Brittle fracture induced by phase transformation of Ni-Cu-Sn intermetallic compounds in Sn-3Ag-0.5Cu/Ni solder joints under extreme temperature environment

Journal of Alloys and Compounds ◽

10.1016/j.jallcom.2018.10.394 ◽

2019 ◽

Vol 777 ◽

pp. 463-471 ◽

Author(s):

Ruyu Tian ◽

Chunjin Hang ◽

Yanhong Tian ◽

Jiayun Feng

Keyword(s):

Phase Transformation ◽

Brittle Fracture ◽

Intermetallic Compounds ◽

Solder Joints ◽

Extreme Temperature ◽

Temperature Environment

Download Full-text

Brittle fracture of Sn-37Pb solder joints induced by enhanced intermetallic compound growth under extreme temperature changes

Journal of Materials Processing Technology ◽

10.1016/j.jmatprotec.2019.01.006 ◽

2019 ◽

Vol 268 ◽

pp. 1-9 ◽

Author(s):

Ruyu Tian ◽

Chunjin Hang ◽

Yanhong Tian ◽

Jikai Xu

Keyword(s):

Intermetallic Compound ◽

Brittle Fracture ◽

Solder Joints ◽

Extreme Temperature ◽

Temperature Changes ◽

Intermetallic Compound Growth

Download Full-text

Brittle fracture of intermetallic compounds in SAC solder joints under high speed ball pull/pin pull and Charpy impact tests

2013 IEEE 63rd Electronic Components and Technology Conference ◽

10.1109/ectc.2013.6575739 ◽

2013 ◽

Author(s):

Chaoran Yang ◽

Guangsui Xu ◽

S. W. Ricky Lee ◽

Xinping Zhang

Keyword(s):

Brittle Fracture ◽

Intermetallic Compounds ◽

Solder Joints ◽

Charpy Impact ◽

Impact Tests ◽

Download Full-text

Microstructure evolution and mechanical property of Sn-37Pb and Sn-3.0Ag-0.5Cu BGA solder joints under extreme temperature environment

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046497 ◽

2017 ◽

Author(s):

Ruyu Tian ◽

Chunjin Hang ◽

Yanhong Tian ◽

Liyou Zhao

Keyword(s):

Mechanical Property ◽

Microstructure Evolution ◽

Solder Joints ◽

Extreme Temperature ◽

Temperature Environment

Download Full-text

Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock

Materials Science and Engineering A ◽

10.1016/j.msea.2017.10.007 ◽

2018 ◽

Vol 709 ◽

pp. 125-133 ◽

Author(s):

Ruyu Tian ◽

Chunjin Hang ◽

Yanhong Tian ◽

Liyou Zhao

Keyword(s):

Thermal Shock ◽

Intermetallic Compounds ◽

Solder Joints ◽

Extreme Temperature ◽

Growth Behavior ◽

Early Formation ◽

Formation Of Cracks

Download Full-text

Research on Testing Methods of Temperature Strain and Force Strain under Extreme Temperature Environment

IOP Conference Series Earth and Environmental Science ◽

10.1088/1755-1315/668/1/012067 ◽

2021 ◽

Vol 668 (1) ◽

pp. 012067

Author(s):

Axel Tanguy ◽

Yang Li ◽

Mengxi Tan

Keyword(s):

Extreme Temperature ◽

Testing Methods ◽

Temperature Environment ◽

Temperature Strain

Download Full-text

Effect of thermomigration on evolution of interfacial intermetallic compounds in Cu/Sn/Cu and Cu/Sn0.7Cu/Cu solder joints

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-015-2984-5 ◽

2015 ◽

Vol 26 (6) ◽

pp. 4313-4317 ◽

Author(s):

G. Q. Wei ◽

L. C. Du ◽

Y. P. Jia ◽

L. Qi

Keyword(s):

Intermetallic Compounds ◽

Solder Joints ◽

Interfacial Intermetallic Compounds

Download Full-text

Phase transformation behavior of Al-Au-Cu intermetallic compounds under ultra-fast micro resistance bonding process

Materials Characterization ◽

10.1016/j.matchar.2021.111401 ◽

2021 ◽

pp. 111401

Author(s):

Shang Wang ◽

He Zhang ◽

Chunjin Hang ◽

Jiayun Feng ◽

Zicheng Sa ◽

...

Keyword(s):

Phase Transformation ◽

Intermetallic Compounds ◽

Bonding Process ◽

Transformation Behavior ◽

Phase Transformation Behavior

Download Full-text

Nanomechanical Characterization of Intermetallic Compounds in Lead Free Solder Joints

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00355 ◽

2018 ◽

Author(s):

Abdullah Fahim ◽

Sudan Ahmed ◽

Jeffrey C. Suhling ◽

Pradeep Lall

Keyword(s):

Intermetallic Compounds ◽

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

Download Full-text

Formation of Intermetallic Compounds at Pb-Sn/Metal and Lead- Free/Metal Interfaces in Solder Joints

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies ◽

10.1201/9780203021484-18 ◽

2004 ◽

pp. 482-511

Keyword(s):

Intermetallic Compounds ◽

Solder Joints ◽

Lead Free ◽

Metal Interfaces ◽

Download Full-text

Effect of Mo Nanoparticles on the Growth Behavior of the Intermetallic Compounds Layer in Sn3.0Ag0.5Cu/Cu Solder Joints

Journal of Nanoscience and Nanotechnology ◽

10.1166/jnn.2020.17203 ◽

2020 ◽

Vol 20 (4) ◽

pp. 2573-2577 ◽

Author(s):

Linmei Yang ◽

Shanyu Quan ◽

Cong Liu ◽

Hao Xiong

Keyword(s):

Intermetallic Compounds ◽

Solder Joints ◽

Growth Behavior

Download Full-text