Localised zinc oxide nanowires growth on printed circuit board by in-situ joule heating

2012 ◽  
Vol 76 ◽  
pp. 226-228 ◽  
Author(s):  
Zheng J. Chew ◽  
Lijie Li
Keyword(s):  
Zinc Oxide ◽  
Joule Heating ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Zinc Oxide Nanowires ◽  
Oxide Nanowires ◽  
Printed Circuit ◽  
Nanowires Growth

Zinc-oxide nanowires growth in-situ in microfluidic chamber

2019 ◽  
Author(s):  
Mazen Erfan ◽  
Martine Gnambodoe-Capochichi ◽  
Marie Le Pivert ◽  
Frédéric Marty ◽  
Yasser M. Sabry ◽  
...  
Keyword(s):  
Zinc Oxide ◽  
Zinc Oxide Nanowires ◽  
Oxide Nanowires ◽  
Microfluidic Chamber ◽  
Nanowires Growth

In-situ prevention of hydrogen sulfide formation during anaerobic digestion using zinc oxide nanowires

2018 ◽  
Vol 6 (1) ◽  
pp. 110-118 ◽  
Author(s):  
Robert Lupitskyy ◽  
Dania Alvarez-Fonseca ◽  
Zachary D. Herde ◽  
Jagannadh Satyavolu
Keyword(s):  
Zinc Oxide ◽  
Hydrogen Sulfide ◽  
Anaerobic Digestion ◽  
Zinc Oxide Nanowires ◽  
Oxide Nanowires

Effects of Trace Layers and Joule Heating on the Temperature Distribution of Printed Circuit Boards: A Computational Study

2009 ◽  
Vol 1 (2) ◽  
Author(s):  
M. Baris Dogruoz ◽  
Manoj K. Nagulapally
Keyword(s):  
Joule Heating ◽  
Hot Spots ◽  
Printed Circuit Board ◽  
Computational Study ◽  
Computational Cost ◽  
Circuit Board ◽  
System Level ◽  
Printed Circuit ◽  
System Level Simulation ◽  
Background Mesh

A printed circuit board (PCB) is generally a multilayered board made of dielectric material and several layers of traces and vias. Performing detailed system-level computational fluid dynamics (CFD) simulations of PCBs including meshed trace and via geometries for each of the layers is impractical. In the present approach, the effects of the trace and via geometry are accurately modeled in the physical model by importing electronics computer aided-design data consisting of the trace and via layout of the board and computing locally varying orthotropic conductivity (kx, ky, and kz) on the printed circuit board using a background mesh. The spatially varying orthotropic conductivity is then mapped from the background mesh to the CFD mesh and used in a system-level simulation of the PCB with a minimal increase in the overall computational cost. On the other hand, as PCB component densities increase, the current densities increase thereby leading to regions of hot spots due to Joule heating. Hence, it is essential that the computational heat transfer simulations account for the heating due to the high current carrying traces. In order to accurately model the Joule heating of traces and vias, it is of essence to solve for the conservation of current in each of these traces. In this study, the effects of both trace layer nonhomogeneity and Joule heating are examined on a sample PCB with several components attached to it. The results are then compared with those from the conventional modeling techniques. It is demonstrated that there is considerable difference in the location of the hot spots and temperature values between two different methods.

Functional piezoelectric yarn: Toward optimization of zinc oxide nanowires growth

2020 ◽  
Vol 35 (22) ◽  
pp. 3091-3105
Author(s):  
Dina Badawy ◽  
Saeid Soltanian ◽  
Peyman Servati ◽  
Addie Bahi ◽  
Frank Ko
Keyword(s):  
Zinc Oxide ◽  
Zinc Oxide Nanowires ◽  
Oxide Nanowires ◽  
Nanowires Growth

Abstract

Zinc Oxide Nanowires on Printed Circuit Boards

2015 ◽  
pp. 271-275 ◽  
Author(s):  
Giuseppe Arrabito ◽  
Christian Falconi ◽  
Vito Errico ◽  
Weihua Han
Keyword(s):  
Zinc Oxide ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Zinc Oxide Nanowires ◽  
Oxide Nanowires ◽  
Printed Circuit

In situ Decapsulation of Plastic Encapsulated Devices Mounted to a Printed Circuit Board

2002 ◽  
Author(s):  
Ronald R. Hylton
Keyword(s):  
Printed Circuit Board ◽  
Failure Mechanisms ◽  
Circuit Board ◽  
Printed Circuit ◽  
Board Material

Abstract In situ decapsulation of plastic devices can be used to avoid the removal or alteration of failure mechanisms caused by exposure to desoldering temperatures. This paper describes techniques to decapsulate devices mounted to a printed circuit board using materials that are readily available and easily customized to specific applications. The techniques are extended to the decapsulation of other packaging technologies, such as SBGA packages and chip-on-board assemblies. Finally, post decapsulation cleaning techniques that will not harm the printed circuit board material are presented.

Zinc Oxide Nanorods Grown on Printed Circuit Board for Extended-Gate Field-Effect Transistor pH Sensor

2017 ◽  
Vol 46 (6) ◽  
pp. 3732-3737 ◽  
Author(s):  
Pham Van Thanh ◽  
Le Thi Quynh Nhu ◽  
Hong Hanh Mai ◽  
Nguyen Viet Tuyen ◽  
Sai Cong Doanh ◽  
...  
Keyword(s):  
Zinc Oxide ◽  
Field Effect ◽  
Field Effect Transistor ◽  
Printed Circuit Board ◽  
Ph Sensor ◽  
Circuit Board ◽  
Zinc Oxide Nanorods ◽  
Printed Circuit ◽  
Oxide Nanorods ◽  
Effect Transistor
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