Mechanical properties of functionally graded 2-D cellular structures: A finite element simulation

2009 ◽  
Vol 499 (1-2) ◽  
pp. 434-439 ◽  
Author(s):  
A. Ajdari ◽  
P. Canavan ◽  
H. Nayeb-Hashemi ◽  
G. Warner
Keyword(s):  
Mechanical Properties ◽  
Finite Element ◽  
Finite Element Simulation ◽  
Functionally Graded ◽  
Cellular Structures ◽  
Element Simulation

Design and Simulation of a Kind of Ultrasonic Deicing Acoustic System

2012 ◽  
Vol 203 ◽  
pp. 500-503 ◽  
Author(s):  
Yun Dian Zhang ◽  
Long Shen Han
Keyword(s):  
Mechanical Properties ◽  
Finite Element ◽  
Finite Element Simulation ◽  
Computer Software ◽  
New Method ◽  
Acoustic System ◽  
Element Simulation

Ultrasonic deicing is a new method of deicing. This paper analyzed and designed a kind of ultrasonic deicing acoustic system, then simulated it with the ANSYS, which is a kind of finite element simulation computer software used to do finite element simulation work. The results indicate that the frequency and mechanical properties of the acoustic system meet the expectant demand.

The Influence of the Substrate on the Mechanical Properties of Si-Doped DLC Thin Films

2008 ◽  
Vol 587-588 ◽  
pp. 839-843 ◽  
Author(s):  
Carlos W. Moura e Silva ◽  
Jose R.T. Branco ◽  
Marta C. Oliveira ◽  
Jorge M. Antunes ◽  
Albano Cavaleiro
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Finite Element ◽  
Stainless Steel ◽  
Elastic Modulus ◽  
Finite Element Simulation ◽  
Gas Mixtures ◽  
Element Simulation ◽  
Si Doped ◽  
Si Content

In this work, Si-doped DLC films were deposited on stainless steel (316SS) and polycarbonate (PC) substrates by RF-PACVD in gas mixtures of SiH4+CH4, with 2, 5 and 10 vol.% SiH4. The increase of the Si content in the films led to a progressive drop in the hardness from 30 GPa down to 23 GPa whereas the elastic modulus increased from 124 GPa up to 146 GPa, as measured in the SS coated substrates. In the case of coated PC samples pop-in was observed in the loading curve which was interpreted by finite element simulation and nanoscratching techniques.

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