The use of a simplified analytical expression for metastable thermal stress analysis and its application to creep–fatigue damage of a 2.25Cr 1Mo thick walled component

2010 ◽  
Vol 32 (2) ◽  
pp. 368-375 ◽  
Author(s):  
Warwick M. Payten ◽  
Ken U. Snowden ◽  
Philip Bendeich
Keyword(s):  
Thermal Stress ◽  
Stress Analysis ◽  
Fatigue Damage ◽  
Thermal Stress Analysis ◽  
Analytical Expression ◽  
Creep Fatigue

Thermal stress analysis of a directionally solidified Al–1wt%Ni alloy casting

2010 ◽  
Vol 46 (10) ◽  
pp. 889-895 ◽  
Author(s):  
Moisés M. Pariona ◽  
Josuel K. Rugenski ◽  
Manuel V. Canté ◽  
José E. Spinelli ◽  
Amauri Garcia
Keyword(s):  
Thermal Stress ◽  
Stress Analysis ◽  
Directionally Solidified ◽  
Thermal Stress Analysis ◽  
Alloy Casting ◽  
Ni Alloy

Thermal stress analysis of a multichip package design

1989 ◽  
Vol 12 (4) ◽  
pp. 663-672 ◽  
Author(s):  
R. Darveaux ◽  
I. Turlik ◽  
L.-T. Hwang ◽  
A. Reisman
Keyword(s):  
Thermal Stress ◽  
Stress Analysis ◽  
Package Design ◽  
Thermal Stress Analysis
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