scholarly journals DEMO Breeding Blanket Helium Cooled First Wall design investigation to cope high heat loads

2019 ◽  
Vol 146 ◽  
pp. 514-517 ◽  
Author(s):  
Julien Aubert ◽  
Giacomo Aiello ◽  
Rémi Boullon ◽  
Francisco A. Hernández ◽  
Jean-Charles Jaboulay
Keyword(s):  
Author(s):  
B. P. d’Entremont ◽  
J. M. Ochterbeck

In this investigation, a Loop Heat Pipe (LHP) evaporator has been studied using a borescope inserted through the compensation chamber into the liquid core. This minimally intrusive technique allows liquid/vapor interactions to be observed throughout the liquid core and compensation chamber. A low conductivity ceramic was used for the wick and ammonia as the working fluid. Results indicate that buoyancy driven flows, both two-phase and single-phase, play essential roles in evacuating excess heat from the core, which explains the several differences in performance between horizontal and vertical orientations of the evaporator. This study also found no discernable effect of the pre-start fill level of the compensation chamber on thermal performance during startup at moderate and high heat loads.


2015 ◽  
Vol 463 ◽  
pp. 223-227 ◽  
Author(s):  
C. Li ◽  
H. Greuner ◽  
Y. Yuan ◽  
S.X. Zhao ◽  
G.N. Luo ◽  
...  

1986 ◽  
pp. 505-511
Author(s):  
Saburo TODA ◽  
Jiro KATAYAMA ◽  
Masahiro NISHIKAWA ◽  
Kenji WATANABE

1997 ◽  
pp. 511-514 ◽  
Author(s):  
Toshihisa Hatano ◽  
Kiyoshi Fukaya ◽  
Masayuki Dairaku ◽  
Toshimasa Kuroda ◽  
Hideyuki Takatsu

2020 ◽  
Vol 22 ◽  
pp. 100716 ◽  
Author(s):  
V. Shah ◽  
M.P.F.H.L. van Maris ◽  
J.A.W. van Dommelen ◽  
M.G.D. Geers

1998 ◽  
Vol 258-263 ◽  
pp. 252-257 ◽  
Author(s):  
R.G Castro ◽  
K.E Elliot ◽  
R.D Watson ◽  
D.L Youchison ◽  
K.T Slattery

Author(s):  
Randeep Singh ◽  
Aliakbar Akbarzadeh ◽  
Masataka Mochizuki ◽  
Thang Nguyen ◽  
Vijit Wuttijumnong

Loop heat pipe (LHP) is a very versatile heat transfer device that uses capillary forces developed in the wick structure and latent heat of evaporation of the working fluid to carry high heat loads over considerable distances. Robust behaviour and temperature control capabilities of this device has enable it to score an edge over the traditional heat pipes. In the past, LHPs has been invariably assessed for electronic cooling at large scale. As the size of the thermal footprint and available space is going down drastically, miniature size of the LHP has to be developed. In this paper, results of the investigation on the miniature LHP (mLHP) for thermal control of electronic devices with heat dissipation capacity of up to 70 W have been discussed. Copper mLHP with disk-shaped flat evaporator 30 mm in diameter and 10 mm thickness was developed. Flat evaporators are easy to attach to the heat source without any need of cylinder-plane-reducer saddle that creates additional thermal resistance in the case of cylindrical evaporators. Wick structure made from sintered nickel powder with pore size of 3–5 μm was able to provide adequate capillary forces for the continuos circulation of the working fluid, and successfully transport heat load at the required distance of 60 mm. Heat was transferred using 3 mm ID copper tube with vapour and liquid lines of 60 mm and 200 mm length respectively. mLHP showed very reliable start up at different heat loads and was able to achieve steady state without any symptoms of wick dry-out. Tests were conducted on the mLHP with evaporator and condenser at the same level. Total thermal resistance, R total of the mLHP came out to be in the range of 1–4°C/W. It is concluded from the outcomes of the investigation that mLHP with flat evaporator can be effectively used for the thermal control of the electronic equipments with restricted space and high heat flux chipsets.


Author(s):  
Ioanna Aslanidou ◽  
Budimir Rosic ◽  
Vasudevan Kanjirakkad ◽  
Sumiu Uchida

The remarkable developments in gas turbine materials and cooling technologies have allowed a steady increase in combustor outlet temperature and hence in gas turbine efficiency over the last half century. However, the efficiency benefits of higher gas temperature, even at the current levels, are significantly offset by the increased losses associated with the required cooling. Additionally, the advancements in gas turbine cooling technology have introduced considerable complexities into turbine design and manufacture. Therefore, a reduction in coolant requirements for the current gas temperature levels is one possible way for gas turbine designers to achieve even higher efficiency levels. The leading edges of the first turbine vane row are exposed to high heat loads. The high coolant requirements and geometry constraints limit the possible arrangement of the multiple rows of film cooling holes in the so called showerhead region. In the past, investigators have tested many different showerhead configurations, varying the number of rows, inclination angle and shape of the cooling holes. However the current leading edge cooling strategies using showerheads have not been shown to allow further increase in turbine temperature without excessive use of coolant air. Therefore new cooling strategies for the first vane have to be explored. In gas turbines with multiple combustor chambers around the annulus, the transition duct walls can be used to shield, i.e. to protect the first vane leading edges from the high heat loads. In this way the stagnation region at the leading edge and the shower-head of film cooling holes can be completely removed, resulting in a significant reduction in the total amount of cooling air that is otherwise required. By eliminating the showerhead the shielding concept significantly simplifies the design and lowers the manufacturing costs. This paper numerically analyses the potential of the leading edge shielding concept for cooling air reduction. The vane shape was modified to allow for the implementation of the concept and non-restrictive relative movement between the combustor and the vane. It has been demonstrated that the coolant flow that was originally used for cooling the combustor wall trailing edge and a fraction of the coolant air used for the vane showerhead cooling can be used to effectively cool both the suction and the pressure surfaces of the vane.


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