Influence of the thermal history on the mechanical properties of two alumina based castables

2009 ◽  
Vol 29 (15) ◽  
pp. 3197-3204 ◽  
Author(s):  
M. Ghassemi Kakroudi ◽  
E. Yeugo-Fogaing ◽  
M. Huger ◽  
C. Gault ◽  
T. Chotard
1991 ◽  
Vol 6 (7) ◽  
pp. 1498-1501 ◽  
Author(s):  
Paul A. Flinn

Since copper has some advantages relative to aluminum as an interconnection material, it is appropriate to investigate its mechanical properties in order to be prepared in advance for possible problems, such as the cracks and voids that have plagued aluminum interconnect systems. A model previously used to interpret the behavior of aluminum films proves to be, with minor modification, also applicable to copper. Although the thermal expansion of copper is closer to that of silicon and, consequently, the thermally induced strains are smaller, the much larger elastic modulus of copper results in substantially higher stresses. This has implications for the interaction of copper lines with dielectrics.


2005 ◽  
Vol 502 ◽  
pp. 505-510 ◽  
Author(s):  
Masami Futamata ◽  
Xiaohui Gai ◽  
Toyokazu Mizumoto ◽  
Kimio Nakanishi

To fabricate thermal spraying coatings with good reproducibility, it is necessary to improve the process of the equalization of both thermal history and impacting behavior of the particles. In this study, the characteristics of the solution type plasma spraying using the hollow-cathode type torch are investigated. The physical and mechanical properties that are different from usual thermal spraying coatings are described. By using solutions including metal ingredients in a state of ion, colloid or sol, thinner coating that cannot be made by conventional plasma spraying methods is formed on various substrates. The coatings are uniform in appearance.


1995 ◽  
Vol 34 (5-6) ◽  
pp. 635-641 ◽  
Author(s):  
R. Benavente ◽  
J. M. Pere�a ◽  
A. Bello ◽  
E. P�rez

Author(s):  
Ashish Kumar Nath ◽  
Muvvala Gopinath

Abstract Monitoring and controlling the microstructure, phases, and thermal stresses in laser cladding of materials which determine their mechanical properties is essential for ensuring repeatability and reproducibility in refurbishing engineering parts and building functional parts by layer-by-layer deposition in additive manufacturing process. Several studies have been reported on on-line monitoring of temperature, melt-pool geometry, and porosity etc. in laser powder deposition process, but only a few on the assessment of solidification morphology, microstructure, and thermal stresses. Since these features are dictated by the melt-pool lifetime, cooling and solidification rates, their effects on the evolution of microstructure and the state of ceramic particles in laser deposition of Ni-super alloy and metal matrix composites of WC and TiC are investigated in the current study. Good correlation exists between the thermal history monitored online and the solidification characteristics. Process maps based on the melt-pool lifetime as a function of laser cladding parameters for these materials are developed. On-line monitoring of thermal cycle is extended to laser welding of stainless steel and titanium which are difficult to join together due to the formation of brittle intermetallic phases, and laser polishing of thermal sprayed ceramic coating to develop a better understanding and control of these processes. Melt-pool lifetime is found to have significant effect on the crack growth in fusion welding and by optimizing the former the later could be mitigated. Similarly, the cooling rate in laser polishing of thermal sprayed ceramic coating is found to have significant influence on the surface roughness and residual stress. These studies show that the online monitoring of thermal history can be exploited for controlling the process quality and ensuring the repeatability and reproducibility in different laser material processing modalities.


2009 ◽  
Vol 30 (7) ◽  
pp. 2726-2731 ◽  
Author(s):  
N. Rajamanickam ◽  
V. Balusamy ◽  
G. Madhusudhanna Reddy ◽  
K. Natarajan

2006 ◽  
Vol 44 (8) ◽  
pp. 1253-1267 ◽  
Author(s):  
J. M. López-Majada ◽  
H. Palza ◽  
J. L. Guevara ◽  
R. Quijada ◽  
M. C. Martínez ◽  
...  

2007 ◽  
Vol 345-346 ◽  
pp. 1457-1460 ◽  
Author(s):  
Hiroshi Kawakami ◽  
Keiko Kimura ◽  
Satoshi Kondo ◽  
Jippei Suzuki

Al bonding in air by inserted A5056 was investigated in this study. Heating rate in thermal history of bonding process may have the relation with the growth of Al oxide film and the deformation of bonding surface by softening. Both of phenomena affect the joinability and the mechanical properties of bond. Al bonding in air was carried out by several heating rate. Growth of Al oxide film significantly suppressed the progress of bonding in air by low heating rate, 1K/s. Decrease of deformation of bonding surface suppressed also the progress of bonding by high heating rate, 10K/s. In case of medium heating rate, 5K/s, good joinabilty of Al bonding in air was obtained by the medium growth of oxide film and the deformation of bonding surface.


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