Elimination of droplet rebound off soluble substrate in metal droplet deposition

2018 ◽  
Vol 216 ◽  
pp. 232-235 ◽  
Author(s):  
Hao Yi ◽  
Lehua Qi ◽  
Jun Luo ◽  
Yongan Guo ◽  
Shaolin Li ◽  
...  
2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Yanlin Ren ◽  
Zhaomiao Liu ◽  
Yan Pang ◽  
Xiang Wang ◽  
Shanshan Gao

Purpose This paper aims to investigate the influence of droplet infiltration and sliding on the deposition size and make a uniform deposition by controlling the interaction between droplets, using the three-dimensional lattice Boltzmann method (LBM) based on the actual working condition. Design/methodology/approach D3Q19 Shan-Chen LB approach is developed and optimized based on the metal droplet deposition. The Carnahan-Starling equation of state and transition layers are introduced to maintain the greater stability and low pseudo velocities. In addition, an additional collision term is adopted to implement immersed moving boundary scheme to deal with no-slip boundaries on the front of the phase change. Findings The numerical results show that the new¬ incoming droplet wet and slide off the solidified surface and the rejection between droplets are the reasons for the deviation of the actual deposition length. The total length of the longitudinal section negatively correlates with the deposition distance. To improve the dimensional accuracy, the deposition distance and repulsion rate need to be guaranteed. The optimal deposition distance is found to have a negative linear correlation with wettability. Originality/value The numerical model developed in this paper will help predict the continuous metal droplet deposition and provide guidance for the selection of deposition distance.


2017 ◽  
Vol 123 (6) ◽  
Author(s):  
SuLi Li ◽  
ZhengYing Wei ◽  
Du Jun ◽  
Guangxi Zhao ◽  
Xin Wang ◽  
...  

2010 ◽  
Vol 97-101 ◽  
pp. 4028-4031 ◽  
Author(s):  
Yan Pu Chao ◽  
Le Hua Qi ◽  
Xiang Hui Zeng ◽  
Jun Luo ◽  
Hua Huang

In the droplet-based manufacturing process, the accuracy and density of forming parts are determined by experimental parameters such as the velocity and temperature of substrate, droplets spraying frequency, line deposition space and layer thickness etc. Using Sn60-Pb40, the droplets deposition experiment was conducted to investigate the effect of the parameters on the accuracy and density of formed lines, layers and solids on the experimental system. The experiment results showed that the high quality lines were obtained when the overlapping ratio of the adjacent droplets was controlled around 30% by the substrate velocity and droplet spraying frequency, meanwhile,the temperatures of the substrate and droplet were maintained at 270°C and 140°C, respectively. When the lines deposited space was about 90% of droplet diameter and the layer thickness was about 80% of droplet diameter, good deposition results of layers and solids can be obtained. This work has offered experimental guide for metal droplet deposition manufacturing.


2017 ◽  
Vol 243 ◽  
pp. 474-480 ◽  
Author(s):  
Daicong Zhang ◽  
Lehua Qi ◽  
Jun Luo ◽  
Hao Yi ◽  
Xianghui Hou ◽  
...  

2016 ◽  
Vol 122 (8) ◽  
Author(s):  
SuLi Li ◽  
ZhengYing Wei ◽  
Jun Du ◽  
Guangxi Zhao ◽  
Xin Wang ◽  
...  

Electronics ◽  
2021 ◽  
Vol 10 (13) ◽  
pp. 1568
Author(s):  
Manoj Meda ◽  
Viktor Sukhotskiy ◽  
Denis Cormier

The fabrication of printed electronic devices via molten metal droplet jetting has enormous potential in flexible electronic device applications due to the extremely high electrical conductivity and excellent substrate adhesion of printed features. However, large pinholes (which could be detrimental to the feature performance) have been experimentally observed when molten metal droplets of aluminum 4043 alloy are deposited and solidified on a polyimide (PI) substrate. In this study, we have shown that subjecting the polymer substrate to elevated temperature during droplet deposition considerably reduces the number and size of pinholes. The formation mechanism behind the large pinholes is interpreted as the release of the adsorbed/absorbed moisture from the polymer substrate into the solidifying droplet due to the rapid rise in temperature of the substrate upon droplet impact. Through numerical modelling, we have shown that the temperature of the polyimide substrate underneath the deposited droplet exceeds the boiling point of water while the metal droplet is still in liquid state, showing the possibility of water vapor escaping from the substrate and causing pinholes in the solidifying metal.


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