Study on the micro-interface behavior of 2024Al light alloy bonded by ultrasonic assisted solid phase diffusion welding with Ag interlayer under atmosphere

2021 ◽  
pp. 142520
Author(s):  
Qian Wang ◽  
Yong Nie ◽  
Yingfeng Shao ◽  
Hongzhi Liu ◽  
Xiaoqiang Hu ◽  
...  
Keyword(s):  
Solid Phase ◽  
Diffusion Welding ◽  
Light Alloy ◽  
Interface Behavior ◽  
Phase Diffusion ◽  
Ultrasonic Assisted

scholarly journals Effects of solid phase diffusion welding condition and carbon content of an insert metal on joint strength for Ni-base superalloys.

1989 ◽  
Vol 7 (3) ◽  
pp. 407-413 ◽  
Author(s):  
Ken Yasuda ◽  
Akira Okayama ◽  
Mitsuru Kobayashi ◽  
Takao Funamoto ◽  
Hideyo Kodama ◽  
...  
Keyword(s):  
Carbon Content ◽  
Joint Strength ◽  
Solid Phase ◽  
Diffusion Welding ◽  
Welding Condition ◽  
Phase Diffusion ◽  
Insert Metal

scholarly journals Fabrication of SOI FinFET Devices using Arsenic Solid-phase-diffusion

2007 ◽  
Vol 20 (5) ◽  
pp. 394-398 ◽  
Author(s):  
Won-Ju Cho ◽  
Hyun-Mo Koo ◽  
Woo-Hyun Lee ◽  
Sang-Mo Koo ◽  
Hong-Bay Chung
Keyword(s):  
Solid Phase ◽  
Phase Diffusion

Barrier Properties of Electroless Ni-B UBM for Solder Joining

2015 ◽  
Vol 2015 (1) ◽  
pp. 000862-000867
Author(s):  
Masaru Morita ◽  
Toshiya Akamatsu ◽  
Nobuhiro Imaizumi ◽  
Seiki Sakuyama
Keyword(s):  
Integrated Circuits ◽  
High Speed ◽  
Solid Phase ◽  
Barrier Properties ◽  
Electrode Structure ◽  
Phase Diffusion ◽  
3D Ics ◽  
The Difference ◽  
Electroless Ni ◽  
Plating Layer

As demands accelerate for high density, high speed transmission and low power integrated circuits, 3D-ICs with through-silicon via (TSV) is pursued. In the structure of 3D-ICs, the first die is attached to the second die with micro bump, and the second die is attached to the circuit substrate with a C4 solder bump. The electrode structure of the second die is Cu/Ni UBM. The stress of the Ni-B layer is less than that of the Ni-P layer, and the Ni-B layer can suppress stress and die warpage. The purposes of our study are to clarify the difference in the barrier properties of the Ni-B UBM and Ni-P under bump metal (UBM) and the relevance of the barrier properties of Ni UBM and intermetallic compound (IMC) growth. It was found that an electroless Ni-B plating layer is superior to a Ni-P plating layer for UBM in liquid phase diffusion and in solid phase diffusion, and that a segregated B layer is formed under the IMC layer of a Ni-B land due to reflow soldering. It was estimated that this B layer plays the role of being a barrier layer for solder diffusion.

scholarly journals Study on liquid phase diffusion welding of copper to austenitic stainless steel using Cu-Ti thin alloyed layer deposited by sputtering.

1988 ◽  
Vol 6 (2) ◽  
pp. 219-225 ◽  
Author(s):  
Takao Funamoto ◽  
Hiroshi Wachi ◽  
Ryoich Kajiwara ◽  
Mitsuo Kato ◽  
Takeshi Matsuzaka ◽  
...  
Keyword(s):  
Stainless Steel ◽  
Liquid Phase ◽  
Austenitic Stainless Steel ◽  
Diffusion Welding ◽  
Alloyed Layer ◽  
Phase Diffusion
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