Method for Semi-Automated Measurement and Statistical Evaluation of Iron Aluminum Intermetallic Compound Layer Thickness and Morphology

2017 ◽  
Vol 6 (5) ◽  
pp. 367-374 ◽  
Author(s):  
Sebastian Herbst ◽  
Christopher Neal Dovletoglou ◽  
Florian Nürnberger
Keyword(s):  
Intermetallic Compound ◽  
Layer Thickness ◽  
Statistical Evaluation ◽  
Compound Layer ◽  
Intermetallic Compound Layer ◽  
Automated Measurement ◽  
Iron Aluminum

Investigations of Interfacial Reaction and Shear Strength between Pb-Free Flip Chip Solder and Electroplated Cu UBM

2005 ◽  
Vol 297-300 ◽  
pp. 863-868
Author(s):  
Dae Gon Kim ◽  
Hyung Sun Jang ◽  
Jong Woong Kim ◽  
Seung Boo Jung
Keyword(s):  
Shear Strength ◽  
Intermetallic Compound ◽  
Layer Thickness ◽  
Flip Chip ◽  
Solder Bump ◽  
Ductile Failure ◽  
Compound Layer ◽  
Intermetallic Compound Layer ◽  
Quantitative Analyses ◽  
Dominant Phase

In the present work, we investigated the interfacial reactions and shear properties between Sn-3.0Ag-0.5Cu flip chip solder bump and Cu UBM after multiple reflows. The quantitative analyses of the intermetallic compound layer thickness as a function of the number of reflows were performed. After six reflows, the reaction product could be distinguished by two intermetallic compounds: Cu3Sn adjacent to the substrate and Cu6Sn5 which was the dominant phase. The thickness of total intermetallic compound layers increased with the number of reflows. The shear strength value did not significantly change as a function of the number of reflows. Nearly all of the test specimens showed ductile failure mode, and this could be well explained with the results of FEM analyses.

scholarly journals Effect of Coating Element on Joining Stability of Sn-0.3Ag-0.7Cu Solder Joint due to Aging Test

2020 ◽  
Vol 49 (12) ◽  
pp. 2983-2990
Author(s):  
Atiqah Mohd Afdzaluddin ◽  
Maria Abu Bakar
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Layer Thickness ◽  
Aging Temperature ◽  
Compound Layer ◽  
Elastic Behavior ◽  
Plastic Behavior ◽  
Intermetallic Compound Layer ◽  
Micromechanical Properties ◽  
Aging Test

Solder joint is important for providing mechanical support and functionality of electronic packaging. Established solder joint should be able to withstand in device service operation and the environment without significant changes in terms of their microstructural evolution and mechanical properties. This study investigates the effect of the coating element (Sn and Ni) on the joining stability of Sn-0.3Ag-0.7Cu solder joint. The solder joints were exposed to different aging test for 1000 h to observed microstructure and micromechanical properties changes. Microstructural observation by means of intermetallic compound layer thickness due to the aging temperature effect. Joining stability by means of micromechanical changes were studied using nanoindentation approach. It was found that the elastic behavior, reduced modulus, and hardness of Sn-0.3Ag-0.7Cu solder joint has reduced due to aging test. However, the plastic behavior of Sn-0.3Ag-0.7Cu solder joint has increased with the increase of the aging temperature. It is observed that the Ni coating has a significant effect and a more stable solder joint achieved. This can be evidenced from small changes in intermetallic compound layer thickness and micromechanical properties were achieved using Ni coating as compared to Sn coating after subjected to the aging test for 1000 h.

Dissimilar Metal Welding of Steel to Al-Mg Alloy by Spot Resistance Welding

2006 ◽  
Vol 15-17 ◽  
pp. 381-386 ◽  
Author(s):  
I.H. Hwang ◽  
Takehiko Watanabe ◽  
Y. Doi
Keyword(s):  
Intermetallic Compound ◽  
Base Metal ◽  
Joint Strength ◽  
Pure Aluminum ◽  
Compound Layer ◽  
Interfacial Microstructure ◽  
Mg Alloy ◽  
Intermetallic Compound Layer ◽  
Commercially Pure ◽  
Insert Metal

We tried to join steel to Al-Mg alloy using a resistance spot welding method. The effect of Mg in Al-Mg alloy on the strength and the interfacial microstructure of the joint was investigated. Additionally, the effect of insert metal of commercially pure aluminum, which was put into the bonding interface, on the joint strength was examined. The obtained results were as follows. The cross-tensile strength of a joint between SS400 steel and commercially pure aluminum (SS400/Al) was high and fracture occurred in the aluminum base metal. However, the strength of a joint between SS400 and Al-Mg alloy was remarkably low and less than 30% of that of the SS400/Al joint. An intermetallic compound layer developed so thickly at the bonded interface of the SS400/Al-Mg alloy joint that the joint strength decreased. The intermetallic compound layer developed more thickly as Mg content in the Al-Mg alloy increased. Using insert metal of commercially pure aluminum containing little Mg successfully improved the strength of the SS400/Al-Mg alloy joint and the strength was equivalent to that of the base metal.

Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint

2015 ◽  
Vol 27 (1) ◽  
pp. 52-58 ◽  
Author(s):  
Peter K. Bernasko ◽  
Sabuj Mallik ◽  
G. Takyi
Keyword(s):  
Shear Strength ◽  
Intermetallic Compound ◽  
Solder Joint ◽  
Layer Thickness ◽  
Solder Joints ◽  
Ageing Time ◽  
Circuit Board ◽  
Intermetallic Compound Layer ◽  
Content Type ◽  
Surface Mount

Purpose – The purpose of this paper is to study the effect of intermetallic compound (IMC) layer thickness on the shear strength of surface-mount component 1206 chip resistor solder joints. Design/methodology/approach – To evaluate the shear strength and IMC thickness of the 1206 chip resistor solder joints, the test vehicles were conventionally reflowed for 480 seconds at a peak temperature of 240°C at different isothermal ageing times of 100, 200 and 300 hours. A cross-sectional study was conducted on the reflowed and aged 1206 chip resistor solder joints. The shear strength of the solder joints aged at 100, 200 and 300 hours was measured using a shear tester (Dage-4000PXY bond tester). Findings – It was found that the growth of IMC layer thickness increases as the ageing time increases at a constant temperature of 175°C, which resulted in a reduction of solder joint strength due to its brittle nature. It was also found that the shear strength of the reflowed 1206 chip resistor solder joint was higher than the aged joints. Moreover, it was revealed that the shear strength of the 1206 resistor solder joints aged at 100, 200 and 300 hours was influenced by the ageing reaction times. The results also indicate that an increase in ageing time and temperature does not have much influence on the formation and growth of Kirkendall voids. Research limitations/implications – A proper correlation between shear strength and fracture mode is required. Practical implications – The IMC thickness can be used to predict the shear strength of the component/printed circuit board pad solder joint. Originality/value – The shear strength of the 1206 chip resistor solder joint is a function of ageing time and temperature (°C). Therefore, it is vital to consider the shear strength of the surface-mount chip component in high-temperature electronics.

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