Overlay as the key to drive wafer scale 3D integration

2007 ◽  
Vol 84 (5-8) ◽  
pp. 1412-1415 ◽  
Author(s):  
Steven E. Steen ◽  
Douglas LaTulipe ◽  
Anna W. Topol ◽  
David J. Frank ◽  
Kevin Belote ◽  
...  
Keyword(s):  
3D Integration ◽  
Wafer Scale

Wafer-scale 3D integration of InGaAs photodiode arrays with Si readout circuits by oxide bonding and through-oxide vias

2011 ◽  
Vol 88 (1) ◽  
pp. 131-134 ◽  
Author(s):  
C.L. Chen ◽  
D.-R. Yost ◽  
J.M. Knecht ◽  
J. Wey ◽  
D.C. Chapman ◽  
...  
Keyword(s):  
3D Integration ◽  
Wafer Scale ◽  
Readout Circuits ◽  
Photodiode Arrays

Three Dimensional Integration with Benzocyclobutene as the Wafer-Bonding Medium

2004 ◽  
Vol 833 ◽  
Author(s):  
Sang Kevin Kim ◽  
Lei Xue ◽  
Sandip Tiwari
Keyword(s):  
Integrated Circuits ◽  
Wafer Bonding ◽  
Three Dimensional ◽  
Experimental Results ◽  
Device Layer ◽  
3D Integration ◽  
Wafer Scale ◽  
3D Ics ◽  
Fabrication Procedure ◽  
3D Fabrication

ABSTRACTA successful wafer-scale device layering process for fabricating three-dimensional integrated circuits (3D ICs) using Benzocyclobutene (BCB) is described. In the reported embodiment of the method, a sub-micron thick “donor” device layer is transplanted onto a fully fabricated “host” wafer with BCB as the intervening medium. Experimental results, including RIE study and planarization of BCB processed through the 3D fabrication procedure are reported. We conclude with an approach to alleviate BCB and fabrication induced wafer bowing, which leads to poor wafer to wafer alignment in 3D integration.

A Single-Chip Optical Phased Array in a Wafer-Scale Silicon Photonics/CMOS 3D-Integration Platform

2019 ◽  
Vol 54 (11) ◽  
pp. 3061-3074 ◽  
Author(s):  
Taehwan Kim ◽  
Tat Ngai ◽  
Yukta Timalsina ◽  
Michael R. Watts ◽  
Vladimir Stojanovic ◽  
...  
Keyword(s):  
Silicon Photonics ◽  
Phased Array ◽  
Single Chip ◽  
3D Integration ◽  
Integration Platform ◽  
Wafer Scale ◽  
Optical Phased Array

Toward wafer-scale fabrication and 3D integration of micro-solid oxide fuel cells for portable energy

2010 ◽  
Author(s):  
Bo-Kuai Lai ◽  
Alex C. Johnson ◽  
Masaru Tsuchiya ◽  
Shriram Ramanathan
Keyword(s):  
Fuel Cells ◽  
Solid Oxide Fuel Cells ◽  
Solid Oxide ◽  
Oxide Fuel ◽  
3D Integration ◽  
Wafer Scale

Wafer scale integration

1988 ◽  
Vol 135 (6) ◽  
pp. 281
Author(s):  
J.B. Butcher ◽  
K.K. Johnstone
Keyword(s):  
Wafer Scale ◽  
Wafer Scale Integration ◽  
Scale Integration
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