
Author(s):  
Johnny Estephan ◽  
Changda Feng ◽  
Arindam Gan Chowdhury ◽  
Mauricio Chavez ◽  
Appupillai Baskaran ◽  
...  

Author(s):  
Xiang Li ◽  
Liuniu Guo ◽  
Tianchen Lang ◽  
Daorong Lu ◽  
Khalil Alluhaybi ◽  
...  

Author(s):  
Tanya Liu ◽  
James W. Palko ◽  
Joseph S. Katz ◽  
Feng Zhou ◽  
Ercan M. Dede ◽  
...  

2004 ◽  
Vol 45 (1) ◽  
pp. 60-64 ◽  
Author(s):  
Yoshi Hirooka ◽  
Hoju Fukushima ◽  
Noriyasu Ohno ◽  
Shuichi Takamura ◽  
Masahiro Nishikawa

2015 ◽  
Vol 14 (5-6) ◽  
pp. 729-766 ◽  
Author(s):  
Franck Bertagnolio ◽  
Helge Aa. Madsen ◽  
Christian Bak ◽  
Niels Troldborg ◽  
Andreas Fischer

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