Numerical analysis of thermo-mechanical characteristics of solder joint depending on change in solder junction structure of MCP
2015 ◽
Vol 55
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pp. 442-447
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2001 ◽
Vol I.01.1
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pp. 435-436
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Vol 303-306
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pp. 2847-2850
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Vol 163-167
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pp. 2977-2982
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Vol 723
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2009 ◽
Vol 49
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pp. 79-85
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2006 ◽
Vol 171
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