Research on the relationship between early surface deformation and microstructure evolution of Ni-based single crystal alloy

2019 ◽  
Vol 807 ◽  
pp. 151646
Author(s):  
Ben Li ◽  
Dong Chen ◽  
Qiaoxin Zhang ◽  
Hongyan Zhou
Keyword(s):  
Single Crystal ◽  
Microstructure Evolution ◽  
Surface Deformation ◽  
Single Crystal Alloy ◽  
The Relationship

CMSX-2

Alloy Digest ◽  
1992 ◽  
Vol 41 (11) ◽  
Keyword(s):  
Physical Properties ◽  
Single Crystal ◽  
Alloy Development ◽  
Single Crystal Alloy ◽  
High Level

Abstract CMSX-2 is a single crystal alloy development of Cannon-Muskegon Corporation designed to achieve a high level of balanced properties. This datasheet provides information on composition, physical properties, as well ascreep and fatigue. Filing Code: Ni-417. Producer or source: Cannon-Muskegon Corporation.

Relaxor Single Crystals with Giant k31 Mode

2006 ◽  
Vol 45 ◽  
pp. 2412-2421
Author(s):  
Toshio Ogawa
Keyword(s):  
Single Crystal ◽  
Electromechanical Coupling ◽  
Impedance Measurement ◽  
Hysteresis Loops ◽  
Electromechanical Coupling Factor ◽  
Coupling Factor ◽  
Poling Direction ◽  
Length Direction ◽  
Relaxor Single Crystals ◽  
The Relationship

Giant electromechanical coupling factor of k31 mode over 86% was found for (100) Pb[(Zn1/3Nb2/3)0.91Ti0.09]O3 and (110) Pb[(Mg1/3Nb2/3)0.74Ti0.26]O3 single-crystal plates poled in the [100] and [110] directions, respectively. The P-E hysteresis loops in the single-crystal plates with giant k31 became asymmetric. Furthermore, the frequency response of impedance in these plates with giant k31 consisted of a single vibration in the length direction. A mechanism to realize giant k31 can be explained by the relationship between the crystal plane and poling direction. In addition, the existence of giant piezoelectric d31 constant was proven by the strain measurement as well as by the impedance measurement.

The effect of Al/Si disorder on the bulk moduli of plagioclase feldspars

2010 ◽  
Vol 74 (6) ◽  
pp. 943-950 ◽  
Author(s):  
L. M. Sochalski-Kolbus ◽  
R. J. Angel ◽  
F. Nestola
Keyword(s):  
Bulk Modulus ◽  
Single Crystal ◽  
Equations Of State ◽  
X Ray Diffraction ◽  
Volume Increase ◽  
X Ray ◽  
Density Decrease ◽  
The Relationship

AbstractThe volumes of a disordered An20 (Qod = 0.15), a disordered An78 (Qod = 0.55) and an ordered An78 (Qod = 0.81) were determined up to 9.569(10) GPa, 8.693(5) GPa and 9.765(10) GPa, respectively, using single-crystal X-ray diffraction. The volume variations with pressure for these samples are described with 4th-order Birch Murnaghan equations of state with V0 = 669.88(7) Å3, K0 = 59.7(7) GPa. K′ = 5.7(5), K″ = −0.8(2) GPa−1 for disordered An20, V0 = 1340.48(10) Å3, K0 = 77.6(5) GPa, K0′ = 4.0(3), K″ = -0.59(9) GPa−1 for disordered An78 and V0 = 1339.62(6) A3, K0 = 77.4(6) GPa, K′ = 4.2(4), and K″ = −0.7(1) GPa−1 for ordered An78. Along with data from previous studies (An0 ordered, An0 disordered and An2o ordered), the volumes for the disordered samples were found to be up to ∼0.3% larger than the ordered samples of the same composition. The disordered samples are softer than the ordered samples of the same composition by 4(1)% for An0, 2.5(9)% for An20 and essentially zero for An78. The relationship between volume increase, density decrease, and decreasing bulk modulus with increasing disorder is in accordance with Birch's Law.

Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Jianing Wang ◽  
Jieshi Chen ◽  
Zhiyuan Zhang ◽  
Peilei Zhang ◽  
Zhishui Yu ◽  
...  
Keyword(s):  
Solder Joint ◽  
Single Crystal ◽  
Microstructure Evolution ◽  
Thermal Aging ◽  
Interfacial Layer ◽  
Aging Treatment ◽  
Growth Behavior ◽  
Reflow Process ◽  
Content Type ◽  
Ni Substrate

Purpose The purpose of this article is the effect of doping minor Ni on the microstructure evolution of a Sn-xNi (x = 0, 0.05 and 0.1 wt.%)/Ni (Poly-crystal/Single-crystal abbreviated as PC Ni/SC Ni) solder joint during reflow and aging treatment. Results showed that the intermetallic compounds (IMCs) of the interfacial layer of Sn-xNi/PC Ni joints were Ni3Sn4 phase, while the IMCs of Sn-xNi/SC Ni joints were NiSn4 phase. After the reflow process and thermal aging of different joints, the growth behavior of interfacial layer was different due to the different mechanism of element diffusion of the two substrates. The PC Ni substrate mainly provided Ni atoms through grain boundary diffusion. The Ni3Sn4 phase of the Sn0.05Ni/PC Ni joint was finer, and the diffusion flux of Sn and Ni elements increased, so the Ni3Sn4 layer of this joint was the thickest. The SC Ni substrate mainly provided Ni atoms through the lattice diffusion. The Sn0.1Ni/SC Ni joint increases the number of Ni atoms at the interface due to the doping of 0.1Ni (wt.%) elements, so the joint had the thickest NiSn4 layer. Design/methodology/approach The effects of doping minor Ni on the microstructure evolution of an Sn-xNi (x = 0, 0.05 and 0.1 Wt.%)/Ni (Poly-crystal/Single-crystal abbreviated as PC Ni/SC Ni) solder joint during reflow and aging treatment was investigated in this study. Findings Results showed that the intermetallic compounds (IMCs) of the interfacial layer of Sn-xNi/PC Ni joints were Ni3Sn4 phase, while the IMCs of Sn-xNi/SC Ni joints were NiSn4 phase. After the reflow process and thermal aging of different joints, the growth behavior of the interfacial layer was different due to the different mechanisms of element diffusion of the two substrates. Originality/value In this study, the effect of doping Ni on the growth and formation mechanism of IMCs of the Sn-xNi/Ni (single-crystal) solder joints (x = 0, 0.05 and 0.1 Wt.%) was investigated.

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