scholarly journals A holistic X-ray analytical approach to support sensor design and fabrication: Strain and cracking analysis for wafer bonding processes

2021 ◽  
Vol 210 ◽  
pp. 110052
Author(s):  
A. Borzì ◽  
R. Zboray ◽  
S. Dolabella ◽  
J.F. Le Neal ◽  
P. Drljaca ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Analytical Approach ◽  
Sensor Design ◽  
X Ray

scholarly journals Two-dimensional X-ray waveguides: fabrication by wafer-bonding process and characterization

2008 ◽  
Vol 91 (1) ◽  
pp. 7-12 ◽  
Author(s):  
A. Kohlstedt ◽  
S. Kalbfleisch ◽  
T. Salditt ◽  
M. Reiche ◽  
U. Gösele ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Bonding Process ◽  
Two Dimensional ◽  
X Ray

Low temperature covalent wafer bonding for X-ray imaging detectors

2019 ◽  
Vol 59 (SB) ◽  
pp. SBBB06 ◽  
Author(s):  
Nasser Razek ◽  
Jorge Neves ◽  
Philippe Le Corre ◽  
Pierrre-François Rüedi ◽  
Riccardo Quaglia ◽  
...  
Keyword(s):  
Low Temperature ◽  
Wafer Bonding ◽  
X Ray ◽  
X Ray Imaging ◽  
Imaging Detectors

scholarly journals Bromine and bromide content in soils: Analytical approach from total reflection X-ray fluorescence spectrometry

Chemosphere ◽  
2016 ◽  
Vol 156 ◽  
pp. 294-301 ◽  
Author(s):  
Helena Gallardo ◽  
Ignasi Queralt ◽  
Josefina Tapias ◽  
Lucila Candela ◽  
Eva Margui
Keyword(s):  
Analytical Approach ◽  
Total Reflection ◽  
Fluorescence Spectrometry ◽  
X Ray

Microscopy and Microanalysis of Blood in a Snake Head Fish, Channa gachua Exposed to Environmental Pollution

2016 ◽  
Vol 22 (1) ◽  
pp. 39-47 ◽  
Author(s):  
Eva M. Pala ◽  
Sudip Dey
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Blood Cell ◽  
Analytical Methods ◽  
Analytical Approach ◽  
Erythrocyte Membranes ◽  
X Ray ◽  
Structural Abnormalities ◽  
Polluted Sites ◽  
Scanning Electron

AbstractConventional and highly sophisticated analytical methods (Cyria et al., 1989; Massar et al., 2012a) were used to analyze micro-structural and micro-analytical aspects of the blood of snake head fish, Channa gachua, exposed to municipal wastes and city garbage. Red (RBC) and white blood cell (WBC) counts and hemhemoglobin content were found to be higher in pollution affected fish as compared with control. Scanning electron microscopy revealed the occurrence of abnormal erythrocytes such as crenated cells, echinocytes, lobopodial projections, membrane internalization, spherocytes, ruptured cells, contracted cells, depression, and uneven elongation of erythrocyte membranes in fish inhabiting the polluted sites. Energy-dispersive X-ray spectroscopy (EDS) revealed the presence of silicon and lead in the RBCs of pollution affected fish. Significance of the study includes the highly sophisticated analytical approach, which revealed the aforementioned micro-structural abnormalities.

A GaAs/Si X-Ray Pixel Detector Based on Low Temperature Covalent Wafer Bonding

2020 ◽  
Vol MA2020-02 (22) ◽  
pp. 1632-1632
Author(s):  
Nasser Razek ◽  
Ivan Prieto ◽  
Jorge Neves ◽  
Philippe Le Corre ◽  
Hans von Känel
Keyword(s):  
Low Temperature ◽  
Wafer Bonding ◽  
Pixel Detector ◽  
X Ray

New insight on carbonisation and graphitisation mechanisms as obtained from a bottom-up analytical approach of X-ray diffraction patterns

Carbon ◽  
2019 ◽  
Vol 147 ◽  
pp. 602-611 ◽  
Author(s):  
Pascal Puech ◽  
Agnieszka Dabrowska ◽  
Nicolas Ratel-Ramond ◽  
Gérard L. Vignoles ◽  
Marc Monthioux
Keyword(s):  
Analytical Approach ◽  
X Ray Diffraction ◽  
Bottom Up ◽  
X Ray ◽  
Diffraction Patterns

Microscopic Noncontact Electrical Evaluation for the Silicon-on-Insulator Layer with Voids

1993 ◽  
Vol 302 ◽  
Author(s):  
A. Usami ◽  
T. Nakai ◽  
S. Ishigami ◽  
T. Wada ◽  
K. Matsuki ◽  
...  
Keyword(s):  
Electrical Properties ◽  
Laser Beam ◽  
Wafer Bonding ◽  
Signal Intensity ◽  
Diffusion Length ◽  
Silicon On Insulator ◽  
Carrier Injection ◽  
Insulator Layer ◽  
X Ray ◽  
Conductivity Current

ABSTRACTWe evaluate the electrical properties of the silicon-on-insulator (SOI) layer made by the wafer bonding using a noncontact laser beam induced conductivity/current (LBIC) method. Since the thickness of the SOl layer used in this study is about 40μm, the He-Ne laser, whose penetration depth for Si is small (about 3μm), is used as the carrier-injection light source.We use the SOI wafer with some voids which are revealed by the X-ray topography. We have reported that the LBIC signal intensity decreases in the void region. In this study, we measure the microscopic signal variation near the edge of the void. It is observed that the LBIC signal intensity decreases in the outside region within a distance of about 700μm from the void edge. The diffusion length of the injected carrier (100-150μm) is shorter than the width of the region where the signal intensity decreases. Thus the decrease is not due to the carrier diffusion to the void. These results show that the formation of the void degrades the electrical properties not only in the void region but also outside the void.

One-point wafer bonding for highly accurate x-ray masks

1995 ◽  
Author(s):  
Masatoshi Oda ◽  
Takashi Ohkubo ◽  
Hideo Yoshihara
Keyword(s):  
Wafer Bonding ◽  
X Ray
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