Low temperature GaAs/Si direct wafer bonding

2000 ◽  
Vol 36 (7) ◽  
pp. 677 ◽  
Author(s):  
M. Alexe ◽  
V. Dragoi ◽  
M. Reiche ◽  
U. Gösele
Keyword(s):  
Low Temperature ◽  
Wafer Bonding ◽  
Direct Wafer Bonding ◽  
Low Temperature Gaas

High Precision Low Temperature Direct Wafer Bonding Technology for Wafer-Level 3D ICs Manufacturing

2016 ◽  
Vol 75 (9) ◽  
pp. 345-353 ◽  
Author(s):  
F. Kurz ◽  
T. Plach ◽  
J. Suss ◽  
T. Wagenleitner ◽  
D. Zinner ◽  
...  
Keyword(s):  
Low Temperature ◽  
High Precision ◽  
Wafer Bonding ◽  
Wafer Level ◽  
3D Ics ◽  
Direct Wafer Bonding ◽  
Bonding Technology

Low-temperature direct wafer bonding for III-V compound semiconductors to nanometer-scale grating arrays

2015 ◽  
Author(s):  
Bai-Ci Chen ◽  
Yu-Chang Wu ◽  
Jen-Hung Huang ◽  
Hao-Chung Kuo ◽  
Chien-Chung Lin
Keyword(s):  
Low Temperature ◽  
Wafer Bonding ◽  
Compound Semiconductors ◽  
Nanometer Scale ◽  
Direct Wafer Bonding

Plasma activation assisted low-temperature direct wafer bonding

2012 ◽  
Author(s):  
Hongyao Chua ◽  
Xianshu Luo ◽  
Wai Hong See Toh ◽  
Junfeng Song ◽  
Tsung-Yang Liow ◽  
...  
Keyword(s):  
Low Temperature ◽  
Wafer Bonding ◽  
Plasma Activation ◽  
Direct Wafer Bonding

Enhancement of Bonding Strength for Low Temperature Si3N4/Si3N4 Direct Wafer Bonding by Nitrogen-Plasma Activation and Hydrofluoric Pre-dip

2014 ◽  
Vol 64 (5) ◽  
pp. 111-117
Author(s):  
F. - S. Lo ◽  
C. - C. Chiang ◽  
C. Li ◽  
T. - H. Lee
Keyword(s):  
Low Temperature ◽  
Wafer Bonding ◽  
Bonding Strength ◽  
Nitrogen Plasma ◽  
Plasma Activation ◽  
Direct Wafer Bonding
Sign in / Sign up

Export Citation Format

Share Document