Low-temperature wafer bonding for MEMS packaging utilizing screen-printed sub-micron size Au particle patterns

2011 ◽  
Vol 88 (8) ◽  
pp. 2275-2277 ◽  
Author(s):  
S. Ishizuka ◽  
N. Akiyama ◽  
T. Ogashiwa ◽  
T. Nishimori ◽  
H. Ishida ◽  
...  
Keyword(s):  
Low Temperature ◽  
Wafer Bonding ◽  
Mems Packaging ◽  
Micron Size ◽  
Screen Printed

Characterization of intermediate In/Ag layers of low temperature fluxless solder based wafer bonding for MEMS packaging

2009 ◽  
Vol 154 (1) ◽  
pp. 85-91 ◽  
Author(s):  
Chengkuo Lee ◽  
Aibin Yu ◽  
Liling Yan ◽  
Haitao Wang ◽  
Johnny Han He ◽  
...  
Keyword(s):  
Low Temperature ◽  
Wafer Bonding ◽  
Mems Packaging

High Precision Low Temperature Direct Wafer Bonding Technology for Wafer-Level 3D ICs Manufacturing

2016 ◽  
Vol 75 (9) ◽  
pp. 345-353 ◽  
Author(s):  
F. Kurz ◽  
T. Plach ◽  
J. Suss ◽  
T. Wagenleitner ◽  
D. Zinner ◽  
...  
Keyword(s):  
Low Temperature ◽  
High Precision ◽  
Wafer Bonding ◽  
Wafer Level ◽  
3D Ics ◽  
Direct Wafer Bonding ◽  
Bonding Technology

Low temperature GaAs/Si direct wafer bonding

2000 ◽  
Vol 36 (7) ◽  
pp. 677 ◽  
Author(s):  
M. Alexe ◽  
V. Dragoi ◽  
M. Reiche ◽  
U. Gösele
Keyword(s):  
Low Temperature ◽  
Wafer Bonding ◽  
Direct Wafer Bonding ◽  
Low Temperature Gaas

High performance InAs quantum dot lasers on silicon substrates by low temperature Pd-GaAs wafer bonding

2015 ◽  
Vol 107 (26) ◽  
pp. 261107 ◽  
Author(s):  
Zihao Wang ◽  
Ruizhe Yao ◽  
Stefan F. Preble ◽  
Chi-Sen Lee ◽  
Luke F. Lester ◽  
...  
Keyword(s):  
Low Temperature ◽  
Quantum Dot ◽  
Wafer Bonding ◽  
High Performance ◽  
Silicon Substrates ◽  
Quantum Dot Lasers ◽  
Gaas Wafer ◽  
Inas Quantum Dot

Low Temperature Wafer Bonding: Plasma Assisted Silicon Direct Bonding vs. Silicon-Gold Eutectic Bonding

2019 ◽  
Vol 16 (8) ◽  
pp. 499-506 ◽  
Author(s):  
Martin Rabold ◽  
Holger Kuster ◽  
Peter Woias ◽  
Frank Goldschmidtboeing
Keyword(s):  
Low Temperature ◽  
Wafer Bonding ◽  
Eutectic Bonding

Low Temperature Direct Silicon Wafer Bonding Using Argon Activation

1997 ◽  
Vol 36 (Part 2, No. 5A) ◽  
pp. L527-L528 ◽  
Author(s):  
Robert W. Bower ◽  
Frank Y.-J. Chin
Keyword(s):  
Low Temperature ◽  
Silicon Wafer ◽  
Wafer Bonding
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