scholarly journals Microstructure evolution and bonding mechanism of Ti2SnC-Ti6Al4V joint by using Cu pure foil interlayer

2017 ◽  
Vol 127 ◽  
pp. 53-59 ◽  
Author(s):  
W. Yu ◽  
H. Zhao ◽  
Z. Huang ◽  
X. Chen ◽  
Y. Aman ◽  
...  
Author(s):  
B. Van Meerbeek ◽  
L. J. Conn ◽  
E. S. Duke

Restoration of decayed teeth with tooth-colored materials that can be bonded to tooth tissue has been a highly desirable property in restorative dentistry for many years. Advantages of such an adhesive restorative technique over conventional techniques using non-adhesive metal-based restoratives include improved restoration retention with minimal sacrifice of sound tooth tissue for retention purposes, superior adaptation and sealing of the restoration margins in prevention of caries recurrence, improved stress distribution across the tooth-restoration interface throughout the whole tooth, and even reinforcement of weakened tooth structures. The dental adhesive technology is rapidly changing. An efficient resin bond to enamel has already long been achieved. Its bonding mechanism has been fully elucidated and has proven to be a durable and reliable clinical treatment. However, bonding to dentin represents a greater challenge. After the failures of a dentin acid-etch technique in imitation of the enamel phosphoric-acid-etch technique and a bonding procedure based on chemical adhesion, modern dentin adhesives are currently believed to bond to dentin by a micromechanical hybridization process. This process is developed by an initial demineralization of the dentin surface layer with acid etchants exposing a collagen fibril arrangement with interfibrillar microporosities that subsequently become impregnated by low-viscosity monomers. Although the development of such a hybridization process has well been documented in the literature, questions remain with respect to parameters of-primary importance to adhesive efficacy.


2014 ◽  
Vol 29 (9) ◽  
pp. 941
Author(s):  
JIANG Jin-Long ◽  
WANG Qiong ◽  
HUANG Hao ◽  
ZHANG Xia ◽  
WANG Yu-Bao ◽  
...  

Author(s):  
Wentao Qin ◽  
Dorai Iyer ◽  
Jim Morgan ◽  
Carroll Casteel ◽  
Robert Watkins ◽  
...  

Abstract Ni(5 at.%Pt ) films were silicided at a temperature below 400 °C and at 550 °C. The two silicidation temperatures had produced different responses to the subsequent metal etch. Catastrophic removal of the silicide was seen with the low silicidation temperature, while the desired etch selectivity was achieved with the high silicidation temperature. The surface microstructures developed were characterized with TEM and Auger depth profiling. The data correlate with both silicidation temperatures and ultimately the difference in the response to the metal etch. With the high silicidation temperature, there existed a thin Si-oxide film that was close to the surface and embedded with particles which contain metals. This thin film is expected to contribute significantly to the desired etch selectivity. The formation of this layer is interpreted thermodynamically.


Sign in / Sign up

Export Citation Format

Share Document