Relationship between intermetallic compound layer thickness with deviation and interfacial strength for dissimilar joints of aluminum alloy and stainless steel

2018 ◽  
Vol 735 ◽  
pp. 361-366 ◽  
Author(s):  
Ryoichi Hatano ◽  
Tomo Ogura ◽  
Tomoki Matsuda ◽  
Tomokazu Sano ◽  
Akio Hirose
Keyword(s):  
Stainless Steel ◽  
Aluminum Alloy ◽  
Intermetallic Compound ◽  
Layer Thickness ◽  
Interfacial Strength ◽  
Compound Layer ◽  
Intermetallic Compound Layer ◽  
Dissimilar Joints

Friction Welding of A 6061 Aluminum Alloy and S45C Carbon Steel

2004 ◽  
Vol 449-452 ◽  
pp. 437-440 ◽  
Author(s):  
Takeshi Shinoda ◽  
Shiniti Kawata
Keyword(s):  
Tensile Strength ◽  
Aluminum Alloy ◽  
Carbon Steel ◽  
Intermetallic Compound ◽  
Intermetallic Compounds ◽  
Friction Welding ◽  
Compound Layer ◽  
Weld Interface ◽  
Welding Parameters ◽  
Intermetallic Compound Layer

Many researches for friction welding of aluminum with either carbon steel or stainless steel have been carried out. From those results, it is concluded that the greatest problem is the formation of brittle intermetallic compounds at weld interface. However, it is not clearly demonstrated the effect of friction welding parameters on the formation of intermetallic compounds. This research purposes are to evaluate the formation of intermetallic compounds and to investigate the effect of friction welding parameters on the strength of welded joint. For these purposes, A6061 aluminum alloy and S45C carbon steel were used with a continuous drive vertical friction welding machine. Tensile test results revealed that the maximum tensile strength was achieved at extremely short friction time and high upset. The joint strength reached 92% of the tensile strength of A6061 base metal. Tensile strength of friction welding was increasing with increasing upset pressure when friction time 1sec. However, tensile properties were deteriorated with increasing friction time. It was observed that the amount of formed intermetallic compound was increasing with increasing friction time at weld interface. Partly formed intermetallic compound on weld interface were identified when friction time 1sec. However, intermetallic compound layer were severely developed with longer friction time at weld interface. It was concluded that intermetallic compound layer deteriorated the tensile properties of weld joints.

Investigations of Interfacial Reaction and Shear Strength between Pb-Free Flip Chip Solder and Electroplated Cu UBM

2005 ◽  
Vol 297-300 ◽  
pp. 863-868
Author(s):  
Dae Gon Kim ◽  
Hyung Sun Jang ◽  
Jong Woong Kim ◽  
Seung Boo Jung
Keyword(s):  
Shear Strength ◽  
Intermetallic Compound ◽  
Layer Thickness ◽  
Flip Chip ◽  
Solder Bump ◽  
Ductile Failure ◽  
Compound Layer ◽  
Intermetallic Compound Layer ◽  
Quantitative Analyses ◽  
Dominant Phase

In the present work, we investigated the interfacial reactions and shear properties between Sn-3.0Ag-0.5Cu flip chip solder bump and Cu UBM after multiple reflows. The quantitative analyses of the intermetallic compound layer thickness as a function of the number of reflows were performed. After six reflows, the reaction product could be distinguished by two intermetallic compounds: Cu3Sn adjacent to the substrate and Cu6Sn5 which was the dominant phase. The thickness of total intermetallic compound layers increased with the number of reflows. The shear strength value did not significantly change as a function of the number of reflows. Nearly all of the test specimens showed ductile failure mode, and this could be well explained with the results of FEM analyses.

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