Development of anti-oxidation Ag salt paste for large-area (35 × 35 mm2) Cu-Cu bonding with ultra-high bonding strength

2022 ◽  
Author(s):  
Bowen Zhang ◽  
Chuantong Chen ◽  
Takuya Sekiguchi ◽  
Yang Liu ◽  
Caifu Li ◽  
...  
Keyword(s):  
Bonding Strength ◽  
Large Area ◽  
High Bonding Strength ◽  
Cu Bonding

Fabrication of Bioactive Stainless Steel by the Function of Apatite Nuclei

2016 ◽  
Vol 696 ◽  
pp. 151-156 ◽  
Author(s):  
Takeshi Yabutsuka ◽  
Ryoki Karashima ◽  
Shigeomi Takai ◽  
Takeshi Yao
Keyword(s):  
Stainless Steel ◽  
Simulated Body Fluid ◽  
Bonding Strength ◽  
Body Fluid ◽  
Apatite Layer ◽  
Mechanical Interlocking ◽  
High Bonding Strength ◽  
Fluid Formation ◽  
Bonelike Apatite

Micropores were formed on the surfaces of stainless steel (SUS) by sandblasting methods and Apatite Nuclei (AN) were formed in the pores. By this treatments, a bioactive SUS was fabricated. Apatite-forming ability of the SUS was evaluated by immersing in an acellular simulated body fluid. Formation of bonelike apatite was induced on the surface of the SUS within 1 day. High bonding strength of the bonelike apatite layer was achieved by a mechanical interlocking effect between the bonelike apatite formed in the pores and the SUS specimen.

Polymer-Based Repair Mortar Containing Waste Perlite Powder

2021 ◽  
Vol 898 ◽  
pp. 73-79
Author(s):  
Radek Hermann ◽  
Jakub Hodul ◽  
Aleš Jakubík
Keyword(s):  
Mechanical Properties ◽  
Bonding Strength ◽  
Building Materials ◽  
Expanded Perlite ◽  
High Bonding Strength ◽  
Repair Mortar ◽  
Very High

This paper deals with the problematics of utilization of waste perlite from production of expanded perlite in polymer-based material. The goal of this paper is to develop repair mortar containing as high amount of waste perlite as possible as substitution for filler. The resulting mortar exhibits very high physical-mechanical properties such as high bonding strength to a large variety of building materials. The microstructure and the re-dispersibility of filler were also studied.

High-Density Large-Area-Array Interconnects Formed by Low-Temperature Cu/Sn–Cu Bonding for Three-Dimensional Integrated Circuits

2012 ◽  
Vol 59 (7) ◽  
pp. 1941-1947 ◽  
Author(s):  
M. R. Lueck ◽  
J. D. Reed ◽  
C. W. Gregory ◽  
A. Huffman ◽  
J. M. Lannon ◽  
...  
Keyword(s):  
Low Temperature ◽  
Integrated Circuits ◽  
Three Dimensional ◽  
High Density ◽  
Large Area ◽  
Area Array ◽  
Cu Bonding
Sign in / Sign up

Export Citation Format

Share Document