Numerical model for thin liquid film with evaporation and condensation on solid surfaces in systems with conjugated heat transfer

2013 ◽  
Vol 66 ◽  
pp. 382-395 ◽  
Author(s):  
P. Sosnowski ◽  
A. Petronio ◽  
V. Armenio
Keyword(s):  
Heat Transfer ◽  
Numerical Model ◽  
Liquid Film ◽  
Thin Liquid Film ◽  
Solid Surfaces ◽  
Evaporation And Condensation ◽  
Conjugated Heat Transfer

A molecular dynamics study of heat transfer over an ultra-thin liquid film with surfactant between solid surfaces

2019 ◽  
Vol 126 (18) ◽  
pp. 185302 ◽  
Author(s):  
Yuting Guo ◽  
Donatas Surblys ◽  
Yoshiaki Kawagoe ◽  
Hiroki Matsubara ◽  
Taku Ohara
Keyword(s):  
Heat Transfer ◽  
Molecular Dynamics ◽  
Liquid Film ◽  
Thin Liquid Film ◽  
Solid Surfaces

Numerical Investigation of EHD Conduction Pumping of Liquid Film With Phase-Change

2007 ◽  
Author(s):  
Miad Yazdani ◽  
Jamal Seyed-Yagoobi
Keyword(s):  
Heat Transfer ◽  
Liquid Film ◽  
Phase Change ◽  
Flow System ◽  
Thin Liquid Film ◽  
Finite Thickness ◽  
Constant Heat Flux ◽  
Two Dimensional ◽  
Enhanced Heat Transfer ◽  
Constant Heat

Electrohydrodynamic (EHD) conduction pumping is associated with the heterocharge layers of finite thickness in the vicinity of the electrodes, generated by the process of dissociation of the neutral electrolytic species and recombination of the generated ions. This paper numerically investigates the EHD conduction pumping of a thin liquid film in the presence of phase change. The flow system comprises a liquid film flowing over a two-dimensional flat plate while the vapor phase extended far beyond the interface to result in almost motionless vapor. The channel is separated into four different sections: the entrance, electrode, evaporation, and downstream sections. The entrance, electrode and downstream regions are adiabatic while a constant heat flux is applied in the evaporation side. The concept of EHD conduction pumping of liquid film in the presence of phase change is demonstrated in this paper. The enhanced heat transfer due to conduction pumping is evaluated.

Simultaneous measurement of dynamic force and spatial thin film thickness between deformable and solid surfaces by integrated thin liquid film force apparatus

Soft Matter ◽  
2016 ◽  
Vol 12 (44) ◽  
pp. 9105-9114 ◽  
Author(s):  
Xurui Zhang ◽  
Plamen Tchoukov ◽  
Rogerio Manica ◽  
Louxiang Wang ◽  
Qingxia Liu ◽  
...  
Keyword(s):  
Thin Film ◽  
Film Thickness ◽  
Liquid Film ◽  
Simultaneous Measurement ◽  
Thin Liquid Film ◽  
Solid Surfaces ◽  
Dynamic Force ◽  
Thin Film Thickness
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