High thermal conductivity and mechanical properties of Si@Graphite/Aluminum nitride/aluminum composites for high-efficiency thermal management

2020 ◽  
pp. 157630
Author(s):  
Rui Fan ◽  
Ying Huang ◽  
Xiaopeng Han ◽  
Xuanyi Peng
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Aluminum Nitride ◽  
Thermal Management ◽  
High Efficiency ◽  
High Thermal Conductivity ◽  
Aluminum Composites

scholarly journals Super-compatible functional boron nitride nanosheets/polymer films with excellent mechanical properties and ultra-high thermal conductivity for thermal management

2018 ◽  
Vol 6 (6) ◽  
pp. 1363-1369 ◽  
Author(s):  
Jiemin Wang ◽  
Yuanpeng Wu ◽  
Ye Xue ◽  
Dan Liu ◽  
Xuebin Wang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Boron Nitride ◽  
Polyvinyl Alcohol ◽  
Thermal Management ◽  
Polymer Films ◽  
Composite Films ◽  
High Thermal Conductivity ◽  
Boron Nitride Nanosheets

Super compatible functional boron nitride (FBN) nanosheets and polyvinyl alcohol (PVA) composite films are well fabricated by facile aqueous vacuum filtering.

Effect of Raw Materials on the Thermal Conductivity and Microstructure of Aluminum Nitride

2007 ◽  
Vol 336-338 ◽  
pp. 790-792
Author(s):  
Zhi Ping Liu ◽  
Hong Yu Zheng ◽  
Jin Li Zhang ◽  
Zheng Guo Jin
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Aluminum Nitride ◽  
Electronic Packaging ◽  
Raw Materials ◽  
High Thermal Conductivity ◽  
Promising Material ◽  
Sintering Behavior ◽  
Sintering Aids

High thermal conductivity, along with good electrical and mechanical properties, makes aluminum nitride a very promising material for electronic packaging and substrates. Much work has been reported on the influence of additions and sintering aids on densification and thermal conductivity. In this paper, the influence of raw materials on the sintering behavior and thermal conductivity characteristics of pressureless-sintered AlN has been investigated. The highest thermal conductivity is 248W/m.K.

Highly Thermoconductive Yet Ultraflexible Polymer Composite with Superior Mechanical Properties and Autonomous Self-Healing Functionality via Binary Fillers Strategy

2022 ◽  
Author(s):  
Dong Wang ◽  
Dingyao Liu ◽  
JianHua Xu ◽  
JiaJun Fu ◽  
Kai Wu
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Polymer Composite ◽  
High Thermal Conductivity ◽  
Thermal Dissipation ◽  
Self Healing ◽  
Formidable Challenge ◽  
Superior Mechanical Properties

It is still a formidable challenge to develop ideal thermal dissipation materials with simultaneous high thermal conductivity, excellent mechanical softness and toughness, and spontaneous self-healing. Herein, we report the introduction...

scholarly journals High thermal conductivity polymer chains with reactive groups: a step towards true application

2020 ◽  
Vol 1 (6) ◽  
pp. 1996-2002
Author(s):  
Anqi Chen ◽  
Yanyan Wu ◽  
Shaoxin Zhou ◽  
Wenxue Xu ◽  
Wenlong Jiang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
Polymer Chains ◽  
High Thermal Conductivity ◽  
Reactive Groups

Nanostructured polyethylene (PE, [–CH2–CH2–]n) films with metal-like thermal conductivity have opened up opportunities for polymers in advanced thermal management.

scholarly journals Silver Nanoparticle-Deposited Aluminum Oxide Nanoparticle as Fillers for Epoxy Composites with High Thermal Conductivity

2018 ◽  
Vol 27 (6) ◽  
pp. 096369351802700
Author(s):  
Tao Huang ◽  
Yimin Yao ◽  
Gang Zhang ◽  
Fanling Meng
Keyword(s):  
Thermal Conductivity ◽  
Aluminum Nitride ◽  
Silver Nanoparticle ◽  
Ag Nanoparticles ◽  
Thermal Contact Resistance ◽  
Epoxy Composite ◽  
Thermal Contact ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Oxide Nanoparticle

With the development of polymer-filled composites, the demand of high thermal conductivity materials is much attractive than ever. However, the process of a common method to improve thermal conductivity of composites is considerably complicated. The aim of this study is to investigate thermal conductivity of epoxy filled silver nanoparticle deposited aluminum nitride nanoparticles with relatively convenient process. We found that the thermal conductivities of composites filled with AlN/Ag nanoparticles are effectively enhanced, which is enormously increased from 0.48 Wm-1K-1(1.88 vol%) to 3.66 Wm-1K-1 (19.54 vol%). This can be ascribed to the bridging connections of silver nanoparticle among aluminum nitride nanoparticles. In addition, the thermal contact resistance of the epoxy composites filler with AlN/Ag nanoparticles is decreased, which is proved by the fitting measured thermal conductivity of epoxy composite with one physical model. We believe the finding has great potential for any microelectronic application.

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