High power flexible supercapacitor electrodes based on a surface modified C60 – β Ni(OH)2 nanocomposite

2020 ◽  
pp. 101825
Author(s):  
Soorya Sasi ◽  
Sunish K. Sugunan ◽  
P. Radhakrishnan Nair ◽  
K.R.V. Subramanian ◽  
Raji George ◽  
...  
2019 ◽  
Vol 2019 (HiTen) ◽  
pp. 000066-000070 ◽  
Author(s):  
Sri Krishna Bhogaraju ◽  
Omid Mokhtari ◽  
Jacopo Pascucci ◽  
Fosca Conti ◽  
Gordon Elger

Abstract Sintering under pressure has been in the forefront of the research and development over the past decade as an alternative to high temperature soldering and die-attach bonding for high temperature electronics. However, high bonding pressure is a deterrent to mass industrialization due to the high costs involved in the design of special tooling and complex process control parameters. Further, it can cause device cracking, especially while working with sensitive high power optoelectronics devices (e.g. high power light emitting diodes). Therefore, alternatives to enhance sinterability are highly requested. Substrate metallization is observed to play an important role while sintering. An innovative low cost method to have nanostructured surface modifications on the substrates is realized and presented here. The method is applied to enhance sinterability of Cu particles to substrate. Shear tests on samples with surface modified substrates are promising with results of ca. 25 MPa, which is 24% better than sintering on unmodified bare Cu substrate. Sintering was enabled by in-house developed hybrid Cu paste under pressureless sintering conditions of 300°C, for 60 min, and under N2 atmosphere.


2021 ◽  
pp. 2107442
Author(s):  
Manmatha Mahato ◽  
Sanghee Nam ◽  
Rassoul Tabassian ◽  
Saewoong Oh ◽  
Van Hiep Nguyen ◽  
...  

Author(s):  
Haejoo Kim ◽  
Hyeonjun Song ◽  
Nilüfer Çakmakçı ◽  
Heesoo Kang ◽  
Jonghyun Park ◽  
...  

2020 ◽  
Vol 394 ◽  
pp. 125814 ◽  
Author(s):  
Shu-Chuan Liao ◽  
Chih-Ying Chen ◽  
Yu-Hsuan Hsu ◽  
Chi-Ting Li ◽  
Cheng-Chi Hsieh ◽  
...  

Author(s):  
P. S. Sklad

Over the past several years, it has become increasingly evident that materials for proposed advanced energy systems will be required to operate at high temperatures and in aggressive environments. These constraints make structural ceramics attractive materials for these systems. However it is well known that the condition of the specimen surface of ceramic materials is often critical in controlling properties such as fracture toughness, oxidation resistance, and wear resistance. Ion implantation techniques offer the potential of overcoming some of the surface related limitations.While the effects of implantation on surface sensitive properties may be measured indpendently, it is important to understand the microstructural evolution leading to these changes. Analytical electron microscopy provides a useful tool for characterizing the microstructures produced in terms of solute concentration profiles, second phase formation, lattice damage, crystallinity of the implanted layer, and annealing behavior. Such analyses allow correlations to be made with theoretical models, property measurements, and results of complimentary techniques.


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