Polishing of polycrystalline diamond by the technique of dynamic friction. Part 2: Material removal mechanism

2007 ◽  
Vol 47 (10) ◽  
pp. 1615-1624 ◽  
Author(s):  
Y. Chen ◽  
L.C. Zhang ◽  
J.A. Arsecularatne
Keyword(s):  
Material Removal ◽  
Polycrystalline Diamond ◽  
Dynamic Friction ◽  
Removal Mechanism ◽  
Material Removal Mechanism

Material Removal Mechanism in Dynamic Friction Polishing of Diamond

2003 ◽  
Vol 238-239 ◽  
pp. 235-240 ◽  
Author(s):  
Kiyoshi Suzuki ◽  
Manabu Iwai ◽  
Tetsutaro Uematsu ◽  
Nobuo Yasunaga
Keyword(s):  
Material Removal ◽  
Dynamic Friction ◽  
Removal Mechanism ◽  
Material Removal Mechanism

Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer

2004 ◽  
Vol 471-472 ◽  
pp. 26-31 ◽  
Author(s):  
Jian Xiu Su ◽  
Dong Ming Guo ◽  
Ren Ke Kang ◽  
Zhu Ji Jin ◽  
X.J. Li ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Chemical Mechanical Polishing ◽  
Material Removal ◽  
Mechanical Polishing ◽  
Wafer Surface ◽  
Removal Mechanism ◽  
Particle Movement ◽  
Material Removal Mechanism ◽  
The Relationship ◽  
Nonuniform Material

Chemical mechanical polishing (CMP) has already become a mainstream technology in global planarization of wafer, but the mechanism of nonuniform material removal has not been revealed. In this paper, the calculation of particle movement tracks on wafer surface was conducted by the motion relationship between the wafer and the polishing pad on a large-sized single head CMP machine. Based on the distribution of particle tracks on wafer surface, the model for the within-wafer-nonuniformity (WIWNU) of material removal was put forward. By the calculation and analysis, the relationship between the motion variables of the CMP machine and the WIWNU of material removal on wafer surface had been derived. This model can be used not only for predicting the WIWNU, but also for providing theoretical guide to the design of CMP equipment, selecting the motion variables of CMP and further understanding the material removal mechanism in wafer CMP.

Fundamental study on material removal mechanism in single-crystal germanium

2021 ◽  
pp. 103773
Author(s):  
Ruiwen Geng ◽  
Xiaojing Yang ◽  
Qiming Xie ◽  
Jianguo Xiao ◽  
Wanqing Zhang ◽  
...  
Keyword(s):  
Single Crystal ◽  
Material Removal ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Fundamental Study

Microgrinding of Nanostructured Carbide Coatings: Ground Surface and Subsurface Damage Observations

2006 ◽  
Vol 304-305 ◽  
pp. 276-280 ◽  
Author(s):  
Y.H. Ren ◽  
Zhi Xiong Zhou ◽  
Zhao Hui Deng
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Material Removal ◽  
Ground Surface ◽  
Subsurface Damage ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Carbide Coatings ◽  
Subsurface Layers ◽  
Scanning Electron

Surface microgrinding of the nanostructured WC/12Co coatings have been undertaken with diamond wheels under various conditions. Nondestructive and destructive approaches were utilized to assess damage in ground nanostructured coatings. Different surface and subsurface configurations were observed by scanning electron microscopy. This paper investigates the effects of microgrinding conditions on damage formation in the surface and subsurface layers of the ground nanostructured WC/12Co coatings. And the material-removal mechanism has been discussed.

A Discussion on Removal Mechanisms in Grinding Polycrystalline Diamond

2015 ◽  
Vol 138 (1) ◽  
Author(s):  
Florestan Schindler ◽  
Richard Brocker ◽  
Fritz Klocke ◽  
Patrick Mattfeld
Keyword(s):  
Material Removal ◽  
Polycrystalline Diamond ◽  
Material Removal Mechanism ◽  
Mesoscopic Scale ◽  
Tool Manufacture ◽  
Brittle Behavior ◽  
Process Characteristics ◽  
Chemical Effects ◽  
Removal Mechanisms ◽  
First Time

Polycrystalline diamond (PCD) grinding takes an important role in the field of tool manufacture. Regardless, there is still lack of process knowledge about the occurring material removal mechanisms in PCD grinding. In order to get a better understanding of the process characteristics, the surface integrity zone of PCD inserts has been analyzed in detail after grinding for the first time. The drawn conclusion questions solely ductile or brittle behavior as removal mechanisms. Both thermal and mechanical process loads during the grinding process lead to thermophysical and chemical effects on a micro- and mesoscopic-scale and might thus have a significant impact on the material removal mechanism.

The Research and Development on the Material Removal Mechanism of the Ultrasonic Cutting

2014 ◽  
Vol 1027 ◽  
pp. 40-43
Author(s):  
Yan Yan Lou ◽  
Yan Zhang ◽  
Ying Gao ◽  
Jia Chen Zhang ◽  
Yan Zhou Sun
Keyword(s):  
Material Removal ◽  
Development Trend ◽  
Ultrasonic Machining ◽  
Removal Mechanism ◽  
Rotary Ultrasonic Machining ◽  
Material Removal Mechanism ◽  
Material Removal Model ◽  
The Development Trend ◽  
Removal Model ◽  
Ultrasonic Cutting

Ultrasonic machining is an important part of modern processing technology which is adapt to all kinds of hard brittle materials processing. This paper reviews the latest progress of the material removal mechanism on one-dimensional ultrasonic machining, two-dimensional ultrasonic machining and rotary ultrasonic machining, and expounds the development trend of establishing the material removal model of the ultrasonic machining.

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